Lesi sihloko sethula kakhulu izingozi ezintathu zokusebenzisa i-PCB ephelelwe yisikhathi.
01
I-PCB ephelelwe yisikhathi ingase ibangele i-surface pad oxidation
I-oxidation yamaphedi e-soldering izobangela ukudayiswa okungalungile, okungagcina kuholele ekuhlulekeni kokusebenza noma engozini yokuyeka ukufunda. Ukwelashwa okuhlukile kwendawo yamabhodi esekethe kuzoba nemiphumela ehlukile yokulwa ne-oxidation. Empeleni, i-ENIG idinga ukuthi isetshenziswe zingakapheli izinyanga eziyi-12, kuyilapho i-OSP idinga ukuthi isetshenziswe zingakapheli izinyanga eziyisithupha. Kunconywa ukulandela impilo yeshalofu yefekthri yebhodi le-PCB (i-shelflife) ukuqinisekisa ikhwalithi.
Amabhodi e-OSP ngokuvamile angabuyiselwa efekthri yebhodi ukuze ageze ifilimu ye-OSP futhi aphinde afake ungqimba olusha lwe-OSP, kodwa kunethuba lokuthi isekethe ye-foil yethusi izolimala lapho i-OSP isuswa ngokuqoqwa, ngakho kungcono ukuthintana nemboni yebhodi ukuze uqinisekise ukuthi ifilimu ye-OSP ingacutshungulwa kabusha.
Amabhodi e-ENIG awakwazi ukucutshungulwa kabusha. Ngokuvamile kunconywa ukwenza "i-press-baking" bese uhlola ukuthi ingabe ikhona yini inkinga nge-solderability.
02
I-PCB ephelelwe yisikhathi ingase imunce umswakama futhi ibangele ukuqhuma kwebhodi
Ibhodi lesifunda lingase libangele umphumela we-popcorn, ukuqhuma noma ukuncipha lapho ibhodi lesifunda ligeleza kabusha ngemva kokumuncwa komswakama. Nakuba le nkinga ingaxazululwa ngokubhaka, akuzona zonke izinhlobo zebhodi ezifanele ukubhaka, futhi ukubhaka kungase kubangele ezinye izinkinga zekhwalithi.
Ngokuvamile, ibhodi le-OSP alinconywa ukubhaka, ngoba ukubhaka okuphezulu kokushisa kuzolimaza ifilimu ye-OSP, kodwa abanye abantu baye babona abantu bethatha i-OSP ukuze babhake, kodwa isikhathi sokubhaka kufanele sibe sifushane ngangokunokwenzeka, futhi izinga lokushisa akufanele. abe phezulu kakhulu. Kuyadingeka ukuqedela isithando somlilo ngesikhathi esifushane, okuyizinselele eziningi, ngaphandle kwalokho i-solder pad izobe i-oxidized futhi ithinte i-welding.
03
Amandla okubopha we-PCB aphelelwe yisikhathi angehlisa futhi awohloke
Ngemva kokukhiqizwa kwebhodi lesifunda, ikhono lokubopha phakathi kwezingqimba (ungqimba kuya kungqimba) lizokwehlisa kancane kancane noma liwohloke ngokuhamba kwesikhathi, okusho ukuthi njengoba isikhathi sikhula, amandla okubopha phakathi kwezingqimba zebhodi lesifunda azokwehla kancane kancane .
Lapho ibhodi lesifunda elinjalo libhekene nokushisa okuphezulu esithandweni sokugeleza kabusha, ngenxa yokuthi amabhodi wesifunda akhiwe ngezinto ezihlukene anama-coefficients ahlukene okunweba okushisayo, ngaphansi kwesenzo sokwandisa nokunciphisa okushisayo, kungabangela i-de-lamination kanye namabhamuza angaphezulu. Lokhu kuzothinta kakhulu ukwethembeka nokuthembeka kwesikhathi eside kwebhodi lesifunda, ngoba i-delamination yebhodi lesifunda ingase iphule i-vias phakathi kwezingqimba zebhodi lesifunda, okuholela ekuziphatheni okubi kagesi. Okukhathaza kakhulu izinkinga ezimbi Ezingapheli kungenzeka, futhi kungenzeka ukuthi kubangele i-CAF (i-micro short circuit) ngaphandle kokwazi.
Umonakalo wokusebenzisa ama-PCB aphelelwe yisikhathi usemkhulu impela, ngakho abaklami kusafanele basebenzise ama-PCB phakathi komnqamulajuqu ngokuzayo.