1. Dweba i-PCB Circuit Board:
2. Setha ukuphrinta ungqimba oluphezulu kuphela nangesendlalelo.
3. Sebenzisa iphrinta ye-laser ukuphrinta ephepheni lokudlulisa le-thermal.
4. Isekethe likagesi elincanyana elisethwe kulelibhodi lesekethe lingu-10mil.
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I-6
Bese uyinamathisela kusayizi ofanele weCopper Chepper Laminate, Heat bese ucindezela umshini wokudlulisa ukushisa, imizuzwana engama-20 ukuqedela ukudluliselwa kokushisa. Thatha i-Copper Clad Lamisate futhi wembula iphepha lokudlulisa le-Thermal, ungabona umdwebo wesilisa ocacile ku-LAPP CLAD Laminate.
7. Bese ubeka i-clod clad yethangi le-oscillating corrosion tank, usebenzisa isixazululo esihlanganisiwe se-hydrochloric acid kanye ne-hydrogen peroxide, kuthatha kuphela imizuzwana eyi-15 ukususa ungqimba lwethusi ngokweqile.
Isilinganiso esifanele se-hydrochloric acid, i-hydrogen peroxide, kanye nethangi elinama-oscillative aphezulu aphezulu yizikhiye zokuthola ukugqwala okusheshayo nokuphelele.
Ngemuva kokudonswa ngamanzi, ibhodi yesifunda elonakalisiwe ingasuswa. Ingqikithi yemizuzwana engama-45 idlule ngalesi sikhathi. Ungalokothi uthinte uketshezi oluqinile lokuhlushwa lunganaki. Ngaphandle kwalokho, izinhlungu zizokhunjulwa ngempilo yonke.
8. Sebenzisa i-acetone futhi ukusula i-toner emnyama. Ngale ndlela, ibhodi le-PCB le-PCB liqediwe.
9. Faka i-flux ebusweni bebhodi yesekethe
10. Sebenzisa i-iron ebanzi ye-soldering yensimbi ukudonsa ibhodi yesekethe ukuze kusheshiswe kalula ngokuhamba kwesikhathi.
11. Susa i-Flux yokuthengisa futhi usebenzise i-soldering flux kudivayisi yokukhweza ingaphezulu ukuze uqedele ukuthengisa kwensiza.
12. Ngenxa yokuthengiswa kwangaphambi kwe-camera, kulula ukuthengisa idivaysi.
13. Ngemuva kokuthengisa, hlanza ibhodi yesekethe ngokugeza amanzi.
14. Ingxenye yebhodi yesekethe.
15. Kunemishini emifushane eminingi ebhodini lesekethe.
I-16. I-wiring emfushane iphothulwa ngu-0603, 0805, 1206 zero ahm ukumelana.
17. Ngemuva kwemizuzu eyishumi, ibhodi yesekethe selilungele ukulinga.
18. IBhodi Yesekethe ngaphansi kokuhlolwa.
19. Qedela ukulungisa iphutha lokujikeleza.
Indlela yokudlulisa ipuleti ye-Thermate ye-Thermal One-Treasure Plate ingenza ukukhiqizwa kwe-Hardware njengokuhle njengohlelo lwesoftware. Ngemuva kokuqedwa kokuhlolwa kwebhulokhi yesekethe, ukukhiqizwa komjikelezo ekugcineni kuqediwe kusetshenziswa indlela yokwenza ipuleti ehlelekile.
Le ndlela ayigcini nje kuphela izindleko zokuhlolwa, kepha okubaluleke kakhulu, isindisa isikhathi. Umqondo omuhle, uma ulinda usuku noma ezimbili ngaphambi kokuthola ibhodi yesekethe ngokusho komjikelezo ojwayelekile wepuleti, injabulo izodliwa.
