1. Dweba ibhodi lesekhethi ye-PCB:
2. Hlela ukuthi uphrinte kuphela USEHLU ESIPHEZULU nangesendlalelo.
3. Sebenzisa iphrinta ye-laser ukuze uphrinte ephepheni lokudlulisa elishisayo.
4. Isekhethi kagesi encane kunazo zonke ebekwe kuleli bhodi lesifunda ingu-10mil.
5. Isikhathi sokwenza ipuleti esiyiminithi elilodwa siqala esithombeni esimnyama nesimhlophe sesekethe ye-elekthronikhi ephrintwe ephepheni lokudlulisa elishisayo yiphrinta ye-laser.
6. Kumabhodi esifunda anohlangothi olulodwa, eyodwa kuphela eyanele.
Bese uyinamathisela kusayizi ofanelekile we-copper clad laminate, ukushisa bese ucindezela umshini wokudlulisa ukushisa, imizuzwana engu-20 ukuqedela ukudluliswa kokushisa. Thatha i-copper clad laminate futhi uvule iphepha lokudlulisa elishisayo, ungabona umdwebo wesifunda ocacile ku-laminate ye-copper clad.
7. Bese ufaka i-laminate ye-copper clad ku-tank corrosion oscillating, usebenzisa isisombululo esixubile se-hydrochloric acid ne-hydrogen peroxide, kuthatha imizuzwana engu-15 kuphela ukususa ungqimba lwethusi okweqile.
Isilinganiso esifanele se-hydrochloric acid, i-hydrogen peroxide, ne-high-speed oscillating corrosion tank yizihluthulelo zokuzuza ukugqwala okusheshayo nokuphelele.
Ngemva kokugezwa ngamanzi, ibhodi lesifunda eligqwalile lingakhishwa. Kwadlula imizuzwana engama-45 ngalesi sikhathi. Ungalokothi uthinte uketshezi olubolayo okugxilile kakhulu ngokunganaki. Uma kungenjalo, ubuhlungu buyokhunjulwa impilo yonke.
8. Sebenzisa i-acetone futhi ukuze usule ithoni emnyama. Ngale ndlela, ibhodi le-PCB lokuhlola liyaqedwa.
9. Faka i-flux ebusweni bebhodi lesifunda
10. Sebenzisa i-wide blade soldering iron ukuze uthayiphe ibhodi lesifunda ukuze likwazi ukusoda kalula kamuva.
11. Khipha i-soldering flux bese usebenzisa i-soldering flux emshinini wokukhweza ngaphezulu ukuze uqedele ukusoda kocingo.
12. Ngenxa ye-solder ehlanganiswe ngaphambili, kulula ukuthengisa idivayisi.
13. Ngemuva kwe-soldering, hlanza ibhodi lesifunda ngamanzi okugeza.
14. Ingxenye yebhodi lesifunda.
15. Kunezintambo eziningi ezimfishane ebhodini lesekethe.
16. I-wiring emfushane igcwaliswa ngo-0603, 0805, 1206 zero ohm ukumelana.
17. Ngemva kwemizuzu eyishumi, ibhodi lesifunda selilungele ukuhlolwa.
18. Ibhodi lesifunda elingaphansi kokuhlolwa.
19. Qedela ukulungisa iphutha lesekethe.
Indlela yokwenza ipuleti lokudlulisa elishisayo yomzuzu owodwa ingenza ukukhiqizwa kwehadiwe kube lula njengokuhlelwa kwesoftware. Ngemva kokuqedwa kokuhlolwa kwe-circuit block, ukukhiqizwa kwesekethe ekugcineni kuqediwe kusetshenziswa indlela ehlelekile yokwenza ipuleti.
Le ndlela ayigcini nje ngokusindisa izindleko zokuhlolwa, kodwa okubaluleke nakakhulu, igcina isikhathi. Umqondo omuhle, uma ulinda usuku noma ezimbili ngaphambi kokuthi uthole ibhodi lesifunda ngokuvumelana nomjikelezo ovamile wokwenza amapuleti, injabulo izoqedwa.