Ingabe “igolide” leminwe yegolide liyigolide?

Umunwe Wegolide

Kumamemory sticks ekhompuyutha nasemakhadini ezithombe, singabona umugqa wezinto ezisagolide zokuthinta, ezibizwa ngokuthi “iminwe yegolide”. I-Gold Finger (noma i-Edge Connector) embonini ye-PCB yokuklama nokukhiqiza isebenzisa isixhumi sesixhumi njengendawo yokukhipha ibhodi ukuze ixhume kunethiwekhi. Okulandelayo, ake siqonde ukuthi singabhekana kanjani neminwe yegolide ku-PCB neminye imininingwane.

 

Indlela yokwelapha engaphezulu ye-PCB yomunwe wegolide
1. Electroplating nickel gold: ukujiya kuze kufike ku-3-50u”, ngenxa ye-conductivity yayo ephakeme, ukumelana ne-oxidation nokumelana nokugqoka, isetshenziswa kakhulu kuma-PCB eminwe yegolide adinga ukufakwa nokususwa njalo noma amabhodi e-PCB adinga ukungqubuzana okuvamile kwemishini Ngenhla, kodwa ngenxa yezindleko eziphakeme zokucwecwa kwegolide, lisetshenziselwa kuphela ucwecwe lwegolide oluyingxenye njengeminwe yegolide.

2. Igolide lokucwiliswa: Ugqinsi luvamile 1u”, kufika ku-3u” ngenxa yezinga eliphezulu le-conductivity, flatness kanye ne-solderability, lisetshenziswa kakhulu kumabhodi e-PCB anembayo aphezulu anezinkinobho, i-IC eboshiwe, i-BGA, njll. Ama-PCB womunwe wegolide ngezidingo eziphansi zokumelana nokugqoka zingakhetha futhi inqubo yonke yegolide yokucwiliswa kwebhodi. Izindleko zenqubo yegolide yokucwiliswa iphansi kakhulu kunenqubo ye-electro-gold. Umbala we-Immersion Gold uphuzi osagolide.

 

Ukucubungula imininingwane yomunwe wegolide ku-PCB
1) Ukuze ukwandise ukumelana nokugqokwa kweminwe yegolide, iminwe yegolide ngokuvamile idinga ukunameka ngegolide eliqinile.
2) Iminwe yegolide idinga ukushaywa, ngokuvamile i-45 °, amanye ama-engeli afana no-20 °, 30 °, njll. Uma kungekho chamfer ekwakhiweni, kunenkinga; i-chamfer engu-45° ku-PCB iboniswa esithombeni esingezansi:

 

3) Umunwe wegolide udinga ukuphathwa njengengxenye yonke ye-solder mask ukuze uvule iwindi, futhi i-PIN ayidingi ukuvula insimbi yensimbi;
4) Ithayela lokucwiliswa kanye namaphedi okucwilisa esiliva kudingeka abe ebangeni elincane elingu-14mil ukusuka phezulu komunwe; kunconywa ukuthi i-pad iqhele ngaphezu kwe-1mm ukusuka emunweni ngesikhathi sokuklama, kuhlanganise nama-pads;
5) Ungaweluli ithusi ebusweni bomunwe wegolide;
6) Zonke izingqimba zongqimba lwangaphakathi lomunwe wegolide zidinga ukusika ithusi, ngokuvamile ububanzi bethusi elisikiwe buyi-3mm emikhulu; ingasetshenziswa ukwenza ithusi elisikwe ngomunwe uhafu kanye nethusi elisikwe ngomunwe wonke.

Ingabe “igolide” leminwe yegolide liyigolide?

Okokuqala, ake siqonde imiqondo emibili: igolide elithambile negolide eliqinile. Igolide elithambile, ngokuvamile igolide elithambile. Igolide eliqinile ngokuvamile liyinhlanganisela yegolide eliqinile.

Umsebenzi oyinhloko womunwe wegolide ukuxhuma, ngakho-ke kufanele ube ne-conductivity kagesi enhle, ukumelana nokugqoka, ukumelana ne-oxidation nokumelana nokugqwala.

Ngenxa yokuthi ukuthungwa kwegolide elihlanzekile (igolide) lithambile uma kuqhathaniswa, iminwe yegolide ngokuvamile ayilisebenzisi igolide, kodwa kuphela ungqimba “lwegolide eliqinile (inhlanganisela yegolide)” olufakwe kuwo ugesi, olungagcini nje ngokuthola ukuguquguquka okuhle kwegolide, kodwa. iphinde iyenze imelane nokusebenza kwe-Abrasion kanye nokumelana ne-oxidation.

 

Ngakho ingabe i-PCB isebenzise “igolide elithambile”? Impendulo iwukuthi kukhona ukusetshenziswa, okufana nendawo yokuxhumana yezinye izinkinobho zefoni ephathekayo, i-COB (Chip On Board) enocingo lwe-aluminium nokunye. Ukusetshenziswa kwegolide elithambile ngokuvamile ukufaka igolide le-nickel ebhodini lesifunda nge-electroplating, futhi ukulawula ukushuba kwalo kuyavumelana nezimo.