"Ukuhlanza" ngokuvamile akunakwa ohlelweni lokukhiqiza lwe-PCBA lwamabhodi wesifunda, futhi kubhekwa ukuthi ukuhlanza akusona isinyathelo esibalulekile. Kodwa-ke, ngokusetshenziswa isikhathi eside komkhiqizo ohlangothini lweklayenti, izinkinga ezibangelwa ukuhlanza okungasebenzi ekuqaleni kwesigaba sokuqala kubangela ukwehluleka okuningi, ukulungiswa noma Imikhiqizo ekhunjulwe ibangele ukwanda okukhulu kwezindleko zokusebenza. Ngezansi, i-Heming Technology izochaza kafushane indima yokuhlanza i-PCBA yamabhodi wesekethe.
Inqubo yokukhiqiza ye-PCBA (umhlangano wesifunda ophrintiwe) uhamba ngezigaba eziningi zenqubo, futhi isigaba ngasinye singcoliswa ngamazinga ahlukene. Ngakho-ke, amadiphozithi ahlukahlukene noma ukungcola kuhlala phezu kwebhodi lesifunda PCBA. Lokhu kungcola kuzonciphisa Ukusebenza komkhiqizo, futhi kubangele nokwehluleka komkhiqizo. Isibonelo, ekusetshenzisweni kwe-soldering izingxenye ze-elekthronikhi, i-solder paste, i-flux, njll. Ngemuva kwe-soldering, izinsalela ziyakhiqizwa. Izinsalela ziqukethe ama-organic acid nama-ion. Phakathi kwazo, ama-asidi e-organic azogqwala ibhodi lesifunda i-PCBA. Ukuba khona kwama-ion kagesi kungase kubangele isifunda esifushane futhi kubangele ukuthi umkhiqizo ungaphumeleli.
Kunezinhlobo eziningi zokungcola ebhodini lesekethe i-PCBA, engafingqwa ngezigaba ezimbili: i-ionic ne-non-ionic. Ukungcola kwe-Ionic kuhlangana nomswakama emvelweni, futhi ukufuduka kwe-electrochemical kwenzeka ngemva kokufakwa kukagesi, ukwakha isakhiwo se-dendritic, okuholela endleleni ephansi yokumelana, nokubhubhisa umsebenzi we-PCBA webhodi lesifunda. Ukungcola okungezona i-ionic kungangena ungqimba oluvikelayo lwe-PC B futhi kukhule ama-dendrites ngaphansi kobuso be-PCB. Ngaphezu kokungcola kwe-ionic nokungeyona i-ionic, kukhona nezinto ezingcolisayo eziyimbudumbudu, njengamabhola e-solder, amaphuzu antantayo kubhavu we-solder, uthuli, uthuli, njll. Lezi zingcoliso zingabangela ikhwalithi yamalunga e-solder ukuba iyancipha, kanye ne-solder. amalunga alolwa ngesikhathi sokufakwa. Izimo ezihlukahlukene ezingathandeki njengezimbotshana namasekhethi amafushane.
Njengoba izinto eziningi ezingcolisayo, yiziphi ezikhathazeke kakhulu? I-Flux noma i-solder paste ivame ukusetshenziswa ku-reflow soldering kanye nezinqubo ze-wave soldering. Ikakhulukazi yakhiwe izincibilikisi, ama-ejenti wokumanzisa, ama-resin, ama-corrosion inhibitors nama-activator. Imikhiqizo eguquliwe ngokushisa kufanele ibe khona ngemva kokusoda. Lezi zinto Mayelana nokwehluleka komkhiqizo, izinsalela zangemuva kokushisela ziyisici esibaluleke kakhulu esithinta ikhwalithi yomkhiqizo. Izinsalela ze-Ionic cishe zibangele ukufuduka kwe-electromigration futhi zinciphise ukumelana nokufakwa kwe-insulation, futhi izinsalela ze-rosin resin kulula ukukhangisa Uthuli noma ukungcola kubangela ukuthi ukumelana nokuxhumana kukhuphuke, futhi ezimeni ezinzima, kuzoholela ekuhlulekeni kwesekethe evulekile. Ngakho-ke, ukuhlanza okuqinile kufanele kwenziwe ngemuva kokushisela ukuze kuqinisekiswe ikhwalithi yebhodi lesifunda PCBA.
Kafushane, ukuhlanzwa kwebhodi lesifunda i-PCBA kubaluleke kakhulu. "Ukuhlanza" kuyinqubo ebalulekile ehlobene ngokuqondile nekhwalithi yebhodi lesifunda i-PCBA futhi kudingekile.