Isingeniso sezinzuzo kanye nokubiI-BGA PCBibhodi

I-ball grid array (BGA) printed circuit board (PCB) iyi-surface mount package PCB eyenzelwe ngqo amasekhethi ahlanganisiwe. Amabhodi e-BGA asetshenziswa ezinhlelweni lapho ukukhwezwa kwendawo kungunaphakade, isibonelo, kumadivayisi afana nama-microprocessors. Lawa amabhodi esekethe aphrintiwe alahlwayo futhi awakwazi ukuphinda asetshenziswe. Amabhodi e-BGA anamaphini okuxhumana amaningi kunama-PCB avamile. Iphuzu ngalinye ebhodini le-BGA lingathengiswa ngokuzimela. Konke ukuxhumana kwalawa ma-PCB kusakazwa ngendlela ye-matrix efanayo noma igridi engaphezulu. Lawa ma-PCB aklanywe ngendlela yokuthi yonke indawo engaphansi ingasetshenziswa kalula esikhundleni sokusebenzisa indawo eseceleni.

Izikhonkwane zephakheji ye-BGA mafushane kakhulu kune-PCB evamile ngoba inomumo wohlobo lwe-perimeter kuphela. Ngenxa yalesi sizathu, inikeza ukusebenza okungcono ngesivinini esiphezulu. I-BGA yokushisela idinga ukulawula okunembile futhi ivame ukuqondiswa imishini ezenzakalelayo. Yingakho amadivayisi e-BGA engafanele ukukhwezwa isokhethi.

Soldering ubuchwepheshe BGA emaphaketheni

I-oven yokugeleza kabusha isetshenziselwa ukuthengisa iphakheji ye-BGA ebhodini lesifunda eliphrintiwe. Lapho ukuncibilika kwamabhola e-solder kuqala ngaphakathi kuhhavini, ukungezwani okungaphezulu kwamabhola ancibilikisiwe kugcina iphakethe liqondaniswe endaweni yalo yangempela ku-PCB. Le nqubo iyaqhubeka kuze kube yilapho iphakheji ikhishwa kuhhavini, ipholile futhi iba qinile. Ukuze ube namajoyini e-solder ahlala isikhathi eside, inqubo yokudambisa elawulwayo yephakheji ye-BGA iyadingeka kakhulu futhi kufanele ifinyelele izinga lokushisa elidingekayo. Lapho kusetshenziswa amasu afanele we-soldering, aphinde aqede noma yikuphi ukutholakala kwamasekethe amafushane.

Izinzuzo zokupakisha kwe-BGA

Kunezinzuzo eziningi zokupakishwa kwe-BGA, kodwa izinzuzo eziphezulu kuphela ezichazwe ngezansi.

1. Ukupakishwa kwe-BGA kusebenzisa isikhala se-PCB kahle: Ukusetshenziswa kwe-BGA yokupakisha iqondisa ukusetshenziswa kwezingxenye ezincane kanye nendawo encane. Lawa maphakheji asiza futhi ukonga isikhala esanele sokwenza ngokwezifiso ku-PCB, ngaleyo ndlela andise ukusebenza kwayo kahle.

2. Ukusebenza okuthuthukisiwe kukagesi nokushisayo: Usayizi wamaphakheji we-BGA mncane kakhulu, ngakho lawa ma-PCB ahlakaza ukushisa okuncane futhi inqubo yokulahla kulula ukuyisebenzisa. Noma nini lapho i-wafer ye-silicon ifakwe phezulu, ukushisa okuningi kudluliselwa ngqo kugridi yebhola. Kodwa-ke, ngokufa kwe-silicon kufakwe ngezansi, i-silicon die ixhuma phezulu kwephakheji. Yingakho kubhekwa njengenketho engcono kakhulu yobuchwepheshe bokupholisa. Awekho izikhonkwane ezigobekayo noma ezintekenteke kuphakheji ye-BGA, ngakho-ke ukuqina kwalawa ma-PCB kuyakhula kuyilapho kuqinisekiswa nokusebenza kahle kukagesi.

3. Thuthukisa inzuzo yokukhiqiza ngokusebenzisa i-solder ethuthukisiwe: Amaphedi amaphakheji we-BGA makhulu ngokwanele ukuwenza kube lula ukusoda futhi kulula ukuwaphatha. Ngakho-ke, ukushisela kalula nokuphatha kwenza kusheshe kakhulu ukukhiqiza. Amaphedi amakhulu alawa ma-PCB angaphinda asetshenzwe kabusha kalula uma edingeka.

4. YEHLISA UBUNGOZI BOKULIMALA: Iphakheji ye-BGA ithengiswa ngokwesimo esiqinile, ngaleyo ndlela inikeza ukuqina nokuqina okuqinile kunoma yisiphi isimo.

kwe-5. Yehlisa izindleko: Izinzuzo ezingenhla zisiza ukunciphisa izindleko zokupakishwa kwe-BGA. Ukusetshenziswa kahle kwamabhodi esekethe aphrintiwe kunikeza amathuba engeziwe okugcina izinto zokwakha kanye nokwenza ngcono ukusebenza kwe-thermoelectric, okusiza ukuqinisekisa ikhwalithi ephezulu ye-elekthronikhi nokunciphisa amaphutha.

Ukungalungi kokupakishwa kwe-BGA

Okulandelayo kukhona ukungalungi kwamaphakheji we-BGA, achazwe ngokuningiliziwe.

1. Inqubo yokuhlola inzima kakhulu: Kunzima kakhulu ukuhlola isifunda ngesikhathi senqubo yokuhlanganisa izingxenye kuphakheji ye-BGA. Kunzima kakhulu ukuhlola noma yimaphi amaphutha okungenzeka kuphakheji ye-BGA. Ngemuva kokuthi ingxenye ngayinye isithengisiwe, iphakheji linzima ukufunda nokuhlola. Ngisho noma kukhona iphutha elitholakala ngesikhathi sokuhlolwa, kuzoba nzima ukulilungisa. Ngakho-ke, ukuze kube lula ukuhlola, kusetshenziswa ubuchwepheshe be-CT scan kanye ne-X-ray ebiza kakhulu.

2. Izinkinga ezinokwethenjelwa: Amaphakheji e-BGA asengozini yokucindezeleka. Lokhu buthakathaka kungenxa yengcindezi egobayo. Lokhu kucindezeleka okugobayo kubangela izinkinga zokwethembeka kulawa mabhodi esekethe aphrintiwe. Nakuba izinkinga zokuthembeka zingavamile kumaphakheji e-BGA, kungenzeka kuhlale kukhona.

I-BGA ihlanganiswe ubuchwepheshe be-RayPCB

Ubuchwepheshe obusetshenziswa kakhulu bosayizi wephakheji ye-BGA osetshenziswa yi-RayPCB ngu-0.3mm, futhi ibanga elincane okufanele libe phakathi kwamasekhethi ligcinwa ku-0.2mm. Isikhala esincane phakathi kwamaphakheji e-BGA amabili ahlukene (uma kugcinwa ku-0.2mm). Nokho, uma izidingo zihlukile, sicela uthinte i-RAYPCB ukuze uthole izinguquko emininingwaneni edingekayo. Ibanga losayizi wephakheji ye-BGA liboniswa esithombeni esingezansi.

Ikusasa BGA emaphaketheni

Akunakuphikwa ukuthi ukupakishwa kwe-BGA kuzohola imakethe yemikhiqizo kagesi neye-elekthronikhi ngokuzayo. Ikusasa lokupakishwa kwe-BGA liqinile futhi lizoba semakethe isikhathi eside. Kodwa-ke, izinga lamanje lokuthuthuka kwezobuchwepheshe lishesha kakhulu, futhi kulindeleke ukuthi esikhathini esizayo esiseduze, kuzoba nolunye uhlobo lwebhodi lesifunda eliphrintiwe elisebenza kahle kakhulu kune-BGA yokupakisha. Kodwa-ke, intuthuko kwezobuchwepheshe nayo ilethe izinkinga zokwehla kwamandla emali kanye nezindleko emhlabeni wezogesi. Ngakho-ke, kucatshangwa ukuthi ukupakishwa kwe-BGA kuzohamba ibanga elide embonini ye-elekthronikhi ngenxa yokusebenza kahle kwezindleko kanye nezizathu zokuqina. Ngaphezu kwalokho, kunezinhlobo eziningi zamaphakheji e-BGA, futhi umehluko ezinhlotsheni zawo zandisa ukubaluleka kwamaphakheji we-BGA. Isibonelo, uma ezinye izinhlobo zamaphakheji e-BGA zingafaneleki emikhiqizweni kagesi, ezinye izinhlobo zamaphakheji e-BGA zizosetshenziswa.