1. Kungani usebenzise amabhodi wesifunda se-ceramic

I-PCB evamile ngokuvamile yenziwe nge-foil yethusi kanye ne-substrate bonding, futhi i-substrate material ngokuvamile i-glass fiber (FR-4), i-phenolic resin (FR-3) nezinye izinto, i-adhesive ngokuvamile i-phenolic, epoxy, njll. Ukucutshungulwa kwe-PCB ngenxa yokucindezeleka okushisayo, izici zamakhemikhali, inqubo yokukhiqiza engafanele nezinye izizathu, noma inqubo yokuklama ngenxa yezinhlangothi ezimbili ze-asymmetry yethusi, kulula ukuholela emazingeni ahlukene ebhodi le-PCB ephikisanayo.

I-PCB Twist

Futhi enye i-PCB substrate - i-ceramic substrate, ngenxa yokusebenza kokushisa kokushisa, umthamo wamanje wokuthwala, ukwahlukanisa, i-coefficient yokwandisa ukushisa, njll., ingcono kakhulu kunebhodi le-PCB yengilazi evamile, ngakho isetshenziswa kabanzi kumamojula we-electronics wamandla aphezulu. , i-aerospace, i-electronics yezempi neminye imikhiqizo.

Ama-substrates e-Ceramic

Nge-PCB evamile esebenzisa i-adhesive copper foil kanye ne-substrate bonding, i-ceramic PCB isendaweni yokushisa ephezulu, ngendlela yokuhlanganisa i-copper foil kanye ne-ceramic substrate ehlanganiswe ndawonye, ​​amandla okubopha aqinile, ucwecwe lwethusi ngeke liwe, ukwethembeka okuphezulu, ukusebenza okuzinzile endaweni ephakeme. izinga lokushisa, umswakama ophezulu imvelo

2. Izinto eziyinhloko ze-ceramic substrate

I-Alumina (Al2O3)

I-Alumina iyinto evame ukusetshenziswa kakhulu ku-substrate ye-ceramic, ngoba kumishini, izakhiwo ezishisayo nezikagesi uma kuqhathaniswa nezinye izitsha eziningi ze-oxide, amandla aphezulu nokuzinza kwamakhemikhali, kanye nomthombo ocebile wezinto zokusetshenziswa, ezifanele ukukhiqizwa kobuchwepheshe obuhlukahlukene nobujamo obuhlukahlukene. . Ngokwephesenti ye-alumina (Al2O3) ingahlukaniswa ibe yi-porcelain engu-75, i-porcelain engu-96, i-porcelain engu-99.5. Izakhiwo zikagesi ze-alumina cishe azithinteki ngokuqukethwe okuhlukile kwe-alumina, kodwa izakhiwo zayo zemishini kanye ne-thermal conductivity ishintsha kakhulu. I-substrate enokuhlanzeka okuphansi inengilazi eyengeziwe kanye nobulukhuni obungaphezulu. Ukuphakama kokuhlanzeka kwe-substrate, bushelelezi, kuhlangene, ukulahlekelwa okuphakathi kuphansi, kodwa intengo nayo iphakeme

I-Beryllium oxide (BeO)

Ine-conductivity ephezulu yokushisa kune-aluminium yensimbi, futhi isetshenziswa ezimweni lapho kudingeka khona ukuqhutshwa kokushisa okuphezulu. Yehla ngokushesha ngemva kokuba izinga lokushisa lidlule ku-300 ℃, kodwa ukukhula kwayo kunqunyelwe ubuthi bayo.

I-Aluminium nitride (AlN) 

I-Aluminium nitride ceramics iyi-ceramics enezimpushana ze-aluminium nitride njengesigaba sekristalu esiyinhloko. Uma kuqhathaniswa ne-alumina ceramic substrate, ukumelana nokufakwa kwe-insulation, ukufakwa kwe-insulation ukumelana ne-voltage ephezulu, i-dielectric engaguquki. I-thermal conductivity yayo iphindwe izikhathi ezingu-7~10 kune-Al2O3, futhi i-thermal expansion coefficient (CTE) icishe ifaniswe ne-silicon chip, ebaluleke kakhulu kuma-chips semiconductor anamandla aphezulu. Enkambweni yokukhiqiza, i-thermal conductivity ye-AlN ithinteka kakhulu ngokuqukethwe kokungcola okusele kwe-oksijeni, futhi ukuqhutshwa kwe-thermal kungakhuliswa kakhulu ngokunciphisa okuqukethwe kwe-oxygen. Njengamanje, i-thermal conductivity yenqubo

Ngokusekelwe kulezi zizathu ezingenhla, kungaziwa ukuthi izitsha zobumba ze-alumina zisendaweni ehamba phambili emikhakheni ye-microelectronics, amandla kagesi, ama-microelectronics axubile namamojula wamandla ngenxa yokusebenza kwawo okuphezulu okuphelele.

Uma kuqhathaniswa nemakethe yobukhulu obufanayo (100mm×100mm×1mm), izinto ezahlukene zentengo ye-ceramic substrate: 96% alumina 9.5 yuan, 99% alumina 18 yuan, aluminium nitride 150 yuan, beryllium oxide 650 yuan, kungabonakala ukuthi igebe lamanani phakathi kwama-substrates ahlukene nalo likhulu ngokuqhathaniswa

3. Izinzuzo kanye nokubi PCB Ceramic

Izinzuzo

1. Umthamo omkhulu wamanje wokuthwala, i-100A yamanje ngokuqhubekayo ngokusebenzisa umzimba wethusi owugqinsi ongu-1mm 0.3mm, ukukhuphuka kwezinga lokushisa okungaba ngu-17 ℃
2. Ukwenyuka kwezinga lokushisa cishe ku-5℃ kuphela lapho i-100A yamanje idlula ngokuqhubekayo emzimbeni wethusi owugqinsi ongu-2mm 0.3mm.
3. Ukusebenza okungcono kokulahla ukushisa, i-coefficient ephansi yokwandisa okushisayo, umumo ozinzile, akulula ukungqubuzana.
4. Ukwahlukanisa okuhle, ukumelana nogesi ophezulu, ukuqinisekisa ukuphepha komuntu siqu kanye nemishini.

Ukubi

I-Fragility ingenye yezinkinga eziyinhloko, okuholela ekwenzeni amabhodi amancane kuphela.

Intengo iyabiza, izidingo zemikhiqizo ye-elekthronikhi ziyanda imithetho, ibhodi lesifunda se-ceramic noma elisetshenziswe kweminye yemikhiqizo ephezulu kakhulu, imikhiqizo ephansi ngeke isetshenziswe nhlobo.

4. Ukusetshenziswa kwe-ceramic PCB

a. Imodyuli ye-elekthronikhi yamandla aphezulu, imojula yephaneli yelanga, njll

1. Ukunikezwa kwamandla okushintsha imvamisa ephezulu, ukudluliselwa kwesimo esiqinile
2. I-elekthronikhi yezimoto, i-aerospace, i-electronics yezempi
3. Imikhiqizo yokukhanyisa ye-LED enamandla aphezulu
4. I-antenna yokuxhumana