Ukuvimbela izimbobo ekufakeni nasekushiseleni kuhilela ukuhlola izinqubo ezintsha zokukhiqiza nokuhlaziya imiphumela. Ama-plating kanye nama-welding voids ngokuvamile anezimbangela ezibonakalayo, njengohlobo lwe-solder paste noma i-drill bit esetshenziselwa inqubo yokukhiqiza. Abakhiqizi be-PCB bangasebenzisa inqwaba yamasu abalulekile ukuze bahlonze futhi babhekane nezimbangela ezivamile zalezi zigebengu.
1.Lungisa ijika lokushisa le-reflux
Enye yezindlela zokuvimbela imigodi yokushisela ukulungisa indawo ebucayi yejika le-reflux. Ukunikeza izigaba zesikhathi ezihlukene kungandisa noma kwehlise amathuba okwakheka kwe-voids. Ukuqonda izici ezifanele zejika lokubuya kubalulekile ekuvimbeleni umgodi ophumelelayo.
Okokuqala, bheka Izilungiselelo zamanje zesikhathi sokufudumala. Zama ukukhulisa izinga lokushisa langaphambi kokushisa noma ukwelula isikhathi sokushisa ngaphambili kwejika le-reflux. Izimbobo ze-solder zingase zakheke ngenxa yokushisa okunganele endaweni yokushisa, ngakho-ke sebenzisa lawa masu ukulungisa imbangela.
Izindawo zokushisa ezilinganayo nazo ziyizigebengu ezivamile kuma-voids ashiselwe. Izikhathi ezimfushane zokucwiliswa emanzini zingase zingavumeli zonke izingxenye nezindawo zebhodi ukuthi zifinyelele izinga lokushisa elidingekayo. Zama ukuvumela isikhathi esengeziwe sale ndawo yejika le-reflux.
2.Sebenzisa i-flux encane
Ukuguquguquka okuningi kungabhebhethekisa futhi kuvame ukuholela ekushiseleni. Enye inkinga ngomgodi ohlangene: i-flux degassing. Uma i-flux ingenaso isikhathi esanele sokuqeda igesi, igesi engaphezulu izobanjwa futhi i-void izokwakhiwa.
Uma kusetshenziswa ukugeleza okuningi ku-PCB, isikhathi esidingekayo ukuze i-flux ikhishwe ngokuphelele siyanwetshwa. Ngaphandle uma ungeza isikhathi esengeziwe sokususa ugesi, i-flux eyengeziwe izoholela ku-weld voids.
Nakuba ukwengeza isikhathi esiningi sokususa umoya kungaxazulula le nkinga, kuphumelela kakhulu ukunamathela kumthamo we-flux edingekayo. Lokhu konga amandla nezinsiza futhi kwenza amalunga ahlanzeke.
3.Sebenzisa izinsimbi zokubhola ezicijile kuphela
Imbangela evamile yezimbobo zokucwenga impofu ngokubhoboza imigodi. Izingcezu ezibuthuntu noma ukunganembi kahle kokumba kungandisa amathuba okwakheka kwemfucumfucu ngesikhathi sokumba. Lapho lezi zicucu zinamathela ku-PCB, zenza izindawo ezingenalutho ezingenakunameka ngethusi. Lokhu kuphazamisa i-conductivity, ikhwalithi nokuthembeka.
Abakhiqizi bangakwazi ukuxazulula le nkinga ngokusebenzisa izinsimbi zokubhoboza ezibukhali nezibukhali. Misa ishejuli ehambisanayo yokulola noma ukushintsha izingcezu zokubhoboza, njengekota. Lokhu kunakekelwa okujwayelekile kuzoqinisekisa izinga lokumba emigodini engaguquki futhi kunciphise amathuba okuba khona kwemfucumfucu.
4.Zama imiklamo yesifanekiso ehlukene
Idizayini yesifanekiso esetshenziswa enqubweni yokugeleza kabusha ingasiza noma ivimbe ama-voids ashiselwe. Ngeshwa, asikho isixazululo esilingana nosayizi owodwa ekukhethweni kwedizayini yesifanekiso. Eminye imiklamo isebenza kangcono ngezinhlobo ezahlukene ze-solder, i-flux, noma izinhlobo ze-PCB. Kungase kuthathe ukuzama nephutha ukuthola ukukhetha kohlobo oluthile lwebhodi.
Ukuthola ngempumelelo ukwakheka kwesifanekiso esifanele kudinga inqubo yokuhlola enhle. Abakhiqizi kumele bathole indlela yokulinganisa nokuhlaziya umthelela we-formwork design kuma-voids.
Indlela ethembekile yokwenza lokhu ukwakha iqoqo le-PCBS ngomklamo othize wesifanekiso bese uzihlola kahle. Kusetshenziswa izifanekiso eziningana ezihlukene ukwenza lokhu. Ukuhlola kufanele kwembule ukuthi yimiphi imiklamo ye-formwork enenani elijwayelekile lezimbobo ze-solder.
Ithuluzi elibalulekile ohlelweni lokuhlola umshini we-X-ray. Ama-X-ray angenye yezindlela zokuthola ama-void ashiselwe futhi awusizo ikakhulukazi lapho usebenza nama-PCBS amancane, agcwele ngokuqinile. Ukuba nomshini we-X-ray okahle kuzokwenza inqubo yokuhlola ibe lula kakhulu futhi isebenze kahle.
5.Izinga lokumba elincishisiwe
Ngaphezu kobukhali be-bit, isivinini sokumba sizophinde sibe nomthelela omkhulu kwikhwalithi yokucwenga. Uma ijubane elincane liphezulu kakhulu, lizonciphisa ukunemba futhi kwandise amathuba okwakheka kwemfucumfucu. Isivinini esiphezulu sokumba singanyusa ngisho nengozi yokuphuka kwe-PCB, okusongela ubuqotho besakhiwo.
Uma izimbobo zokumboza zisavamile ngemva kokulola noma ukushintsha i-bit, zama ukunciphisa izinga lokumba. Isivinini esinensayo sivumela isikhathi esengeziwe sokwakheka, ukuhlanza ngezimbobo.
Khumbula ukuthi izindlela zokukhiqiza zendabuko aziyona inketho namuhla. Uma ukusebenza kahle kuwukucatshangelwa ekushayeleni amazinga aphezulu okumba, ukuphrinta kwe-3D kungase kube ukukhetha okuhle. I-PCBS ephrintiwe ye-3D ikhiqizwa ngokuyikho kakhulu kunezindlela zendabuko, kodwa ngokunemba okufanayo noma okuphezulu. Ukukhetha i-PCB ephrintiwe ye-3D kungase kungadingi ukubhoboza izimbobo nhlobo.
6.Namathela ekunamathiseleni kwe-solder yekhwalithi ephezulu
Kungokwemvelo ukufuna izindlela zokonga imali enqubweni yokukhiqiza ye-PCB. Ngeshwa, ukuthenga unamathisele we-solder oshibhile noma osezingeni eliphansi kungandisa amathuba okwenza ama-weld voids.
Izakhiwo zamakhemikhali zezinhlobo ezahlukene ze-solder paste zithinta ukusebenza kwazo kanye nendlela ezisebenzisana ngayo ne-PCB ngesikhathi senqubo ye-reflux. Isibonelo, ukusebenzisa i-solder paste engenawo umthofu kungase kunciphe ngesikhathi sokupholisa.
Ukukhetha ikhwalithi ephezulu yokunamathisela i-solder kudinga ukuthi uqonde izidingo ze-PCB nesifanekiso esisetshenzisiwe. I-solder paste ewugqinsi kuzoba nzima ukungena kusifanekiso esinembobo encane.
Kungase kube usizo ukuhlola ama-solder ama-paste ahlukene ngesikhathi esifanayo nokuhlola izifanekiso ezihlukene. Kugcizelelwa ukusebenzisa umthetho wamabhola amahlanu ukulungisa usayizi wesifanekiso sokuvula ukuze okunamathiselwe kwe-solder kufane nesifanekiso. Umthetho uthi abakhiqizi bazosebenzisa i-formwork enezimbobo ezidingekayo ukuze kulingane amabhola okunamathisela e-solder amahlanu. Lo mqondo wenza kube lula inqubo yokudala ukucushwa kwesifanekiso sokunamathisela okuhlukile ukuze sihlolwe.
7.Yehlisa i-solder paste oxidation
I-oxidation ye-solder paste ivame ukwenzeka lapho kunomoya omningi noma umswakama endaweni yokukhiqiza. I-oxidation ngokwayo inyusa amathuba okuthi ama-voids akheke, futhi iphakamisa nokuthi umoya oweqile noma umswakama uyanda futhi ubungozi be-voids. Ukuxazulula nokunciphisa i-oxidation kusiza ukuvimbela i-voids ukuthi ingakhi futhi kuthuthukisa ikhwalithi ye-PCB.
Okokuqala hlola uhlobo solder unama esetshenziswa. I-solder paste encibilikayo emanzini ijwayele kakhulu i-oxidation. Ngaphezu kwalokho, ukugeleza okunganele kwandisa ingozi ye-oxidation. Yiqiniso, ukuguquguquka okuningi kuyinkinga, ngakho-ke abakhiqizi kufanele bathole ibhalansi. Kodwa-ke, uma kwenzeka i-oxidation, ukwandisa inani lokugeleza ngokuvamile kungaxazulula inkinga.
Abakhiqizi be-PCB bangathatha izinyathelo eziningi ukuvimbela izimbobo zokucwenga nezinsimbi emikhiqizweni ye-elekthronikhi. I-Voids ithinta ukuthembeka, ukusebenza kanye nekhwalithi. Ngenhlanhla, ukunciphisa amathuba okwakhiwa kwe-voids kulula njengokushintsha i-solder paste noma ukusebenzisa i-stencil design entsha.
Ngokusebenzisa indlela yokuhlola ukuhlola-ukuhlaziya, noma yimuphi umkhiqizi angathola futhi abhekane nembangela ye-voids kuzinqubo ze-reflux ne-plating.
