Njengoba nje izitolo zezingxenyekazi zekhompuyutha zidinga ukuphatha nokubonisa izipikili nezikulufu zezinhlobo ezihlukahlukene, i-metric, impahla, ubude, ububanzi nephimbo, njll., idizayini ye-PCB nayo idinga ukuphatha izinto zokuklama ezifana nezimbobo, ikakhulukazi kumklamo wokuminyana okuphezulu. Imiklamo ye-PCB evamile ingase isebenzise izimbobo ezimbalwa ezihlukene zokudlula, kodwa imiklamo yanamuhla yokuxhumanisa okuphezulu (HDI) idinga izinhlobo eziningi ezahlukene nosayizi bezimbobo zokudlula. Imbobo ngayinye yokudlula idinga ukuphathwa ukuze isetshenziswe ngendlela efanele, kuqinisekiswe ukusebenza okuphezulu kwebhodi kanye nokwenza kahle okungenaphutha. Lesi sihloko sizochaza kabanzi ngesidingo sokuphatha izimbobo eziminyene kakhulu ekwakhiweni kwe-PCB nokuthi ungakufeza kanjani lokhu.

Izinto ezishayela idizayini ye-PCB yokuminyana okuphezulu 

Njengoba isidingo semishini emincane ye-elekthronikhi siqhubeka sikhula, amabhodi esifunda anyathelisiwe anika amandla lezi zixhobo kufanele anciphe ukuze alingane kuwo. Ngesikhathi esifanayo, ukuze kuhlangatshezwane nezidingo zokuthuthukiswa kokusebenza, amadivaysi e-elekthronikhi kufanele engeze amanye amadivaysi namasekhethi ebhodini. Ubukhulu bemishini ye-PCB buhlala buncipha, futhi nenani lamaphini liyanda, ngakho-ke kufanele usebenzise izikhonkwane ezincane kanye nesikhala esiseduze sokuklama, okwenza inkinga ibe nzima kakhulu. Kubaklami be-PCB, lokhu kulingana nesikhwama esiba sincane futhi sibe sincane, kuyilapho sibambe izinto eziningi kuso. Izindlela zendabuko zokuklama ibhodi lesifunda ngokushesha zifinyelela imingcele yazo.

Ukuze kuhlangatshezwane nesidingo sokwengeza amasekhethi engeziwe kusayizi webhodi elincane, indlela entsha yokuklama ye-PCB ibe khona - i-high-density Interconnect, noma i-HDI. Idizayini ye-HDI isebenzisa izindlela ezithuthuke kakhulu zokukhiqiza ibhodi lesifunda, ububanzi bemigqa emincane, izinto ezisetshenziswayo ezizacile, kanye nama-microholes angaboni futhi agqitshiwe noma ambozwe nge-laser. Ngenxa yalezi zici zokuminyana okuphezulu, amasekhethi amaningi angabekwa ebhodini elincane futhi anikeze isisombululo esisebenzayo sokuxhuma amasekethe ahlanganisiwe wamaphini amaningi.

Kunezinye izinzuzo ezimbalwa zokusebenzisa lezi zimbobo eziminyana kakhulu: 

Iziteshi zezintambo:Njengoba izimbobo eziyizimpumputhe nezigqitshiwe kanye nama-microholes angangeni kusitaki sesendlalelo, lokhu kudala iziteshi zezintambo ezengeziwe ekwakhiweni. Ngokubeka ngobuchule lezi zimbobo ezihlukene, abaklami bangakwazi ukuhlanganisa amadivayisi ngamakhulu ezikhonkwane. Uma kusetshenziswa izimbobo ezijwayelekile kuphela, amadivayisi anamaphini amaningi ngokuvamile azovimba zonke iziteshi zezintambo ezingaphakathi.

Ubuqotho besignali:Amasignali amaningi emishinini emincane kagesi anezidingo ezithile zobuqotho besignali, futhi izimbobo zokudlula azihlangabezani nezidingo ezinjalo zokuklama. Lezi zimbobo zingakha ama-antenna, zethule izinkinga ze-EMI, noma zithinte indlela yokubuya kwesignali yamanethiwekhi abalulekile. Ukusetshenziswa kwemigodi eyimpumputhe kanye nokugqitshwa noma ama-microholes aqeda izinkinga ezingase zibe khona zesignali yobuqotho ebangelwa ukusetshenziswa ngokusebenzisa izimbobo.

Ukuze uqonde kangcono lezi zimbobo, ake sibheke izinhlobo ezahlukene zemigodi engasetshenziswa kumiklamo eminyanisa kakhulu kanye nezicelo zazo.

Uhlobo kanye nesakhiwo sezimbobo zokuxhumanisa ezinobukhulu obukhulu 

Imbobo yokudlula iyimbobo ebhodini lesifunda exhuma izingqimba ezimbili noma ngaphezulu. Ngokuvamile, imbobo idlulisela isignali ethwelwe yisifunda ukusuka kungqimba olulodwa lwebhodi kuya kumjikelezo ohambisanayo kolunye ungqimba. Ukuze wenze amasignali phakathi kwezingqimba zezintambo, izimbobo zenziwe ngensimbi ngesikhathi sokukhiqiza. Ngokusho kokusetshenziswa okuqondile, ubukhulu bomgodi kanye nephedi kuhlukile. Izimbobo zokudlula ezincane zisetshenziselwa ukufaka izintambo zesignali, kuyilapho izimbobo ezinkulu zisetshenziselwa amandla kanye nezintambo zaphansi, noma ukusiza amadivayisi okushisa ngokweqile.

Izinhlobo ezahlukene zezimbobo ebhodini lesifunda

ngembobo

I- through-hole iyimbobo evamile esetshenziswe emabhodini esekethe aphrintiwe anezinhlangothi ezimbili selokhu aqala ukwethulwa. Izimbobo zibhobozwa ngomshini kulo lonke ibhodi lesifunda futhi zifakwe ngogesi. Kodwa-ke, ubuncane bebhore elingabhobozwa ngomshini wokuprakthiza linemikhawulo ethile, kuye ngokuthi isilinganiso sesici se-diameter ye-drill kuya ekugqineni kwepuleti. Ngokuvamile, ukuvuleka kwembobo edlulayo akukho ngaphansi kuka-0.15 mm.

Imbobo eyimpumputhe:

Njengezimbobo, izimbobo zibhobozwa ngomshini, kodwa ngezinyathelo eziningi zokukhiqiza, ingxenye kuphela yepuleti ibhotshwa ukusuka phezulu. Izimbobo eziyizimpumputhe nazo zibhekana nenkinga yokulinganiselwa kosayizi omncane; Kodwa kuye ngokuthi yiluphi uhlangothi lwebhodi esikulo, singakwazi ukufaka ucingo ngaphezulu noma ngaphansi kwembobo eyimpumputhe.

Imbobo engcwatshiwe:

Imigodi engcwatshiwe, njengemigodi eyizimpumputhe, ibholwa ngomshini, kodwa iqala futhi iphele ongqimbeni lwangaphakathi lwebhodi kunongaphezulu. Le mbobo yokuphumela nayo idinga izinyathelo ezengeziwe zokukhiqiza ngenxa yesidingo sokushumeka esitakini samapuleti.

I-Micropore

Lokhu kubhobozwa kukhishwa nge-laser futhi indawo yokumboza ingaphansi komkhawulo ongu-0.15 mm webhithi yokubhoboza eyimishini. Ngenxa yokuthi ama-microholes abala izendlalelo ezimbili kuphela ezincikene zebhodi, i-aspect ratio yenza izimbobo zitholakalele ukucwenga zibe zincane kakhulu. Ama-Microholes angabuye abekwe phezulu noma ngaphakathi kwebhodi. Ama-microholes avamise ukugcwaliswa futhi acwecwe, afihlekile, ngakho-ke angabekwa kumabhola e-solder element angaphezulu wezingxenye ezifana ne-ball grid arrays (BGA). Ngenxa yembobo encane, i-pad edingekayo ku-microhole nayo incane kakhulu kunomgodi ojwayelekile, cishe u-0.300 mm.

Ngokwezidingo zokuklama, izinhlobo ezahlukene ezingenhla zemigodi zingalungiswa ukuze zisebenze ndawonye. Isibonelo, ama-micropores angahlanganiswa namanye ama-micropores, kanye nezimbobo ezigqitshiwe. Lezi zimbobo nazo zinganyakaziswa. Njengoba kushiwo ngaphambili, ama-microholes angafakwa kumaphedi anezikhonkwane zesici se-surface-mount. Inkinga yokuminyana kwezintambo iphinda idambiswe ukungabibikho komzila ovamile ukusuka endaweni yokukhweza engaphezulu kuya endaweni yokukhipha abalandeli.