Njengoba nje izitolo ze-Hardware zidinga ukuphatha nokubonisa izinzipho nezikulufa zezinhlobo ezahlukahlukene, ama-metric, impahla, ubude, ububanzi, njll. Imiklamo ye-PCB yendabuko ingasebenzisa kuphela izimbobo ezimbalwa ezihlukile zokudlula, kepha imiklamo yanamuhla ephezulu ye-InterConnect (HDI) idinga izinhlobo eziningi ezahlukene nosayizi wezimbobo zokudlula. Umgodi ngamunye wokudlula udinga ukusetshenziswa ukuze usetshenziswe kahle, uqinisekise ukusebenza okuphezulu kwebhodi kanye nokusebenza kwamaphutha. Lo mbhalo uzocacisa ngesidingo sokuphatha ubuningi obuphezulu ngokusebenzisa izimbobo ku-PCB Design nokuthi ungakufeza kanjani lokhu.
Izici ezishayela i-PCB ye-PCB ephezulu kakhulu
Njengoba isidingo samadivayisi amancane kagesi aqhubeka nokukhula, amabhodi wesifunda aphrintiwe awo amandla la madivayisi kufanele anciphise ukuze akwazi ukungena kuwo. Ngasikhathi sinye, ukuze uhlangabezane nezidingo zokwenza ngcono ukusebenza, amadivaysi e-elekthronikhi kufanele angeze amadivaysi amaningi namasekethe ebhodini. Ubukhulu bamadivayisi we-PCB buhlale buhlanya, futhi inani lezikhonkwane liyanda, ngakho-ke kufanele usebenzise izikhonkwane ezincane kanye nesikhala esiseduze nokuklama, okwenza inkinga ibe yinkimbinkimbi ngokwengeziwe. Kwabaqambi be-PCB, lokhu kufana nesikhwama esiba sincane futhi sincane, ngenkathi sibambe izinto eziningi kuso. Izindlela zendabuko ze-Circuit Board Design zifinyelela ngokushesha imikhawulo yazo.
Ukuze uhlangabezane nesidingo sokungeza amasekethe amaningi kusayizi webhodi elincane, indlela entsha ye-PCB Design yaphenduka - ukuxhumana okuphezulu, noma i-HDI. I-HDI design isebenzisa amasu athuthukile okukhiqiza amabhodi okukhiqiza amabhodi, ububanzi obuncane bomugqa, izinto ezinciphayo, kanye nama-microholes angaboni kahle noma angcwatshwe noma angcwatshwe noma angcwatshwe noma angcwatshwe noma angcwatshwe noma angcwatshwe ama-microholes. Ngenxa yalezi zimpawu eziphezulu zezinkomba, amasekethe amaningi angabekwa ebhodini elincane futhi anikeze isixazululo sokuxhumeka esisebenzayo semibuthano ehlanganisiwe ehlukahlukene.
Kunezinzuzo eziningi eziningi zokusebenzisa lezi zimbobo ezinobuningi:
Iziteshi ze-Wiring:Kusukela izimbobo ezingaboni nezingcwayisiwe kanye nama-microholes awangenisi isitaki sengqimba, lokhu kwakha iziteshi ezingezekile ze-wiring ekwakhiweni. Ngokubeka kahle lezi ezihlukile ngokusebenzisa izimbobo ezihlukile, abaklami bangakwazi ukuthola amadivayisi ngamakhulu ezikhonkwane. Uma kusetshenziswa izimbobo ezijwayelekile kuphela, amadivaysi anezikhonkwane eziningi kangaka azovimba zonke iziteshi ezi-wiring zangaphakathi.
Ubuqotho besiginali:Amasiginali amaningi kumadivayisi amancane we-elekthronikhi nawo anezidingo ezithile zokuthembeka zesiginali, kanye nezimbobo ezingahlangabezana nezidingo ezinjalo zokuklama. Lezi zimbobo zingakha ama-antennas, zethule izinkinga ze-EMI, noma zithinte indlela yokubuya yesiginali yamanethiwekhi abucayi. Ukusetshenziswa kwezimbobo ezingaboni kanye nokungcwatshwa noma ama-microholes aqeda izinkinga ezingaba khona ezingenzeka ezibangelwa ukusetshenziswa kwezimbobo.
Ukuze uqonde kangcono lezi zimbobo, ake sibheke izinhlobo ezahlukene zezimbobo ezingasetshenziswa emiklamo yezingane eziphezulu kanye nezicelo zazo.
Thayipha nokwakheka kwezimbobo zokuxhumana eziphezulu
Umgodi wokudlula umgodi ebhodini yesekethe elihlanganisa izingqimba ezimbili noma ngaphezulu. Ngokuvamile, umgodi udlulisa isibonakaliso esasithwalwa yisendlalelo kusuka kwelinye ungqimba leBhodi kuya kwesifunda esihambisanayo ngakwelinye isendlalelo. Ukuze wenze amasiginali phakathi kwezendlalelo ze-wiring, izimbobo zihlanganisiwe ngesikhathi senqubo yokukhiqiza. Ngokusho kokusetshenziswa okuqondile, usayizi womgodi bese kuhlukaniswa pad. Kusetshenziswa izimbobo ezincane nge-signal wiring, ngenkathi kukhulu ngezimbobo zisetshenziselwa amandla kanye ne-wiring emhlabathini, noma ukusiza ukushisa ngokweqile kwamadivayisi.
Izinhlobo ezahlukene zezimbobo ebhodini lesekethe
ngokusebenzisa-hole
I-pay-hole iyindinganiso esetshenziswayo-hole esetshenziswe emabhodini aseseketheli aphrintiwe abhalwe phansi selokhu yethulwa okokuqala. Izimbobo zibikwe ngomshini kulo lonke ibhodi yesekethe futhi zithwetshuliwe. Kodwa-ke, ubuncane obukhulu obungadonswa yi-mechanic drill bunokulinganiselwa okuthile, ngokuya ngesilinganiso se-Aspect of the Drill Direyic kubukhulu bepuleti. Ngokuvamile ukukhuluma, ukuthambekela komgodi ngokusebenzisa umgodi akuphansi kuka-0.15 mm.
Hole oyimpumputhe:
Njengezimbobo ezinjengezimbobo, izimbobo zimisiwe ngomshini, kepha ngezinyathelo eziningi zokukhiqiza, kuphela ingxenye yepuleti ebunjiwe kusuka ebusweni. Izimbobo eziyimpumputhe nazo zibhekana nenkinga yokulinganiselwa kosayizi omncane; Kepha kuya ngokuthi yiliphi uhlangothi lwebhodi esikulo, singakwazi ukungifaka ngenhla noma ngaphansi komgodi oyimpumputhe.
Umgodi ongcwatshwe:
Izimbobo ezingcwatshwe, njengezimbobo ezingaboni, zivuthwe ngomshini, kepha ziqala futhi ziphele engxenyeni yangaphakathi yeBhodi kunokuba kube ngaphezulu. Lokhu ngomgodi futhi kudinga izinyathelo ezengeziwe zokukhiqiza ngenxa yesidingo sokushumeka esigcawini sepuleti.
Amatshanacwe
Lokhu kungukuphakanyiswa kubili nge-laser futhi i-aperture ingaphansi komkhawulo we-0,15 mm we-mechanic drill bit. Ngoba ama-microholes aqala kuphela izingqimba ezingezansi zebhodi eliseduze lebhodi, isilinganiso se-aspect senza izimbobo zitholakale zincane. Ama-Microholes angabekwa futhi ebusweni noma ngaphakathi kwebhodi. Ama-microholes ajwayele ukugcwaliswa futhi afakwe ama-plated, empeleni afihlwe, ngakho-ke angabekwa kumabhola we-super-themer element yezakhi ezifana ne-ball grid arrays (BGA). Ngenxa ye-aperture encane, i-pad edingekayo yokuthi i-microhole incane kakhulu kunomgodi ojwayelekile, cishe ngo-0.300 mm.
Ngokusho kwezidingo zokwakhiwa, izinhlobo ezahlukene zezimbobo zingalungiswa ukuze zinze zisebenze ndawonye. Isibonelo, ama-micropores angafakwa eminye i-micropores, kanye nezimbobo ezingcwatshwe. Lezi zimbobo nazo zingamangala. Njengoba kushiwo ngaphambili, ama-microholes angafakwa kuma-pads anezikhonkwane ze-surce-Mount element. Inkinga yokuxineka kwe-wiring iphinde yancishiswa ukungabikho komzila wendabuko kusuka ePomu le-Surface Mount PAD ku-Fan Outlet.