Ekwakhiweni kwebhodi le-PCB, idizayini emelene ne-ESD ye-PCB ingafinyelelwa ngokwendlalelo, isakhiwo esifanele kanye nezintambo kanye nokufakwa. Phakathi nenqubo yokuklama, iningi lezinguquko zedizayini zingakhawulelwa ekwengezeni noma ekukhipheni izingxenye ngokuqagela. Ngokulungisa ukwakheka kwe-PCB nezintambo, i-ESD ingavinjelwa kahle.
Ugesi we-PCB omile ovela emzimbeni womuntu, indawo ezungezile ngisho nangaphakathi kwemishini kagesi yebhodi le-PCB uzodala umonakalo ohlukahlukene ku-chip ye-semiconductor eqondile, njengokungena kungqimba oluncane lokufakwa ngaphakathi kwengxenye; Ukulimala kwesango le-MOSFET kanye nezingxenye ze-CMOS; I-CMOS PCB ikhophi yokuvala inhlamvu; I-PN junction ene-short circuit reverse bias; Ibhodi lokukopisha le-PCB lesifunda esifushane ukuze lisuse ukuhlangana kwe-PN; Ishidi le-PCB lincibilikisa intambo ye-solder noma i-aluminium engxenyeni yeshidi le-PCB yedivayisi esebenzayo. Ukuze kuqedwe ukuphazamiseka kanye nokulimala kwe-electrostatic discharge (ESD), kuyadingeka ukuthatha izinyathelo zobuchwepheshe ezihlukahlukene ukuvimbela.
Ekwakhiweni kwebhodi le-PCB, idizayini emelene ne-ESD ye-PCB ingazuzwa ngokwendlalelo kanye nesakhiwo esifanele sezintambo zebhodi le-PCB nokufakwa. Phakathi nenqubo yokuklama, iningi lezinguquko zedizayini zingakhawulelwa ekwengezeni noma ekukhipheni izingxenye ngokuqagela. Ngokulungisa ukwakheka kwe-PCB nomzila, ibhodi lokukopisha le-PCB lingavinjelwa kahle ebhodini lokukopisha le-PCB ESD. Nazi ezinye izindlela zokuphepha ezivamile.
Sebenzisa izendlalelo eziningi ze-PCB ngangokunokwenzeka, uma kuqhathaniswa ne-PCB enamacala amabili, indiza yaphansi kanye nendiza yamandla, kanye nesikhala esihleliwe esiseduze somugqa wesignali singanciphisa i-impedance yemodi evamile kanye nokuhlanganisa inductive, ukuze ifinyelele ku-1 /10 kuya ku-1/100 ye-PCB enezinhlangothi ezimbili. Zama ukubeka ungqimba lwesignali ngayinye eduze kwesendlalelo samandla noma ungqimba lomhlabathi. Ku-PCBS ephezulu kakhulu enezingxenye kuzo zombili izindawo ezingaphezulu neziphansi, zinemigqa yokuxhuma emifushane kakhulu nezindawo eziningi zokugcwalisa, ungacabangela ukusebenzisa umugqa wangaphakathi. Ku-PCBS enezinhlangothi ezimbili, kusetshenziswa ugesi olulukwe ngokuqinile kanye negridi yaphansi. Ikhebula lamandla liseduze nomhlabathi, phakathi kwemigqa eqondile neqondile noma izindawo zokugcwalisa, ukuze zixhumeke ngangokunokwenzeka. Uhlangothi olulodwa losayizi weshidi legridi le-PCB lingaphansi noma lilingana no-60mm, uma kungenzeka, usayizi wegridi kufanele ube ngaphansi kuka-13mm.
Qiniseka ukuthi ishidi le-PCB lesifunda ngalinye lihlangene ngangokunokwenzeka.
Beka zonke izixhumi eceleni ngangokunokwenzeka.
Uma kwenzeka, ethula umugqa womugqa we-PCB wamandla kusukela maphakathi nekhadi futhi kude nezindawo ezingaba nomthelela oqondile we-ESD.
Kuzo zonke izendlalelo ze-PCB ngezansi kwezixhumi eziphuma ku-chassis (ezijwayele ukuqondisa ukulimala kwe-ESD ebhodini lokukopisha le-PCB), beka i-chassis ebanzi noma i-polygon fill floors futhi uzixhume ndawonye nezimbobo ngezikhathi ezingaba ngu-13mm.
Beka izimbobo zokukhweza zeshidi le-PCB onqenqemeni lwekhadi, bese uxhuma amaphedi aphezulu naphansi eshidi le-PCB eligeleza ngokungavimbeli ezungeze izimbobo ezikhuphukayo phansi kwe-chassis.
Lapho uhlanganisa i-PCB, ungasebenzisi noma iyiphi i-solder phezulu noma phansi iphedi leshidi le-PCB. Sebenzisa izikulufu ezineziwasha zeshidi le-PCB ezakhelwe ngaphakathi ukuze uthole ukuthintana okuqinile phakathi kweshidi/isihlangu se-PCB kukesi lensimbi noma ukusekela endaweni ephansi.
"Indawo yokuhlukanisa" efanayo kufanele imiswe phakathi komhlabathi we-chassis kanye nomhlabathi wesifunda wesendlalelo ngasinye; Uma kungenzeka, gcina isikhala ku-0.64mm.
Phezulu nangaphansi kwekhadi eduze nezimbobo zokunamathisela zebhodi lokukopisha le-PCB, xhuma i-chassis nendawo yesekhethi kanye nezintambo ezibanzi ezingu-1.27mm eduze kwentambo yaphansi ye-chassis njalo ngo-100mm. Eduze kwalezi zindawo zokuxhuma, amaphedi e-solder noma izimbobo ezifakwayo zokufakwa zibekwe phakathi kwe-chassis floor kanye neshidi le-PCB lesitezi sesekethe. Lokhu kuxhumana komhlabathi kungasikwa kuvuleke ngensingo ukuze kuhlale kuvuliwe, noma ngokugxuma ngobuhlalu obukazibuthe/i-high frequency capacitor.
Uma ibhodi lesifunda lingeke libekwe kukesi lensimbi noma idivayisi yokuvikela amashidi e-PCB, ungasebenzisi ukumelana ne-solder ezintanjeni eziphansi eziphansi zebhodi lesifunda, ukuze zisetshenziswe njengama-electrode e-ESD arc discharge.
Ukusetha indandatho ezungeze isekethe kumugqa we-PCB olandelayo:
(1)Ngaphezu konqenqema lwedivayisi yokukopisha ye-PCB kanye ne-chassis, faka umzila wendandatho uzungeze wonke umjikelezo wangaphandle.
(2)Qinisekisa ukuthi zonke izendlalelo zingaphezu kuka-2.5mm ububanzi.
(3)Xhuma izindandatho ezinezimbobo njalo ngo-13mm.
(4)Xhuma indandatho endaweni evamile yesekethe yokukopisha ye-PCB enezingqimba eziningi.
(5)Kumashidi e-PCB anezinhlangothi ezimbili afakwe ekuvaleni kwensimbi noma ezintweni ezivikelayo, indawo eyindandatho kufanele ixhunywe endaweni evamile yesekethe. Isifunda esingavikelekile esinezinhlangothi ezimbili kufanele sixhunywe emhlabathini wendandatho, inhlabathi yendandatho ayikwazi ukumbozwa ngokumelana ne-solder, ukuze indandatho isebenze njengenduku yokukhipha i-ESD, futhi okungenani igebe elibanzi elingu-0.5mm libekwe endaweni ethile. ukuma endaweni eyindandatho (zonke izendlalelo), ezingagwema ibhodi lokukopisha le-PCB ukwenza iluphu enkulu. Ibanga phakathi kwezintambo zesignali nendawo yokukhala akufanele ibe ngaphansi kuka-0.5mm.