Ngokuthuthuka okusheshayo kwemboni ye-PCB, i-PCB iya kancane kancane ibheke lapho iqonde khona imigqa emincane enembayo ephezulu, izimbobo ezincane, kanye nezilinganiso eziphezulu (6:1-10:1). Izidingo zethusi lezimbobo zingama-20-25Um, kanti isikhala somugqa we-DF singaphansi kuka-4mil. Ngokuvamile, izinkampani ezikhiqiza i-PCB zinezinkinga ngefilimu ye-electroplating. Isiqeshana sefilimu sizodala ukujikeleza okufushane okuqondile, okuzothinta izinga lokukhiqiza lebhodi le-PCB ngokuhlolwa kwe-AOI. Isiqeshana sefilimu esibucayi noma amaphuzu amaningi kakhulu awakwazi ukulungiswa aholela ekulahlekeni.

Ukuhlaziywa kwesimiso sefilimu yesamishi le-PCB
① Ugqinsi lwethusi lwesekethe yokucwenga kwephethini bukhulu kunobukhulu befilimu eyomile, okuzobangela ukubamba kwefilimu. (Ubukhulu befilimu eyomile esetshenziswa yifektri ye-PCB ejwayelekile ngu-1.4mil)
② Ugqinsi lwethusi nethini lwesekethe yokucwenga kwephethini ludlula ukushuba kwefilimu eyomile, okungase kubangele ukubamba kwefilimu.

Ukuhlaziywa kwezimbangela zokumpintsha
①Iphethini ye-plating density yamanje inkulu, futhi i-copper plating iwugqinsi kakhulu.
②Awukho umcu onqenqemeni kuzo zombili iziphetho zebhasi lempukane, futhi indawo yamanje ephezulu imbozwe ngefilimu ewugqinsi.
③I-adaptha ye-AC inomthamo wamanje omkhulu kunebhodi lokukhiqiza langempela lesethi yamanje.
④C/S side kanye ne-S/S side zihlehlisiwe.
⑤I-pitch incane kakhulu ebhodini lokunamathisela ifilimu enokuphakama okungu-2.5-3.5mil.
⑥Ukusabalalisa kwamanje akulingani, futhi isilinda sokucwenga ithusi asizange sihlanze i-anode isikhathi eside.
⑦ Okokufaka okungalungile okwamanje (faka imodeli engalungile noma faka indawo engalungile yebhodi)
⑧Isikhathi samanje sokuvikela sebhodi le-PCB kusilinda sethusi side kakhulu.
⑨Idizayini yesakhiwo sephrojekthi ayinangqondo, futhi indawo esebenzayo ye-electroplating yezithombe ezinikezwe iphrojekthi ayilungile.
⑩Igebe lomugqa webhodi le-PCB lincane kakhulu, futhi iphethini yesifunda yebhodi enobunzima obuphezulu kulula ukuyinamathisela ifilimu.