I-HDI blind futhi yangcwatshwa ngamabhodi wesifunda asetshenziswe kabanzi emikhakheni eminingi ngenxa yezimpawu zawo, njengokuqina okuphezulu kwe-wiring kanye nokusebenza okungcono kukagesi. Kusuka ku-elekthronikhi yabathengi njengama-Smartphones kanye namathebulethi kuya kuma-Industrial Equipment ezinezidingo zomsebenzi ezinamandla njengezithuthi ze-elekthronikhi nezindawo zokuxhumana, njengento ebalulekile yokulinganisa, njengento ebalulekile ethinta ukusebenza kwayo, inezindinganiso eziqinile futhi ezinemininingwane.
一, ukubaluleka komugqa ububanzi kanye nokunemba okuhlukanisayo
Umthelela Wokusebenza Ngogesi: Ububanzi be-Line buhlobene ngokuqondile nokumelana kocingo, ukumelana okubanzi kwe-Line Fourth kuncane, kungathwala okwamanje; Ibanga lomugqa lithinta amandla kanye nokwenziwa phakathi kwemigqa. Esisekelweni semvamisa ephezulu, uma ukunemba komugqa nokunemba kwebanga lomugqa akwanele, ukuguqulwa kwekhono kanye nokwenziwa kuzodala ukubambezeleka nokuhlanekezela inqubo yokudlulisela isiginali, okuthinta kakhulu ubuqotho besiginali. Isibonelo, kwi-HDI Blind Bured Hole BOOL BOOL yemishini yokuxhumana ye-5G, inani lokudlulisa lesiginali liphezulu kakhulu, futhi ukuphambuka komugqa omncane nokuphambuka kwebanga elincane kungenza ukuthi isiginali singakwazi ukudluliselwa ngokunembile, okuholele ekunciphiseni kwekhwalithi yokuxhumana.
Ukulungiswa kwe-wiring kanye nokusetshenziswa kwesikhala: Enye yezinzuzo zamabhodi wesifunda e-HDI abunjiwe amabhodi aphezulu aphezulu. Ububanzi obukhulu obunembe okuphezulu kanye nokuhlukaniswa komugqa kungahlela eminye imigqa endaweni ekhawulelwe ukufeza imisebenzi eyinkimbinkimbi yokujikeleza. Ukuthatha ibhodi le-smartphone njengesibonelo, ukuze kuhlaliswe inani elikhulu lama-chip, izinzwa nezinye izinto ze-elekthronikhi, inani elikhulu le-wiring lidinga ukuqedwa endaweni encane kakhulu. Ngokulawula ngokuphelele ububanzi belayini kanye nokunemba kwebanga lomugqa singakwazi ukufeza i-wiring esebenza kahle esikhaleni esincane, sithuthukise ukuhlanganiswa kwebhodi encane, futhi sihlangabezane nezidingo ezicebile zamaselula.
二, inani elijwayelekile elijwayelekile lomugqa ububanzi kanye nokunemba kwebanga elithile
Imboni General Livast: Emhlanganweni General HDI BILLE BOOL BOOLDSODE BOOL, ububanzi obujwayelekile obuncane bangafinyelela ku-3-4mil (0.076-0.10mm), kanye nebanga eliphansi le-3-4mil nalo lingaba ngu-3-4mil. Kwezinye izimo ezifunwayo ezifunwayo, njengamabhodi wokulawulwa okungewona umnyombo ku-elekthronikhi abathengisayo, ububanzi be-LINE kanye ne-line spacesing bungavuselelwa ku-5-6mil (0.127-0.152mm). Kodwa-ke, ngenqubekela phambili eqhubekayo yezobuchwepheshe, ububanzi bezinhlu kanye nokunemba kwebanga lemugqa wamabhodi wesifunda aphezulu we-HDI athuthuka endaweni encane. Isibonelo, ezinye izindlu zokufaka ze-Chip Chip ezithuthukile, ububanzi bawo ulayini kanye nebanga le-Line sebefinyelele ku-1-2mil (0.025-0.051mm) ukuze bahlangabezane nezidingo zokudlulisela isineke nezikhulu ze-Chip.
Umehluko ojwayelekile ezinkambeni ezihlukile zohlelo lokusebenza: Emkhakheni weze-elekthronikhi yezimoto, ngenxa yezidingo eziphezulu eziphezulu nendawo yokusebenza eyinkimbinkimbi (njengokushisa okuphezulu, amazinga okunemba okuthe xaxa amabhodi okubuyisa ama-HDI anqwabelanisa. Isibonelo, ibhodi yesekethe elisetshenziswe kwiyunithi yokulawula izimoto ze-amovelile (ECU), ububanzi be-Line ne-Line Direcracy ngokuvamile bulawulwa ku-4-5mil ukuqinisekisa ukuqina kanye nokwethenjwa kokudluliselwa kwesiginali ezindaweni ezinokhahlo. Emkhakheni wemishini yezokwelapha, efana nebhodi yesekethe ye-HDI ku-Magnetic Resonance imaging (MRI) Equipment, ukuze kuqinisekiswe ukutholwa okunembile kwesiginali nokusebenza, ukunemba kwebanga le-Line kanye ne-Line Direcracy kungafinyelela ku-2-3mil ephezulu kakhulu, okubeka izidingo eziphakeme kakhulu kwinqubo yokukhiqiza.
三, izici ezithinta ububanzi be-Line ne-Line Direcracy
Inqubo Yokukhiqiza: Inqubo ye-Lithography isixhumanisi esiyisihluthulelo sokunquma ububanzi belayini nokunemba kwebanga lomugqa. Ezinhlelweni ze-litholwography, ukunemba komshini wokuvezwa, ukusebenza kwe-Photoresist kanye nokulawulwa kwenqubo yentuthuko kanye ne-etching kuzothinta ububanzi belayini nebanga lomugqa. Uma ukunemba komshini wokuvezwa kunganele, iphethini evezayo ingahle iboshwe, futhi ububanzi be-LINE nebanga le-etching lizophambuka kwinani lokuklama. Ngenqubo yokufaka, ukulawulwa okungafanele kokuhlushwa, izinga lokushisa nesikhathi sokugcina uketshezi lwe-etching kuzodala nezinkinga zobubanzi obubanzi kakhulu noma obuncane kakhulu obubanzi kanye nobude obuncane kakhulu.
Izici ezibonakalayo: Izici ezibonakalayo ze-Futterstrate kanye ne-Copper Foil Izici zeBhodi Yesekethe nazo zinomthelela emugqeni ububanzi kanye nokunemba kwebanga lomugqa. Ukulungiswa kokunwebeka kwe-thermal kwezinto zokwakha ezahlukahlukene zehlukile. Enqubweni yokukhiqiza, ngenxa yezinqubo eziningi zokushisa nezinqubo zokupholisa, uma ukwandiswa kwe-thermal kwe-substral impahla kungazinzile, kungahle kuholele ekuguqukeni kwebhodi yesekethe, okuthinta ukunemba komugqa. Ubukhulu bokulingana kwe-foil yethusi bubalulekile futhi, futhi izinga loku-etching le-foil ye-topper elinobukhulu obungalingani lizobe lingahambisani ngesikhathi senqubo yoku-etching, okuholela ekuphambukeni kobubanzi.
四, izindlela zokuthola nokulawula ukunemba
Kusho ukuthini izindlela zokutholwa I-skomprope ye-Optical ingelinye lamathuluzi wokuhlola asetshenziswa kakhulu. Ngokukhulisa isithombe sebhodi lesekethe, ububanzi be-LINE nebanga lomugqa balinganiswa ngesandla noma ngosizo lwesoftware yokuhlaziywa kwezithombe ukuthola ukuthi ngabe kuhlangatshezwane nezinga. I-elektroni