I-Printed Circuit Board (PCB) iyingxenye ye-elekthronikhi eyisisekelo esetshenziswa kabanzi emikhiqizweni ehlukahlukene ye-elekthronikhi nehlobene. I-PCB kwesinye isikhathi ibizwa nge-PWB (Printed Wire Board). Bekukade kuningi eHong Kong naseJapan ngaphambilini, kodwa manje sekuncane (empeleni, i-PCB ne-PWB ahlukene). Emazweni nasezifundeni zaseNtshonalanga, ngokuvamile ibizwa nge-PCB. EMpumalanga, inamagama ahlukene ngenxa yamazwe nezifunda ezahlukene. Ngokwesibonelo, ngokuvamile ibizwa ngokuthi ibhodi lesifunda eliphrintiwe ezweni laseChina (ngaphambilini elalibizwa ngokuthi ibhodi lesifunda eliphrintiwe), futhi ngokuvamile libizwa nge-PCB eTaiwan. Amabhodi esekethe abizwa ngokuthi ama-electronic (circuit) substrates e-Japan nama-substrates eNingizimu Korea.

I-PCB iwukusekelwa kwezingxenye ze-elekthronikhi kanye nomthwali wokuxhumana kukagesi wezingxenye ze-elekthronikhi, ikakhulukazi ezisekelayo nezixhumayo. Ngokuhlanzekile ngaphandle, ungqimba lwangaphandle lwebhodi lesifunda lunemibala emithathu: igolide, isiliva, nokubomvu okukhanyayo. Ihlukaniswa ngentengo: igolide libiza kakhulu, isiliva lingelesibili, futhi okubomvu okukhanya kubiza kakhulu. Kodwa-ke, i-wiring ngaphakathi kwebhodi lesifunda ikakhulukazi ithusi elihlanzekile, eliyithusi elingenalutho.

Kuthiwa kusenezinsimbi eziningi eziyigugu ku-PCB. Kubikwa ukuthi, ngokwesilinganiso, i-smart phone ngayinye iqukethe igolide elingu-0.05g, isiliva elingu-0.26g, nethusi elingu-12.6g. Okuqukethwe kwegolide kukhompuyutha ephathekayo kuphindwe ka-10 kuneselula!

Njengosekelo lwezingxenye ze-elekthronikhi, ama-PCB adinga izingxenye zokunamathisela ngaphezulu, futhi ingxenye yongqimba lwethusi iyadingeka ukuze ivezwe ukuze kufakwe i-solder. Lezi zingqimba zethusi eziveziwe zibizwa ngokuthi ama-pads. Amaphedi ngokuvamile anonxande noma ayindilinga anendawo encane. Ngakho-ke, ngemva kokuba imaski ye-solder idwetshiwe, ithusi elilodwa kuphela kuma-pads livezwa emoyeni.

Ithusi elisetshenziswa ku-PCB lifakwa oxidized kalula. Uma ithusi ku-pad i-oxidized, ngeke kube nzima kuphela ukudayiswa, kodwa futhi ukuphikiswa kuzokwanda kakhulu, okuzothinta kakhulu ukusebenza komkhiqizo wokugcina. Ngakho-ke, i-pad ihlanganiswe negolide lensimbi ye-inert, noma indawo engaphezulu ihlanganiswe ungqimba lwesiliva ngokusebenzisa inqubo yamakhemikhali, noma ifilimu ekhethekile yamakhemikhali isetshenziselwa ukumboza ungqimba lwethusi ukuvimbela iphedi ukuthi ingathintani nomoya. Vimbela i-oxidation futhi uvikele i-pad, ukuze iqinisekise isivuno enqubweni ye-solder elandelayo.

1. PCB copper clad laminate
I-Copper clad laminate iyinsimbi emise okwepuleti eyenziwe ngokufaka indwangu ye-fiber yengilazi efaka indwangu noma ezinye izinto zokuqinisa ezine-resin ohlangothini olulodwa noma izinhlangothi zombili ezine-foil yethusi nokucindezela okushisayo.
Thatha ingilazi ye-fiber esekelwe ngendwangu yethusi njengesibonelo. Izinto zayo eziyinhloko zokusetshenziswa ziyi-foil yethusi, indwangu ye-fiber yengilazi, ne-epoxy resin, ebiza cishe u-32%, 29% kanye no-26% wezindleko zomkhiqizo, ngokulandelana.

Imboni yebhodi lesifunda

I-Copper clad laminate iyimpahla eyisisekelo yamabhodi esekethe aphrintiwe, futhi amabhodi esekethe aphrintiwe ayizingxenye ezisemqoka zemikhiqizo eminingi ye-elekthronikhi ukuze kuzuzwe ukuxhumana kwesekethe. Ngokuthuthuka okuqhubekayo kobuchwepheshe, amanye ama-laminates akhethekile we-electronic copper clad angasetshenziswa eminyakeni yamuva. Khiqiza izingxenye ze-elekthronikhi eziphrintiwe. Amakhondakta asetshenziswa kumabhodi esekethe aphrintiwe ngokuvamile enziwa nge-foil encane efana nethusi elicwengekile, okungukuthi, ucwecwe lwethusi ngomqondo omncane.

2. PCB Immersion Gold Circuit Board

Uma igolide nethusi kuthintana ngokuqondile, kuzoba nokusabela ngokomzimba kokufuduka nokusabalalisa kwe-electron (ubudlelwano phakathi komehluko ongaba khona), ngakho ungqimba "lwe-nickel" kufanele lufakwe ugesi njengongqimba, bese igolide lifakwa ugesi. phezulu kwe-nickel, ngakho-ke ngokuvamile siyibiza ngegolide elicwengekileyo, igama layo langempela kufanele libizwe ngokuthi "igolide le-nickel elenziwe nge-electroplated".
Umehluko phakathi kwegolide eliqinile negolide elithambile ukwakheka kongqimba lokugcina lwegolide olunamekwe kulo. Lapho igolide plating, ungakhetha electroplate igolide elihlanzekile noma ingxubevange. Ngenxa yokuthi ubulukhuni begolide elimsulwa buthambile, bubizwa nangokuthi “igolide elithambile” . Ngenxa yokuthi “igolide” lingenza ingxubevange enhle “nge-aluminium”, i-COB izodinga ikakhulukazi ukujiya kwalolu ngqimba lwegolide elimsulwa lapho kwenziwa izintambo ze-aluminium. Ngaphezu kwalokho, uma ukhetha i-electroplated gold-nickel alloy noma i-gold-cobalt alloy, ngoba i-alloy izoba nzima kunegolide elihlanzekile, ibizwa nangokuthi "igolide eliqinile".

Imboni yebhodi lesifunda

Isendlalelo esinamekwe ngegolide sisetshenziswa kakhulu kumaphedi engxenye, iminwe yegolide, kanye nezinhlamvu zokuxhuma zebhodi lesifunda. Amabhodi womama wamabhodi esekethe omakhalekhukhwini asetshenziswa kakhulu amabhodi agqitshwe ngegolide, amabhodi egolide acwilisiwe, amabhodi omama wekhompyutha, amabhodi esekethe alalelwayo namancane edijithali ngokuvamile awawona amabhodi agqitshwe ngegolide.

Igolide igolide langempela. Ngisho noma ungqimba oluncane kakhulu lufakwe, luvele lubala cishe u-10% wezindleko zebhodi lesifunda. Ukusetshenziswa kwegolide njengesendlalelo sokunamathisela kungenye yokusiza ukushisela kanti okunye ukuvimbela ukugqwala. Ngisho nomunwe wegolide we-memory stick osekuyiminyaka eminingana usetshenziswa namanje usalokoza njengakuqala. Uma usebenzisa ithusi, i-aluminium, noma insimbi, izogqwala ngokushesha ibe yinqwaba yezinsalela. Ngaphezu kwalokho, izindleko zepuleti elifakwe ngegolide ziphakeme kakhulu, futhi amandla okushisela ampofu. Ngenxa yokuthi kusetshenziswa inqubo yokufaka i-nickel engena-electroless, inkinga yamadiski amnyama kungenzeka ivele. Isendlalelo se-nickel sizokhipha i-oxidize ngokuhamba kwesikhathi, futhi ukwethembeka kwesikhathi eside nakho kuyinkinga.

3. PCB Immersion Silver Circuit Board
I-Immersion Silver ishibhile kune-Immersion Gold. Uma i-PCB inezidingo zokusebenza zokuxhuma futhi idinga ukunciphisa izindleko, i-Immersion Silver iyisinqumo esihle; kuhlanganiswe nokucaba okuhle kwe-Immersion Silver kanye nokuxhumana, khona-ke inqubo ye-Immersion Silver kufanele ikhethwe.

I-Immersion Silver inezinhlelo zokusebenza eziningi emikhiqizweni yezokuxhumana, ezimotweni, namapheripheral ekhompyutha, futhi inezinhlelo zokusebenza ekwakhiweni kwesignali enesivinini esikhulu. Njengoba i-Immersion Silver inezinto zikagesi ezinhle ezingakwazi ukufana nezinye izindlela zokwelapha, ingasetshenziswa futhi kumasignali amaza aphezulu. I-EMS incoma ukusebenzisa inqubo yesiliva yokucwiliswa ngoba kulula ukuyihlanganisa futhi inokusheka kangcono. Kodwa-ke, ngenxa yokukhubazeka okufana nokungcoliswa kanye ne-solder joint voids, ukukhula kwesiliva lokucwiliswa kuye kwahamba kancane (kodwa akwehlanga).

andisa
Ibhodi lesifunda eliphrintiwe lisetshenziswa njengesithwali sokuxhuma sezingxenye ze-elekthronikhi ezihlanganisiwe, futhi ikhwalithi yebhodi lesifunda izothinta ngokuqondile ukusebenza kwemishini ye-elekthronikhi ehlakaniphile. Phakathi kwabo, ikhwalithi yokucwenga yamabhodi wesifunda ephrintiwe ibaluleke kakhulu. I-Electroplating ingathuthukisa ukuvikeleka, ukuthengiselana, ukuguquguquka nokumelana nokugqoka kwebhodi lesifunda. Enqubweni yokukhiqiza amabhodi wesifunda aphrintiwe, i-electroplating iyisinyathelo esibalulekile. Izinga le-electroplating lihlobene nempumelelo noma ukwehluleka kwayo yonke inqubo kanye nokusebenza kwebhodi lesifunda.

Izinqubo eziyinhloko ze-electroplating ze-pcb ziyi-copper plating, i-tin plating, i-nickel plating, i-golden plating nokunye. I-Copper electroplating iyisicwecwe esiyisisekelo sokuxhunywa kukagesi kwamabhodi wesekethe; i-tin electroplating iyisimo esidingekayo sokukhiqizwa kwamasekhethi anembe kakhulu njengongqimba olulwa nokugqwala ekucubunguleni iphethini; i-nickel electroplating iwukuba i-electroplate isendlalelo se-nickel barrier ebhodini lesifunda ukuvimbela ithusi negolide Mutual dialysis; Igolide le-electroplating livimbela ukudlula kwendawo ye-nickel ukuze kuhlangatshezwane nokusebenza kwe-soldering nokumelana nokugqwala kwebhodi lesifunda.