Amabhodi wesekethe we-multilayer aqukethe izinhlobo eziningi zezendlalelo ezisebenzayo, njengalezi: isendlalelo esivikelayo, isendlalelo sesikrini sikasilika, isendlalelo sesignali, isendlalelo sangaphakathi, njll. Kungakanani okwaziyo ngalezi zendlalelo? Imisebenzi yesendlalelo ngasinye ihlukile, ake sibheke ukuthi kufanele yenzeni imisebenzi yezinga ngalinye!

Isendlalelo esivikelayo: sisetshenziselwa ukuqinisekisa ukuthi izindawo ebhodini lesifunda ezingadingi i-tin plating azithintwa, futhi ibhodi lesifunda le-PCB lenziwa ukuze kuqinisekiswe ukwethembeka kokusebenza kwebhodi lesifunda. Phakathi kwazo, i-Top Namathisela kanye ne-Bottom Namathisela ungqimba lwemaski ephezulu nesendlalelo semaski solder esingezansi, ngokulandelana. I-Top Solder ne-Bottom Solder iyisendlalelo sokuvikela ukunamathisela kwe-solder kanye nosendlalelo sokuvikela ukunamathisela kwe-solder engezansi, ngokulandelanayo.

Isingeniso esiningiliziwe sebhodi lesekhethi ye-PCB enezingqimba eziningi kanye nencazelo yesendlalelo ngasinye
Isendlalelo sesikrini sikasilika - sisetshenziselwa ukuphrinta inombolo ye-serial, inombolo yokukhiqiza, igama lenkampani, iphethini yelogo, njll. yezingxenye ebhodini lesekethe.

Ungqimba lwesignali - lusetshenziselwa ukubeka izingxenye noma izintambo. I-Protel DXP ngokuvamile iqukethe izendlalelo ezimaphakathi ezingu-30, okuyi-Mid Layer1~Mid Layer30, isendlalelo esiphakathi sisetshenziselwa ukuhlela imigqa yesignali, futhi izendlalelo eziphezulu nezingaphansi zisetshenziselwa ukubeka izingxenye noma ithusi.

Isendlalelo sangaphakathi - esisetshenziswa njengesendlalelo somzila wesignali, i-Protel DXP iqukethe izendlalelo zangaphakathi ezingu-16.

Zonke izinto ze-PCB zabakhiqizi be-PCB abangochwepheshe kufanele zibuyekezwe ngokucophelela futhi zigunyazwe umnyango wobunjiniyela ngaphambi kokusika nokukhiqiza. Izinga lokudlula lebhodi ngalinye liphezulu ngokufika ku-98.6%, futhi yonke imikhiqizo isiphumelele isitifiketi semvelo se-RROHS kanye ne-United States UL nezinye izitifiketi ezihlobene.