1. Ngaphambi kokushisela, sebenzisa i-flux ku-pad futhi uyiphathe nge-soldering iron ukuvimbela iphedi ukuthi ingafakwa kahle ithini noma i-oxidized, okubangela ubunzima ekuhlanganiseni. Ngokuvamile, i-chip ayidingi ukuphathwa.
2. Sebenzisa ama-tweezers ukubeka ngokucophelela i-chip ye-PQFP ebhodini le-PCB, uqaphele ukuthi ungalimazi izikhonkwane. Iqondanise namaphedi futhi uqiniseke ukuthi i-chip ibekwe ngendlela efanele. Lungisa izinga lokushisa lensimbi elithambile libe ngaphezu kuka-300 degrees Celsius, cwilisa isihloko se-soldering iron ngenani elincane le-solder, sebenzisa ithuluzi ukucindezela i-chip eqondanisiwe, bese wengeza inani elincane lokuguquguquka kuma-diagonal amabili. izikhonkwane, namanje Cindezela phansi ku-chip bese uthengisa izikhonkwane ezimbili ezibekwe ngokudayagonali ukuze i-chip igxilise futhi ingakwazi ukunyakaza. Ngemva kokuhlanganisa amakhona aphambene, hlola kabusha indawo ye-chip ukuze iqondaniswe. Uma kunesidingo, ingalungiswa noma isuswe futhi iqondiswe kabusha ebhodini le-PCB.
3. Uma uqala ukudayisa zonke izikhonkwane, engeza i-solder esihlokweni se-soldering iron bese ugcoba zonke izikhonkwane nge-flux ukuze ugcine izikhonkwane zimanzi. Thinta ichopho le-ayina e-solder kuze kube sekugcineni kwephini ngalinye ku-chip uze ubone i-solder igeleza kuphini. Lapho ushisela, gcina ichopho le-soldering iron lihambisana nephinikhodi edayiswayo ukuze kuvinjelwe ukunqwabelana ngenxa yokudayiswa ngokweqile.
4. Ngemuva kokuhlanganisa zonke izikhonkwane, cwilisa zonke izikhonkwane nge-flux ukuhlanza i-solder. Sula i-solder eningi lapho kudingeka khona ukuze ususe noma yiziphi izikhindi nokugqagqana. Okokugcina, sebenzisa ama-tweezers ukuze uhlole ukuthi kukhona yini ukusoda okungamanga. Ngemuva kokuthi ukuhlolwa kuqediwe, susa ukugeleza ebhodini lesifunda. Gcoba ibhulashi eliqinile etshwaleni bese usula ngokucophelela ngokuhambisana nezikhonkwane kuze kuphele ukugeleza kwamanzi.
5. Izingxenye ze-SMD resistor-capacitor kulula ukuzithengisa. Ungaqala ukubeka ithini ekuhlanganyeleni kwe-solder, bese ubeka umkhawulo owodwa wengxenye, sebenzisa ama-tweezers ukuze ubambe ingxenye, futhi ngemva kokuhlanganisa umkhawulo owodwa, hlola ukuthi ibekwe ngendlela efanele yini; Uma iqondanisiwe, weld omunye umkhawulo.
Ngokwesakhiwo, lapho ubukhulu bebhodi lesifunda likhulu kakhulu, nakuba ukushisela kulula ukulawula, imigqa ephrintiwe izoba yinde, i-impedance izokwanda, ikhono lokulwa nomsindo lizokwehla, futhi izindleko zizokhula; uma kuncane kakhulu, ukuchithwa kokushisa kuzokwehla, ukushisela kuyoba nzima ukulawula, futhi imigqa eseduze izovela kalula. Ukuphazamiseka okuhlanganyelwe, okufana nokuphazamiseka kazibuthe kusuka kumabhodi esekethe. Ngakho-ke, umklamo webhodi le-PCB kufanele uthuthukiswe:
(1) Nciphisa ukuxhumana phakathi kwezingxenye zemvamisa ephezulu futhi unciphise ukuphazamiseka kwe-EMI.
(2) Izingxenye ezinesisindo esisindayo (ezingaphezu kwama-20g) kufanele zilungiswe kubakaki bese zishiselwa.
(3) Izinkinga zokukhipha ukushisa kufanele zicatshangelwe ezingxenyeni zokushisisa ukuze kuvinjelwe amaphutha nokusebenza kabusha ngenxa ye-ΔT enkulu endaweni yengxenye. Izingxenye ezizwelayo ezishisayo kufanele zigcinwe kude nemithombo yokushisa.
(4) Izingxenye kufanele zihlelwe ngendlela efanayo ngangokunokwenzeka, engeyona nje kuphela enhle kodwa futhi kulula ukuyishisela, futhi elungele ukukhiqizwa ngobuningi. Ibhodi lesifunda lidizayinelwe ukuthi libe unxande ongu-4:3 (okukhethwa kukho). Ungabi nezinguquko ezingazelelwe kububanzi bezintambo ukuze ugweme ukungaqhubeki kwezintambo. Lapho ibhodi lesifunda lishisa isikhathi eside, i-foil yethusi kulula ukunweba nokuwa. Ngakho-ke, ukusetshenziswa kwezindawo ezinkulu ze-foil yethusi kufanele kugwenywe.