Ibhodi yesifunda lizokhombisa ukuthathwa kabi ngesikhathi sokukhiqizwa kweSMT. Ngokuvamile, i-tinning engesihle ihlobene nokuhlanzeka kwe-PCB engaphezulu. Uma kungekho ngcolile, kuzoba khona ngokuyisisekelo akukho lutho olubi. Okwesibili, uTinse lapho uFlux uqobo lubi, izinga lokushisa nokunye. Ngakho-ke yini ukuvezwa okuyinhloko kwezinkinga ezijwayelekile zikagesi zikagesi ekukhiqizeni i-Circuit Board Production nasekucutshungulweni? Ungayixazulula kanjani le nkinga ngemuva kokwethula?
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2. Kukhona ama-flakes ebusweni bebhodi yesekethe ngaphandle kwe-tin, futhi ungqimba we-plupating endaweni yebhodi ungcolisa ukungcola.
3. I-coating ephezulu engaba khona inzima, kukhona into evuthayo, futhi kukhona ama-flakes ebusweni bebhodi ngaphandle kwe-tin.
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I-5. Kunemiphetho ebonakalayo ekhanyayo emaphethelweni ezimbobo ezinotshani eziphansi, futhi ukuhlanganisa okuphezulu kunzima futhi kushiswe.
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7. Ibhodi le-PCB aliqinisekisiwe ukufeza izinga lokushisa noma isikhathi ngesikhathi senqubo yokuthengisa, noma i-flux ayisetshenziswa kahle.
8. Kunokungcoliswa kwezindawo zokuphikisana ethafeni elingaphezulu kwebhodi yesekethe, noma izinhlayiya zokugaya zishiyelwa ebusweni besifunda ngesikhathi senqubo yokukhiqiza.
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