Ibhodi lesifunda lizokhombisa ukuthayela okungekuhle ngesikhathi sokukhiqizwa kwe-SMT. Ngokuvamile, ukuthayela okungalungile kuhlobene nokuhlanzeka kwendawo engenalutho ye-PCB. Uma kungekho ukungcola, ngeke kube khona ukubopha okungalungile. Okwesibili, i-tinning Lapho i-flux ngokwayo imbi, izinga lokushisa njalonjalo. Ngakho-ke yikuphi ukubonakaliswa okuyinhloko kokukhubazeka okujwayelekile kwamathini kagesi ekukhiqizeni nasekucutshungulweni kwebhodi lesifunda? Indlela yokuxazulula le nkinga ngemva kokuyethula?
1. I-tin surface ye-substrate noma izingxenye i-oxidized futhi i-copper ibuthuntu.
2. Kukhona ama-flakes ebusweni bebhodi lesifunda ngaphandle kwe-tin, futhi ungqimba lokunamathisela endaweni yebhodi lunokungcola okuyingxenye.
3. Ukugqoka okuphezulu okunamandla kunzima, kukhona into evuthayo, futhi kukhona ama-flakes ebusweni bebhodi ngaphandle kwe-tin.
4. Ingaphezulu lebhodi lesifunda linamathele ngamafutha, ukungcola nezinye izinto ezihlukahlukene, noma kukhona amafutha e-silicone asele.
5. Kukhona imiphetho ekhanyayo ecacile emaphethelweni emigodi engase ibe namandla aphansi, futhi ukugqoka okuphezulu okunamandla kuqinile futhi kushile.
6. Ukugqoka ngakolunye uhlangothi kuqedile, futhi ukumboza ngakolunye uhlangothi kumpofu, futhi kukhona umkhawulo okhanyayo ocacile onqenqemeni lwembobo ephansi engase ibe khona.
7. Ibhodi le-PCB aliqinisekisiwe ukuhlangabezana nezinga lokushisa noma isikhathi phakathi nenqubo yokudayiswa, noma i-flux ayisetshenziswanga ngendlela efanele.
8. Kukhona ukungcola okuyingxenye ekufakweni ebusweni bebhodi lesifunda, noma izinhlayiya zokugaya zishiywe ebusweni besifunda ngesikhathi sokukhiqizwa kwe-substrate.
9. Indawo enkulu enamandla aphansi ayikwazi ukugqitshwa ngothayela, futhi ingaphezulu lebhodi lesifunda linombala omnyama ocashile obomvu noma obomvu, onembozo ephelele ngakolunye uhlangothi kanye nembobo empofu ngakolunye.