Ukuvala imbobo nge-electroplated kuyinqubo evamile yokukhiqiza ibhodi lesifunda ephrintiwe esetshenziselwa ukugcwalisa nokuvala emigodini (ngemigodi) ukuze kuthuthukiswe ukuqhutshwa kukagesi nokuvikelwa. Enqubweni yokukhiqiza ibhodi lesifunda ephrintiwe, imbobo yokudlula iyisiteshi esisetshenziselwa ukuxhuma izingqimba zesekethe ezihlukene. Inhloso yokuvala uphawu nge-electroplating ukwenza udonga lwangaphakathi lwembobo edlulayo lugcwale izinto eziqhutshwayo ngokwenza ungqimba lwensimbi noma ukufakwa kwezinto ezibonakalayo ngaphakathi kwembobo edlulayo, ngaleyo ndlela kuthuthukiswe ukuqhutshwa kukagesi futhi kunikeze umphumela wokuvala ongcono.
1.Inqubo yokuvala uphawu yebhodi lesifunda ilethe izinzuzo eziningi enqubweni yokukhiqiza umkhiqizo:
a)Thuthukisa ukuthembeka kwesekethe: inqubo yokuvala uphawu ye-electroplating ingavala ngempumelelo izimbobo futhi ivimbele ukujikeleza okufushane kukagesi phakathi kwezingqimba zensimbi ebhodini lesekethe. Lokhu kusiza ukuthuthukisa ukuthembeka nokuzinza kwebhodi futhi kunciphisa ingozi yokuhluleka kwesifunda kanye nokulimala
b)Thuthukisa ukusebenza kwesekethe: Ngenqubo yokuvala uphawu lwe-electroplating, ukuxhumana kwesekethe okungcono kanye nokuhamba kukagesi kungafinyelelwa. Imbobo yokugcwalisa i-Electroplate inganikeza uxhumano lwesifunda oluzinzile futhi olunokwethenjelwa, ukunciphisa inkinga yokulahlekelwa kwesignali kanye nokungahambisani kahle kwe-impedance, futhi ngaleyo ndlela kuthuthukise ikhono lokusebenza kwesifunda kanye nokukhiqiza.
c) Thuthukisa ikhwalithi yokushisela: inqubo yokufaka uphawu ye-electroplating sealing ingathuthukisa ikhwalithi yokushisela. Inqubo yokuvala ingakha indawo eyisicaba, ebushelelezi ngaphakathi kwembobo, inikeze isisekelo esingcono sokushisela. Lokhu kungathuthukisa ukuthembeka namandla okushisela futhi kunciphise ukuvela kweziphambeko zokushisela kanye nezinkinga zokushisela ezibandayo.
d)Qinisa amandla emishini: Inqubo yokuvala uphawu nge-electroplating ingathuthukisa amandla emishini nokuqina kwebhodi lesifunda. Ukugcwalisa izimbobo kungandisa ukushuba nokuqina kwebhodi lesifunda, kuthuthukise ukumelana kwayo nokugoba nokudlidliza, futhi kunciphise ingozi yokulimala kwemishini nokuphuka ngesikhathi sokusetshenziswa.
e) Ukuhlanganisa nokufaka okulula: inqubo yokufaka uphawu ye-electroplating yebhodi lesifunda ingenza inqubo yokuhlanganisa nokufaka ibe lula futhi isebenze kahle. Izimbobo zokugcwalisa kunikeza indawo ezinzile kanye nezindawo zokuxhuma, okwenza ukufakwa komhlangano kube lula futhi kunembe kakhudlwana. Ngaphezu kwalokho, ukuvala imbobo ye-electroplated kunikeza isivikelo esingcono futhi kunciphisa umonakalo nokulahlekelwa izingxenye ngesikhathi sokufakwa.
Ngokuvamile, inqubo yokuvala uphawu yebhodi lesifunda ingathuthukisa ukwethembeka kwesifunda, ithuthukise ukusebenza kwesifunda, ithuthukise ikhwalithi yokushisela, iqinise amandla emishini, futhi yenze kube lula ukuhlanganisa nokufaka. Lezi zinzuzo zingathuthukisa kakhulu ikhwalithi yomkhiqizo nokuthembeka, kuyilapho kunciphisa ubungozi kanye nezindleko enqubweni yokukhiqiza
2.Nakuba inqubo yokuvala uphawu yebhodi lesifunda inezinzuzo eziningi, kukhona futhi izingozi ezingaba khona noma ukushiyeka, okuhlanganisa okulandelayo:
f) Izindleko ezikhulisiwe: Inqubo yokuvala imbobo yokunamathisela ebhodini idinga izinqubo ezengeziwe nezinto zokwakha, njengezinto zokugcwalisa kanye namakhemikhali asetshenziswa enqubweni yokucwenga. Lokhu kungakhuphula izindleko zokukhiqiza futhi kube nomthelela kuwo wonke umnotho womkhiqizo
g) Ukuthembeka kwesikhathi eside: Nakuba inqubo yokufaka uphawu lwe-electroplating ingathuthukisa ukwethembeka kwebhodi lesifunda, esimweni sokusetshenziswa kwesikhathi eside kanye nezinguquko zemvelo, izinto zokugcwalisa kanye ne-coating zingathintwa yizici ezifana nokwanda okushisayo nokubanda. ukufinyela, umswakama, ukugqwala nokunye. Lokhu kungaholela entweni yokugcwalisa okuxekethile, ukuwa, noma ukulimala kokucwenga, kunciphisa ukuthembeka kwebhodi.
h)3Inqubo eyinkimbinkimbi: Inqubo yokuvala uphawu ye-electroplating yebhodi lesifunda iyinkimbinkimbi kunenqubo evamile. Kubandakanya ukulawulwa kwezinyathelo eziningi kanye nemingcele efana nokulungiselela imbobo, ukugcwalisa ukukhethwa nokwakhiwa kwezinto ezibonakalayo, ukulawulwa kwenqubo ye-electroplating, njll. Lokhu kungase kudinge amakhono enqubo ephakeme kanye nemishini yokuqinisekisa ukunemba kwenqubo nokuzinza.
i)Khulisa inqubo: khulisa inqubo yokuvala, futhi wandise ifilimu yokuvimba izimbobo ezinkudlwana ukuze uqinisekise umphumela wokuvala. Ngemuva kokuvala imbobo, kuyadingeka ukufoshela ithusi, ukugaya, ukupholisha nezinye izinyathelo zokuqinisekisa ukugcwala kwendawo yokuvala.
j)Umthelela kwezemvelo: Amakhemikhali asetshenziswa enqubweni yokuvalwa kwe-electroplating angase abe nomthelela othile endaweni ezungezile. Isibonelo, amanzi angcolile kanye nemfucumfucu ewuketshezi ingase yenziwe ngesikhathi se-electroplating, edinga ukwelashwa nokwelashwa okufanele. Ngaphezu kwalokho, kungase kube nezingxenye ezilimaza imvelo ezintweni zokugcwalisa ezidinga ukulawulwa kahle futhi zilahlwe.
Uma ucubungula inqubo yokuvala uphawu lwe-electroplating yebhodi lesifunda, kuyadingeka ukuthi ucubungule kabanzi lezi zingozi ezingaba khona noma ukushiyeka, bese ukala okuhle nokubi ngokuya ngezidingo ezithile kanye nezimo zohlelo lokusebenza. Lapho kwenziwa inqubo, ukulawulwa kwekhwalithi okufanele kanye nezinyathelo zokulawulwa kwemvelo kubalulekile ukuze kuqinisekiswe imiphumela yenqubo engcono kakhulu nokwethembeka komkhiqizo.
3.Amazinga okwamukela
Ngokwendinganiso: IPC-600-J3.3.20: Ipulagi yethusi efakwe i-electroplated microconduction (impumputhe futhi yangcwatshwa)
I-Sag and bulge: Izidingo zeqhubu (iqhubu) kanye nokudangala (umgodi) wembobo encane eyimpumputhe izonqunywa amaqembu ahlinzekayo kanye nesidingo ngokuxoxisana, futhi asikho isidingo sokuqubuka nokudangala kwe-micro ematasatasa. -ngembobo yethusi. Amadokhumenti athile okuthengwa kwekhasimende noma amazinga ekhasimende njengesisekelo sokwahlulela.
