-Kusuka emhlabeni we-pcb,
Ukusha kwezinto, okwaziwa nangokuthi ukuncipha kwelangabi, ukuzicisha, ukumelana nelangabi, ukumelana nomlilo, ukumelana nomlilo, ukuvutha nokunye ukuvutha, ukuhlola ikhono lezinto zokumelana nokusha.
Isampula lento evuthayo ibaswa ngelangabi elihlangabezana nezimfuneko, futhi ilangabi liyasuswa ngemva kwesikhathi esishiwo.Izinga lokuvutha liyahlolwa ngokuya ngezinga lokusha lesampula.Kunamazinga amathathu.Indlela yokuhlola evundlile yesampula ihlukaniswe yaba yi-FH1, FH2, FH3 ileveli yesithathu, indlela yokuhlola eqondile ihlukaniswe yaba yi-FV0, FV1, VF2.
Ibhodi le-PCB eliqinile lihlukaniswe ngebhodi le-HB nebhodi le-V0.
Ishidi le-HB linokuncipha komlilo okuphansi futhi lisetshenziselwa kakhulu amabhodi anohlangothi olulodwa.
Ibhodi ye-VO inokubambezeleka komlilo okuphezulu futhi isetshenziswa kakhulu kumabhodi anezinhlangothi ezimbili nanezendlalelo eziningi.
Lolu hlobo lwebhodi le-PCB elihlangabezana nezidingo zesilinganiso somlilo we-V-1 liba yibhodi le-FR-4.
I-V-0, V-1, kanye ne-V-2 amamaki angangeni emlilweni.
Ibhodi lesifunda kufanele likwazi ukumelana nelangabi, alikwazi ukushisa ezingeni elithile lokushisa, kodwa lingathanjiswa kuphela.Iphuzu lokushisa ngalesi sikhathi libizwa ngokuthi izinga lokushisa lokushintsha kwengilazi (iphuzu le-Tg), futhi leli nani lihlobene nokuzinza kwe-dimensional yebhodi le-PCB.
Liyini ibhodi lesekhethi ye-Tg PCB ephezulu kanye nezinzuzo zokusebenzisa i-Tg PCB ephezulu?
Lapho izinga lokushisa lebhodi eliphrintiwe le-Tg eliphakeme likhuphukela endaweni ethile, i-substrate izoshintsha kusukela "esimweni sengilazi" kuya "kwisimo senjoloba".Izinga lokushisa ngalesi sikhathi libizwa ngokuthi izinga lokushisa le-glass transition (Tg) lebhodi.Ngamanye amazwi, i-Tg izinga lokushisa eliphakeme kakhulu lapho i-substrate igcina ukuqina.
Yiziphi izinhlobo ezithile zamabhodi e-PCB?
Ihlukaniswe ngezinga lebanga ukusuka phansi kuye phezulu kanje:
94HB - 94VO - 22F - CEM-1 - CEM-3 - FR-4
Imininingwane imi kanje:
I-94HB: amakhadibhodi ajwayelekile, angashisi umlilo (izinto ezisezingeni eliphansi kakhulu, i-die punching, ayikwazi ukusetshenziswa njengebhodi lokuphakela amandla)
94V0: Ikhadibhodi Elibushelelezi Ilangabi (Die Punching)
I-22F: Ibhodi ye-fiber yengilazi enohlangothi olulodwa (i-die punching)
I-CEM-1: Ibhodi le-fiberglass elinohlangothi olulodwa (ukubhola ngekhompyutha kuyadingeka, hhayi ukubhoboza ukufa)
I-CEM-3: Ibhodi le-fibre yengilazi enezinhlangothi ezimbili (ngaphandle kwekhadibhodi elinamaceleni amabili, iyinto ephansi yokugcina yebhodi elinamacele amabili, elula
Le nto ingasetshenziselwa amaphaneli aphindwe kabili, ashibhe ngo-5~10 yuan/imitha yesikwele kune-FR-4)
I-FR-4: Ibhodi ye-fiberglass enezinhlangothi ezimbili
Ibhodi lesifunda kufanele likwazi ukumelana nelangabi, alikwazi ukushisa ezingeni elithile lokushisa, kodwa lingathanjiswa kuphela.Iphuzu lokushisa ngalesi sikhathi libizwa ngokuthi izinga lokushisa lokushintsha kwengilazi (iphuzu le-Tg), futhi leli nani lihlobene nokuzinza kwe-dimensional yebhodi le-PCB.
Liyini ibhodi lesekhethi ye-Tg PCB ephezulu kanye nezinzuzo zokusebenzisa i-Tg PCB ephezulu.Lapho izinga lokushisa likhuphuka endaweni ethile, i-substrate izoshintsha isuka "esimweni sengilazi" ibe "isimo senjoloba".
Izinga lokushisa ngaleso sikhathi libizwa ngokuthi izinga lokushisa le-glass transition (Tg) lepuleti.Ngamanye amazwi, i-Tg izinga lokushisa eliphakeme kakhulu (°C) lapho i-substrate igcina ukuqina.Okusho ukuthi, izinto ezijwayelekile ze-PCB substrate azikhiqizi kuphela ukuthambisa, ukuguqulwa, ukuncibilika nezinye izinto emazingeni okushisa aphezulu, kodwa futhi zibonisa ukwehla okukhulu kwezici zemishini nezikagesi (ngicabanga ukuthi awufuni ukubona ukuhlukaniswa kwamabhodi we-PCB). futhi ubone lesi simo emikhiqizweni yakho.
Ipuleti le-Tg elivamile lingaphezu kwama-degree angu-130, i-Tg ephakeme ngokuvamile ingaphezu kwama-degree angu-170, kanti i-Tg emaphakathi icishe ibe ngaphezu kwama-degree angu-150.
Ngokuvamile amabhodi aphrintiwe e-PCB ane-Tg ≥ 170°C abizwa ngokuthi amabhodi aphrintiwe we-Tg aphezulu.
Njengoba i-Tg ye-substrate ikhula, ukumelana nokushisa, ukumelana nomswakama, ukumelana namakhemikhali, ukuzinza nezinye izici zebhodi eliphrintiwe kuzothuthukiswa futhi kuthuthukiswe.Ukuphakama kwevelu ye-TG, kuba ngcono ukumelana nezinga lokushisa kwebhodi, ikakhulukazi kunqubo engenamthofu, lapho izicelo eziphezulu ze-Tg zivame kakhulu.
I-High Tg isho ukumelana nokushisa okuphezulu.Ngokuthuthuka okusheshayo kwemboni ye-elekthronikhi, ikakhulukazi imikhiqizo ye-elekthronikhi emelwe amakhompyutha, ukuthuthukiswa kokusebenza okuphezulu kanye nama-multilayer aphezulu kudinga ukumelana nokushisa okuphezulu kwe-PCB substrate materials njengesiqinisekiso esibalulekile.Ukuvela nokuthuthukiswa kobuchwepheshe bokukhweza obuphezulu obumelelwe i-SMT ne-CMT kwenze ama-PCB ahluka kakhulu kusukela ekusekelweni kokumelana nokushisa okuphezulu kwama-substrates ngokuvula indawo encane, izintambo ezinhle, kanye nokuncipha.
Ngakho-ke, umehluko phakathi kwe-FR-4 evamile kanye ne-Tg FR-4 ephezulu: isesimweni esishisayo, ikakhulukazi ngemva kokumuncwa komswakama.
Ngaphansi kokushisa, kunomehluko emandleni emishini, ukuzinza kwe-dimensional, ukunamathela, ukumuncwa kwamanzi, ukubola okushisayo, nokwanda kokushisa kwezinto.Imikhiqizo ye-High Tg ngokusobala ingcono kunezinto ezijwayelekile ze-PCB substrate.
Eminyakeni yamuva, inani lamakhasimende adinga ukukhiqizwa kwamabhodi aphrintiwe we-Tg aphezulu liye landa unyaka nonyaka.
Ngokuthuthuka kanye nenqubekelaphambili eqhubekayo yobuchwepheshe be-elekthronikhi, izidingo ezintsha zihlale zibekwe phambili ezintweni eziphrintiwe zebhodi lesifunda, ngaleyo ndlela kuthuthukiswe ukuthuthukiswa okuqhubekayo kwamazinga e-copper clad laminate.Njengamanje, izindinganiso eziyinhloko zezinto ze-substrate zimi kanje.
① Amazinga kazwelonke Njengamanje, izindinganiso kazwelonke zezwe lami zokuhlelwa kwezinto ze-PCB zama-substrates ahlanganisa i-GB/
I-T4721-47221992 ne-GB4723-4725-1992, amazinga e-copper clad laminate e-Taiwan, e-China angamazinga e-CNS, asekelwe ku-Japanese JIs ejwayelekile futhi akhishwe ngo-1983.
② Amanye amazinga kazwelonke ahlanganisa: amazinga e-JIS yaseJapane, i-American ASTM, i-NEMA, i-MIL, i-IPc, i-ANSI, izindinganiso ze-UL, amazinga e-British Bs, amazinga e-German DIN kanye ne-VDE, amazinga e-French NFC kanye ne-UTE, kanye namazinga e-Canadian CSA Standards, i-AS standard yase-Australia, yangaphambili Izinga le-FOCT leSoviet Union, izinga lamazwe ngamazwe le-IEC, njll.
Abahlinzeki bezinto zokuqala zokuklama ze-PCB bavamile futhi bavame ukusetshenziswa: I-Shengyi \ Jiantao \ International, njll.
● Yamukela amadokhumenti: i-protel autocad powerpcb orcad gerber noma ibhodi lamakhophi ebhodi langempela, njll.
● Izinhlobo zeshidi: CEM-1, CEM-3 FR4, izinto ze-TG eziphezulu;
● Ubukhulu bosayizi webhodi: 600mm*700mm (24000mil*27500mil)
● Ugqinsi lwebhodi lokucubungula: 0.4mm-4.0mm (15.75mil-157.5mil)
● Inani eliphakeme kakhulu lezendlalelo zokucubungula: 16Layers
● Ugqinsi lwesendlalelo se-copper: 0.5-4.0(oz)
● Iqedile ukubekezelela ukujiya kwebhodi: +/-0.1mm(4mil)
● Ukubekezelela usayizi wokwakha: ukugaya ikhompuyutha: 0.15mm (6mil) ipuleti le-die punching: 0.10mm (4mil)
● Ububanzi/isikhala somugqa omncane: 0.1mm (4mil) Ikhono lokulawula ububanzi bomugqa: <+-20%
● Ubuncane bembobo ububanzi bomkhiqizo oqediwe: 0.25mm (10mil)
Ubuncane bembobo yokubhoboza ububanzi bomkhiqizo oqediwe: 0.9mm (35mil)
Kuqediwe ukubekezelela imbobo: PTH: +-0.075mm(3mil)
I-NPTH: +-0.05mm(2mil)
● Ugqinsi lwethusi lwembobo eqediwe: 18-25um (0.71-0.99mil)
● Isikhala sesichibi se-SMT esincane: 0.15mm (6mil)
● I-Surface coating: igolide lokucwiliswa ngamakhemikhali, isifutho sikathayela, igolide eligcwele i-nickel (amanzi/igolide elithambile), iglue eluhlaza okwesibhakabhaka sesikrini sikasilika, njll.
● Ubukhulu bemaski ye-solder ebhodini: 10-30μm (0.4-1.2mil)
● Amandla okuxebula: 1.5N/mm (59N/mil)
● Ukuqina kwemaski ye-solder: >5H
● Umthamo wembobo yepulaki yemaski yeSolder: 0.3-0.8mm (12mil-30mil)
● I-Dielectric constant: ε= 2.1-10.0
● Ukumelana ne-insulation: 10KΩ-20MΩ
● Ukungasebenzi kahle kwesici: 60 ohm±10%
● Ukushaqeka okushisayo: 288℃, 10 sec
● I-Warpage yebhodi eliqediwe: <0.7%
● Isicelo somkhiqizo: okokusebenza kokuxhumana, izinto zikagesi zezimoto, izinsimbi, isistimu yokumisa umhlaba wonke, ikhompuyutha, i-MP4, ukunikezwa kwamandla kagesi, izinto zikagesi zasekhaya, njll.