I-PCB aluminium substrate inamagama amaningi, i-aluminium cladding, i-aluminium PCB, ibhodi le-metal clad ephrintiwe yesifunda (MCPCB), i-PCB ephethe ukushisa, njll. Inzuzo ye-PCB aluminium substrate iwukuthi ukuchithwa kokushisa kungcono kakhulu kunesakhiwo esijwayelekile se-FR-4, futhi i-dielectric esetshenziswayo ngokuvamile Izikhathi ezi-5 kuya kweziyi-10 ukuqhutshwa kokushisa kwengilazi ye-epoxy evamile, futhi inkomba yokudlulisa ukushisa yengxenye eyodwa kweshumi yogqinsi iphumelela kakhulu kune-PCB yendabuko eqinile. Ake siqonde izinhlobo ze-PCB aluminium substrates ngezansi.

1. I-aluminium substrate eguquguqukayo

Enye yentuthuko yakamuva ezintweni ze-IMS ama-dielectrics aguquguqukayo. Lezi zinto zinganikeza ukufakwa okuhle kakhulu kagesi, ukuguquguquka kanye ne-thermal conductivity. Uma isetshenziswa ezintweni eziguquguqukayo ze-aluminium ezifana ne-5754 noma okunye okunjalo, imikhiqizo ingakhiwa ukuze kuzuzwe ukubunjwa okuhlukahlukene nama-engeli, okungaqeda amadivaysi okulungisa abizayo, izintambo nezixhumi. Nakuba lezi zinto zivumelana nezimo, zenzelwe ukugoba endaweni futhi zihlale endaweni.

2. I-aluminium ehlanganisiwe ye-aluminium substrate
Kusakhiwo se-IMS "esihlanganisiwe", "izingxenye ezingaphansi" zezinto ezingezona ezishisayo zicutshungulwa ngokuzimela, bese kuthi ama-Amitron Hybrid IMS PCB ahlanganiswe ne-aluminium substrate ngezinto ezishisayo. Isakhiwo esivame kakhulu ungqimba olu-2 noma i-4-layer subassembly eyenziwe yendabuko ye-FR-4, engahlanganiswa ne-aluminium substrate nge-thermoelectric ukusiza ukuqeda ukushisa, ukwandisa ukuqina, nokusebenza njengesihlangu. Ezinye izinzuzo zifaka:
1. Izindleko eziphansi kunazo zonke izinto ezishisayo ezishisayo.
2. Nikeza ukusebenza okungcono okushisayo kunemikhiqizo ejwayelekile ye-FR-4.
3. Amasinki okushisa abizayo kanye nezinyathelo zokuhlanganisa ezihlobene zingasuswa.
4. Ingasetshenziswa ezinhlelweni ze-RF ezidinga izici zokulahleka kwe-RF zongqimba olungaphezulu lwe-PTFE.
5. Sebenzisa amafasitela ezingxenye ku-aluminium ukuze kufakwe izingxenye zembobo, okuvumela izixhumi nezintambo ukuthi zidlule isixhumi ku-substrate ngenkathi ushisela amakhona ayindilinga ukuze udale uphawu ngaphandle kwesidingo sama-gaskets akhethekile noma amanye ama-adaptha abizayo.

Ezintathu, i-aluminium substrate ye-multilayer
Emakethe kagesi esebenza kahle kakhulu, ama-IMS PCB amaningi enziwe ngama-multilayer thermally conductive dielectrics. Lezi zakhiwo zinezingqimba zesekhethi eyodwa noma ngaphezulu ezigqitshwe ku-dielectric, futhi ama-blind vias asetshenziswa njengezindlela ezishisayo noma izindlela zesiginali. Nakuba imiklamo yongqimba olulodwa ibiza kakhulu futhi ingasebenzi kahle kakhulu ekudluliseni ukushisa, ihlinzeka ngesixazululo sokupholisa esilula nesisebenzayo semiklamo eyinkimbinkimbi.
Okwesine, i-aluminium substrate ephuma emgodini
Esakhiweni esiyinkimbinkimbi kunazo zonke, ungqimba lwe-aluminium lungakha "umgogodla" wesakhiwo esishisayo se-multilayer. Ngaphambi kwe-lamination, i-aluminium i-electroplated futhi igcwaliswe nge-dielectric kusengaphambili. Izinto ezishisayo noma izingxenye ezincane zingafakwa ezinhlangothini zombili ze-aluminium kusetshenziswa izinto zokunamathela ezishisayo. Uma i-laminated, umhlangano ophelile ufana ne-substrate ye-multilayer ye-aluminium yendabuko ngokubhoboza. Kufakwe emigodini kudlula izikhala ku-aluminium ukuze kugcinwe ukufakwa kukagesi. Kungenjalo, umgogodla wethusi ungavumela ukuxhuma ugesi okuqondile kanye nama-vias avikelayo.