I-Multilayer PCBikakhulukazi yakhiwe ucwecwe lwethusi, prepreg, kanye core board. Kunezinhlobo ezimbili zezakhiwo ze-lamination, okungukuthi, ukwakheka kwe-lamination ye-copper foil kanye nebhodi eliwumgogodla kanye nesakhiwo se-lamination sebhodi eliwumgogodla kanye nebhodi eliwumgogodla. I-foil yethusi kanye ne-core board lamination structure iyathandwa, futhi isakhiwo se-core board lamination singasetshenziselwa amapuleti akhethekile (afana ne-Rogess44350, njll.) amabhodi anezingqimba eziningi namabhodi esakhiwo se-hybrid.

1.Izidingo zedizayini zesakhiwo sokucindezela Ukuze kuncishiswe i-warpage ye-PCB, ukwakheka kwe-PCB lamination kufanele kuhlangabezane nezidingo ze-symmetry, okungukuthi, ubukhulu befoyili yethusi, uhlobo nogqinsi lwesendlalelo se-dielectric, uhlobo lokusabalalisa iphethini. (ungqimba lwesifunda, ungqimba lwendiza), i-lamination, njll. okuhlobene ne-PCB eqondile ye-Centrosymmetric,

2.I-conductor yethusi ukujiya

(1) Ugqinsi lwethusi lekhondatha elikhonjiswe emdwebeni ubukhulu bekhopha eliqediwe, okungukuthi, ugqinsi longqimba lwethusi olungaphandle luwugqinsi lwecwecwe lethusi elingaphansi kanye nogqinsi longqimba lwe-electroplating, kanye nogqinsi. ongqimbeni lwangaphakathi lwethusi ukujiya kongqimba lwangaphakathi lwecwecwe lethusi elingaphansi. Emdwebeni, ugqinsi lwethusi longqimba lwangaphandle luphawulwa ngokuthi "ugqinsi lwe-copper foil + plating, futhi ugqinsi lwethusi olungaphakathi luphawulwe ngokuthi "ugqinsi lwe-copper foil".

(2) Izinyathelo zokuqapha zokusetshenziswa kwe-2OZ nangaphezulu kwethusi eliwugqinsi elingaphansi Kumelwe kusetshenziswe ngokulinganayo kuso sonke isitaki.

Gwema ukuzibeka phezu kwezingqimba ze-L2 ne-Ln-2 ngangokunokwenzeka, okungukuthi, izingqimba zangaphandle zesibili ze-Top and Bottom, ukugwema izindawo ze-PCB ezingalingani nezishwabene.

3. Izidingo zesakhiwo esicindezelayo

Inqubo ye-lamination iyinqubo eyinhloko ekukhiqizeni i-PCB. Lapho inani lama-laminations lithe xaxa, kubi kakhulu ukunemba kokuqondanisa kwemigodi kanye nediski, futhi kubi kakhulu ukuguqulwa kwe-PCB, ikakhulukazi uma i-asymmetrically laminated. I-Lamination inezidingo zokupakisha, njengokujiya kwethusi nokuqina kwe-dielectric kufanele kufane.