Eminyakeni yamuva, ukusetshenziswa kobuchwepheshe bokunyathelisa be-inkjet ekunyatheliseni izinhlamvu nama-logo kumabhodi e-PCB kuye kwaqhubeka kwanda, futhi ngesikhathi esifanayo kuye kwaphakamisa izinselele eziphakeme ekuqedeni nasekuqineni kokunyathelisa kwe-inkjet. Ngenxa ye-viscosity yayo ephansi kakhulu, uyinki wokuphrinta we-inkjet ngokuvamile unama-centipoise ayishumi nambili. Uma kuqhathaniswa namashumi ezinkulungwane zamasenti kayinki wokuphrinta isikrini, uyinki wokuphrinta we-inkjet uzwela kakhulu endaweni engaphezulu ye-substrate. Uma inqubo ilawulwa Ayilungile, ijwayele ukuba nezinkinga ezifana nokuncipha kwe-inki nokuwa kwezinhlamvu.
Ukuhlanganisa ukunqwabelana kochwepheshe kubuchwepheshe bokuphrinta be-inkjet, i-Hanyin ibisebenzisana namakhasimende ekuthuthukiseni inqubo kanye nokulungiswa nabakhiqizi beziyinki isikhathi eside endaweni yamakhasimende, futhi iqongelele ulwazi oluthile olusebenzayo ekuxazululeni inkinga yezinhlamvu zokuphrinta ze-inkjet.
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Ithonya lokungezwani kwendawo ye-solder mask
Ukungezwani okungaphezulu kwe-mask solder kuthinta ngokuqondile ukunamathela kwezinhlamvu eziphrintiwe. Ungahlola futhi uqinisekise ukuthi uhlamvu oluwayo luhlobene yini nokushuba kwendawo ngokusebenzisa ithebula lokuqhathanisa elilandelayo.
Ngokuvamile ungasebenzisa ipeni le-dyne ukuhlola ukungezwani kwendawo ye-solder mask ngaphambi kokuphrinta izinhlamvu. Ngokuvamile, uma ukungezwani kwendawo kufinyelela ku-36dyn/cm noma ngaphezulu. Kusho ukuthi imaski ye-solder ephekwe ngaphambili ifaneleka kakhulu inqubo yokuphrinta umlingiswa.
Uma ukuhlolwa kuthola ukuthi ukungezwani kwendawo ye-solder mask kuphansi kakhulu, kuyindlela engcono kakhulu yokwazisa umenzi wemaski we-solder ukusiza ekulungiseni.
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Ithonya lefilimu yokuzivikela ye-mask ye-solder
Esigabeni sokuvezwa kwemaski ye-solder, uma ifilimu yokuvikela ifilimu esetshenzisiwe iqukethe izingxenye zikawoyela we-silicone, izodluliselwa endaweni ye-solder mask ngesikhathi sokuchayeka. Ngalesi sikhathi, izovimbela ukusabela phakathi kweyinki yomlingiswa kanye nemaski ye-solder futhi ithinte amandla okubopha, ikakhulukazi Indawo lapho kukhona izimpawu zefilimu ebhodini ngokuvamile indawo lapho abalingisi bangase bawe khona kakhulu. Kulesi simo, kunconywa ukufaka esikhundleni sefilimu evikelayo ngaphandle kwamafutha abicah, noma ungasebenzisi ifilimu yokuzivikela yefilimu ukuze uqhathanise ukuhlolwa. Uma ifilimu yokuvikela ifilimu ingasetshenziswa, amanye amakhasimende azosebenzisa uketshezi oluthile oluvikelayo ukuze afake ifilimu ukuze avikele ifilimu, akhulise ikhono lokukhululwa, futhi athinte isimo se-solder mask.
Ngaphezu kwalokho, ithonya lefilimu yokuzivikela yefilimu ingase ihluke ngokuvumelana nezinga lokulwa nokunamathela kwefilimu. Ipeni le-dyne lingase lingakwazi ukulilinganisa ngokunembile, kodwa lingabonisa ukuncipha kweyinki, okuholela ekungalinganini noma ezinkingeni ze-pinhole, ezizothinta ukunamathela. Yenza umthelela.
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Umthelela wokuthuthukisa i-defoamer
Njengoba okusele kwe-defoamer ethuthukayo kuzophinde kuthinte ukunamathela kukayinki wohlamvu, kunconywa ukuthi kungabikho i-defoamer engezwa phakathi komthuthukisi ukuze kuhlolwe ukuqhathanisa lapho kutholwa imbangela.
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Umthelela wezinsalela ze-solvent ye-solder mask
Uma izinga lokushisa langaphambi kokubhaka lemaski ye-solder liphansi, izinyibiliki eziningi ezisele kumaski e-solder nazo zizothinta isibopho noyinki womlingiswa. Ngalesi sikhathi, kunconywa ukwandisa ngokufanele izinga lokushisa langaphambi kokubhaka kanye nesikhathi se-mask solder sokuhlolwa kokuqhathanisa.
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Izidingo zenqubo yokuphrinta uyinki wezinhlamvu
Izinhlamvu kufanele ziphrintwe kumaski e-solder engakabhakwa ekushiseni okuphezulu:
Qaphela ukuthi izinhlamvu kufanele ziphrintwe ebhodini lokukhiqiza imaski ye-solder engakabhakwa ekushiseni okuphezulu ngemuva kokuthuthukiswa. Uma uphrinta izinhlamvu kumaski e-solder eguga, awukwazi ukuthola ukunamathela okuhle. Naka izinguquko ezidingekayo enqubweni yokukhiqiza. Udinga ukusebenzisa ibhodi elithuthukisiwe ukuze uphrinte izinhlamvu kuqala, bese imaski ye-solder nezinhlamvu zibhakwa ekushiseni okuphezulu.
Setha amapharamitha wokwelapha ukushisa ngendlela efanele:
Uyinki wezinhlamvu eziphrinta we-Jet uwuyinki ophilisa kabili. Ukwelashwa okuphelele kuhlukaniswe ngezinyathelo ezimbili. Isinyathelo sokuqala ukuphulukiswa kwangaphambili kwe-UV, futhi isinyathelo sesibili ukuphulukiswa okushisayo, okunquma ukusebenza kokugcina kukayinki. Ngakho-ke, imingcele yokwelapha okushisayo kufanele isethwe ngokuhambisana nemingcele edingekayo kubhukwana lobuchwepheshe elinikezwe umenzi weyinki. Uma kukhona izinguquko emkhiqizweni wangempela, kufanele uqale uthintane nomkhiqizi we-inki ukuthi kungenzeka yini.
Ngaphambi kokwelapha ukushisa, amabhodi akufanele ahlanganiswe:
Uyinki wokuphrinta we-inkjet welashwa kuphela ngaphambi kokuphulukiswa okushisayo, futhi ukunamathela akubi kahle, futhi amapuleti aminated aletha ukungqubuzana komshini, okungadala kalula ukukhubazeka kwezinhlamvu. Ekukhiqizeni kwangempela, izinyathelo ezifanele kufanele zithathwe ukunciphisa ukungqubuzana okuqondile nokunwaya phakathi kwamapuleti.
Ama-opharetha kufanele alinganise ukusebenza:
Abasebenzi kufanele bagqoke amagilavu ngesikhathi somsebenzi ukuvimbela ukungcoliswa kukawoyela ekungcoliseni ibhodi lokukhiqiza.
Uma ibhodi litholakala lingcolile, ukuphrinta kufanele kuyekwe.
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Ukulungiswa kokuqina kwe-inki yokuphulukisa
Ekukhiqizweni kwangempela, izinhlamvu eziningi ziyawa ngenxa yokushwiba, ukuklwebheka noma umthelela wesitaki, ngakho ukwehlisa ngokufanelekile ukujiya kukayinki kungase kusize izinhlamvu ziwe. Ngokuvamile ungazama ukulungisa lokhu lapho izinhlamvu ziwa futhi ubone ukuthi kukhona yini ukuthuthukiswa.
Ukushintsha ukujiya kokwelapha kuwukuphela kokulungiswa okwenziwa umenzi wemishini emishinini yokunyathelisa.
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Umthelela wokupakisha nokucubungula ngemva kokuphrinta izinhlamvu
Enqubweni elandelayo yokuqedela inqubo yomlingiswa, ibhodi lizoba nezinqubo ezifana nokucindezela okushisayo, ukwenza isicaba, ama-gong, kanye ne-V-cut. Lokhu kuziphatha okufana ne-stacking extrusion, ukungqubuzana kanye nengcindezi yokucubungula imishini kunomphumela obalulekile ekuyekeni kwabalingiswa, okuvame ukwenzeka Imbangela enkulu yokuwa komlingiswa.
Ophenyweni lwangempela, into yokwehla komlingiswa esivame ukuyibona isendaweni encane ye-solder enethusi ngaphansi kwe-PCB, ngoba le ngxenye ye-solder mask incane futhi ukushisa kudlulisa ngokushesha. Le ngxenye izoshiswa ngokushesha uma kuqhathaniswa, futhi le ngxenye ingase idale ukugxila kokucindezeleka. Ngasikhathi sinye, le ngxenye iyi-convexity ephezulu kakhulu kulo lonke ibhodi le-PCB. Lapho amabhodi alandelayo enqwabelene ndawonye ukuze acindezelwe ngokushisayo noma asikwe, Kuba lula ukubangela ukuba ezinye izinhlamvu ziphuke futhi ziwe.
Ngesikhathi sokucindezela okushisayo, ukucaba kanye nokwenza, i-pad spacer ephakathi inganciphisa ukwehla kwezinhlamvu okubangelwa ukungqubuzana kokuminyanisa, kodwa le ndlela inzima ukuyikhuthaza enqubweni yangempela, futhi ngokuvamile isetshenziselwa izivivinyo zokuqhathanisa lapho uthola izinkinga.
Uma ekugcineni kunqunywa ukuthi isizathu esiyinhloko ukuwa komlingiswa okubangelwa ukungqubuzana okunzima, ukunwaya nokucindezeleka esigabeni sokwenza, futhi umkhiqizo kanye nenqubo ye-ink ye-solder mask ayikwazi ukushintshwa, umenzi we-inki angakwazi ukuyixazulula ngokuphelele ukufaka esikhundleni noma ukuthuthukisa uyinki womlingiswa. Inkinga yokushoda kwezinhlamvu.
Sekukonke, kusukela kumiphumela kanye nolwazi lwabakhiqizi bethu bemishini kanye nabakhiqizi beyinki ophenyweni nasekuhlaziyeni okwedlule, izinhlamvu ezehlisiwe zivame ukuhlobana nenqubo yokukhiqiza ngaphambi nangemuva kwenqubo yombhalo, futhi zizwela kancane kwezinye iziyinki zezinhlamvu. Uma inkinga yokuwa komlingiswa yenzeka ekukhiqizweni, imbangela yokungajwayelekile kufanele itholakale isinyathelo ngesinyathelo ngokuya ngokugeleza kwenqubo yokukhiqiza. Uma sibheka idatha yesicelo semboni yeminyaka eminingi, uma oyinki bezinhlamvu abafanelekile nokulawulwa okufanele kwezinqubo zokukhiqiza ezifanele ngaphambi nangemuva kokusetshenziswa, inkinga yokulahlekelwa umlingisi ingalawulwa kahle kakhulu futhi ihlangabezane ngokugcwele nezidingo zemboni yesivuno nekhwalithi.