Ubuchwepheshe bokuhlola obujwayelekile kanye nemishini yokuhlola embonini ye-PCB

Kungakhathaliseki ukuthi hlobo luni lwebhodi lesifunda eliphrintiwe elidinga ukwakhiwa noma ukuthi hlobo luni lwemishini esetshenziswayo, i-PCB kufanele isebenze kahle. Kuyisihluthulelo sokusebenza kwemikhiqizo eminingi, futhi ukwehluleka kungabangela imiphumela emibi.

Ukuhlola i-PCB ngesikhathi sokuklama, ukukhiqiza, nenqubo yokuhlanganisa kubalulekile ukuze uqinisekise ukuthi umkhiqizo uhlangabezana nezindinganiso zekhwalithi futhi usebenza njengoba kulindelekile. Namuhla, ama-PCB ayinkimbinkimbi kakhulu. Nakuba lobu bunzima bunikeza indawo yezici eziningi ezintsha, futhi kuletha ingozi enkulu yokwehluleka. Ngokuthuthukiswa kwe-PCB, ubuchwepheshe bokuhlola kanye nobuchwepheshe obusetshenziselwa ukuqinisekisa ikhwalithi yayo iya ngokuya ithuthuke kakhulu.

Khetha ubuchwepheshe bokuthola obulungile ngohlobo lwe-PCB, izinyathelo zamanje kunqubo yokukhiqiza kanye namaphutha azohlolwa. Ukwakha uhlelo olufanele lokuhlola nokuhlola kubalulekile ukuze kuqinisekiswe imikhiqizo esezingeni eliphezulu.

 

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Kungani sidinga ukuhlola i-PCB?
Ukuhlola kuyisinyathelo esibalulekile kuzo zonke izinqubo zokukhiqiza ze-PCB. Ingathola amaphutha e-PCB ukuze iwalungise futhi ithuthukise ukusebenza okuphelele.

Ukuhlolwa kwe-PCB kungembula noma yikuphi ukukhubazeka okungenzeka phakathi nenqubo yokukhiqiza noma yokuhlanganisa. Kungasiza futhi ukuveza noma yimaphi amaphutha edizayini okungenzeka akhona. Ukuhlola i-PCB ngemva kwesigaba ngasinye senqubo kungathola amaphutha ngaphambi kokungena esigabeni esilandelayo, ngaleyo ndlela ugweme ukuchitha isikhathi esiningi nemali ukuthenga imikhiqizo enesici. Kungasiza futhi ukuthola amaphutha esikhathi esisodwa athinta i-PCB eyodwa noma amaningi. Le nqubo isiza ukuqinisekisa ukuhambisana kwekhwalithi phakathi kwebhodi lesifunda kanye nomkhiqizo wokugcina.

Ngaphandle kwezinqubo ezifanele zokuhlola i-PCB, amabhodi esekethe anesici angase anikezwe amakhasimende. Uma ikhasimende lithola umkhiqizo onesici, umkhiqizi angase alahlekelwe ngenxa yezinkokhelo zesiqinisekiso noma izimbuyiselo. Amakhasimende azophinde alahlekelwe ukwethemba inkampani, ngaleyo ndlela kulimaze isithunzi senkampani. Uma amakhasimende ethutha ibhizinisi lawo kwezinye izindawo, lesi simo singase siholele emathubeni aphuthelwe.

Esimeni esibi kakhulu, uma i-PCB enesici isetshenziswa emikhiqizweni efana nemishini yezokwelapha noma izingxenye zezimoto, ingabangela ukulimala noma ukufa. Izinkinga ezinjalo zingaholela ekulahlekelweni kwesithunzi okunzima kanye nokumangalelwa okubizayo.

Ukuhlolwa kwe-PCB nakho kungasiza ukuthuthukisa yonke inqubo yokukhiqiza ye-PCB. Uma iphutha livame ukutholakala, izinyathelo zingathathwa ohlelweni lokulungisa iphutha.

 

Indlela yokuhlola umhlangano webhodi lesifunda ephrintiwe
Kuyini ukuhlolwa kwe-PCB? Ukuqinisekisa ukuthi i-PCB ingasebenza njengoba bekulindelekile, umenzi kufanele aqinisekise ukuthi zonke izingxenye zihlanganiswe ngendlela efanele. Lokhu kufezwa ngochungechunge lwamasu, kusukela ekuhloleni okwenziwa ngesandla okulula kuya ekuhlolweni okuzenzakalelayo kusetshenziswa imishini yokuhlola ye-PCB ethuthukisiwe.

Ukuhlola okubukwayo okwenziwa ngesandla kuyisiqalo esihle. Kuma-PCB alula, ungawadinga kuphela.
Ukuhlola okubonakalayo okwenziwa ngesandla:
Indlela elula yokuhlola i-PCB ukuhlola okubonakalayo okwenziwa ngesandla (MVI). Ukwenza izivivinyo ezinjalo, abasebenzi bangabuka ibhodi ngeso lenyama noma bakhulise. Bazoqhathanisa ibhodi nombhalo wokuklama ukuze baqinisekise ukuthi yonke imininingwane iyahlangatshezwa. Bazophinde babheke amanani azenzakalelayo ajwayelekile. Uhlobo lwesici abalubhekayo luncike ohlotsheni lwebhodi lesifunda kanye nezingxenye ezikulo.

Kuwusizo ukwenza i-MVI ngemva cishe kwesinyathelo ngasinye senqubo yokukhiqiza ye-PCB (kuhlanganise nomhlangano).

Umhloli uhlola cishe zonke izici zebhodi lesifunda futhi abheke amaphutha ahlukahlukene ajwayelekile kuzo zonke izici. Uhlu lokuhlola olujwayelekile olubonakalayo lwe-PCB lungabandakanya lokhu okulandelayo:
Qinisekisa ukuthi ubukhulu bebhodi lesifunda bulungile, futhi uhlole ukugoqa kwendawo kanye ne-warpage.
Hlola ukuthi usayizi wengxenye uyahlangabezana yini nokucaciswa, futhi unake ngokukhethekile usayizi ohlobene nesixhumi sikagesi.
Hlola ubuqotho nokucaca kwephethini ye-conductive, futhi uhlole amabhuloho e-solder, ama-circuits avulekile, ama-burrs nama-voids.
Hlola ikhwalithi yendawo bese uhlola amazinyo, amazinyo, imihuzuko, amaphinifa nokunye ukonakala emikhondo ephrintiwe namaphedi.
Qinisekisa ukuthi zonke izimbobo zisendaweni efanele. Qinisekisa ukuthi akukho okushiyiwe noma izimbobo ezingafanele, ububanzi buhambisana nokucaciswa komklamo, futhi azikho izikhala noma amafindo.
Hlola ukuqina, ukuhwalala nokukhanya kwe-backing plate, futhi uhlole ukonakala okukhuphukile.
Hlola ikhwalithi yokunameka. Hlola umbala we-plating flux, nokuthi iyunifomu, iqinile futhi isendaweni efanele.

Uma kuqhathaniswa nezinye izinhlobo zokuhlola, i-MVI inezinzuzo ezimbalwa. Ngenxa yobulula bayo, inezindleko eziphansi. Ngaphandle kokukhulisa okungenzeka, akukho mishini ekhethekile edingekayo. Lokhu kuhlola kungenziwa futhi ngokushesha okukhulu, futhi kunganezelwa kalula ekupheleni kwanoma iyiphi inqubo.

Ukuze wenze ukuhlola okunjalo, okuwukuphela kwento edingekayo ukuthola abasebenzi abangochwepheshe. Uma unobuchwepheshe obudingekayo, le nqubo ingase ibe usizo. Kodwa-ke, kubalulekile ukuthi abasebenzi basebenzise imininingwane yedizayini futhi bazi ukuthi yiziphi iziphambeko okufanele ziqashelwe.

Ukusebenza kwale ndlela yokuhlola kunomkhawulo. Ayikwazi ukuhlola izingxenye ezingekho emgqeni wokubonwa komsebenzi. Isibonelo, amalunga e-solder afihliwe awakwazi ukuhlolwa ngale ndlela. Abasebenzi bangase baphuthelwe ezinye iziphambeko, ikakhulukazi amaphutha amancane. Ukusebenzisa le ndlela ukuhlola amabhodi esifunda ayinkimbinkimbi anezingxenye eziningi ezincane kuyinselele ngokukhethekile.

 

 

Ukuhlola okuzenzakalelayo:
Ungasebenzisa futhi umshini wokuhlola we-PCB ukuze uhlole okubonakalayo. Le ndlela ibizwa ngokuthi i-automated optical inspection (AOI).

Amasistimu e-AOI asebenzisa imithombo yokukhanya eminingi kanye nekhamera eyodwa noma ngaphezulu emile noma ikhamera ukuze ihlolwe. Umthombo wokukhanya ukhanyisa ibhodi le-PCB kuwo wonke ama-engeli. Ikhamera ibe isithatha isithombe esinganyakazi noma ividiyo yebhodi lesekhethi bese iyihlanganisa ukuze yakhe isithombe esiphelele socingo. Uhlelo lube seluqhathanisa izithombe zalo ezithwetshuliwe nolwazi olumayelana nokubukeka kwebhodi kusukela kumininingwane yedizayini noma amayunithi aphelele agunyaziwe.

Kokubili okokusebenza kwe-2D ne-3D AOI kuyatholakala. Umshini we-2D AOI usebenzisa izibani ezinemibala namakhamera aseceleni asuka kuma-engeli amaningi ukuze uhlole izingxenye ezithikamezeka ubude bazo. Izinto ze-3D AOI zintsha futhi zingakala ubude bengxenye ngokushesha nangokunembile.

I-AOI ingathola iziphambeko eziningi ezifanayo njenge-MVI, okuhlanganisa amaqhuqhuva, ukuklwebheka, amasekhethi avuliwe, ukuncipha kwe-solder, izingxenye ezingekho, njll.

I-AOI ubuchwepheshe obuvuthiwe nobunembayo obukwazi ukubona amaphutha amaningi kuma-PCB. Iwusizo kakhulu ezigabeni eziningi zenqubo yokukhiqiza ye-PCB. Futhi kuyashesha kune-MVI futhi kuqeda ukuthi kungenzeka iphutha lomuntu. Njenge-MVI, ngeke isetshenziselwe ukuhlola izingxenye ngaphandle kokubonwa, njengokuxhumana okufihlwe ngaphansi kwezinhlaka zegridi yebhola (BGA) nezinye izinhlobo zokupakisha. Lokhu kungase kungasebenzi kuma-PCB anezingxenye eziphezulu zokugxila, ngoba ezinye zezingxenye zingase zifihlwe noma zingabonakali.
Isilinganiso sokuhlolwa kwe-laser okuzenzakalelayo:
Enye indlela yokuhlola i-PCB isilinganiso sokuhlolwa kwelaser okuzenzakalelayo (ALT). Ungasebenzisa i-ALT ukukala usayizi wamajoyinti e-solder kanye namadiphozithi ahlanganisiwe we-solder kanye nokubonakala kwezingxenye ezihlukahlukene.

Uhlelo lwe-ALT lusebenzisa i-laser ukuskena nokulinganisa izingxenye ze-PCB. Lapho ukukhanya kuvela ezingxenyeni zebhodi, uhlelo lusebenzisa indawo yokukhanya ukuze lunqume ukuphakama kwalo. Iphinde ilinganise ukushuba kwe-beam ebonisiwe ukuze inqume ukubukeka kwengxenye. Isistimu ingase iqhathanise lezi zilinganiso nezicaciso zedizayini, noma namabhodi esekethe agunyazwe ukuhlonza ngokunembile noma yikuphi ukukhubazeka.

Ukusebenzisa uhlelo lwe-ALT kulungele ukunquma inani nendawo ye-solder paste deposits. Inikeza ulwazi mayelana nokuqondanisa, i-viscosity, ukuhlanzeka nezinye izakhiwo zokuphrinta unamathisele we-solder. Indlela ye-ALT inikeza imininingwane enemininingwane futhi ingalinganiswa ngokushesha okukhulu. Lezi zinhlobo zokulinganisa ngokuvamile zinembile kodwa zingaphansi kokuphazamiseka noma ukuvikelwa.

 

Ukuhlolwa kwe-X-ray:
Ngokukhula kobuchwepheshe bokukhweza phezulu, ama-PCB asephenduke inkimbinkimbi kakhulu. Manje, amabhodi esekethe anomthamo omkhulu wokuminyana, izingxenye ezincane, futhi afaka amaphakheji e-chip afana ne-BGA ne-chip scale packaging (CSP), lapho ukuxhumeka kwe-solder okufihliwe kungabonakali khona. Le misebenzi iletha izinselele ekuhloleni okubonakalayo njenge-MVI ne-AOI.

Ukuze unqobe lezi zinselele, kungasetshenziswa imishini yokuhlola i-X-ray. Izinto zimunca ama-X-ray ngokwesisindo se-athomu. Izakhi ezisindayo zimunca kakhulu futhi izakhi ezilula zimunca kancane, ezingahlukanisa izinto. I-Solder yenziwe ngezinto ezisindayo njengethayini, isiliva, nomthofu, kuyilapho ezinye izingxenye eziningi ku-PCB zenziwe ngezinto ezilula njenge-aluminium, ithusi, ikhabhoni, ne-silicon. Ngenxa yalokho, i-solder kulula ukuyibona ngesikhathi sokuhlolwa kwe-X-ray, kuyilapho cishe zonke ezinye izingxenye (okuhlanganisa ama-substrates, umkhondo, nama-silicon integrated circuits) zingabonakali.

I-X-ray ayibonakali njengokukhanya, kodwa idlula entweni ukuze yakhe umfanekiso wento. Le nqubo yenza kube nokwenzeka ukubona ngokusebenzisa iphakheji chip nezinye izingxenye ukuhlola uxhumano solder ngaphansi kwazo. Ukuhlolwa kwe-X-ray nakho kungabona ingaphakathi lamalunga e-solder ukuthola amabhamuza angabonakali nge-AOI.

I-X-ray system ingakwazi futhi ukubona isithende sejoyinti le-solder. Ngesikhathi se-AOI, i-solder joint izombozwa umthofu. Ngaphezu kwalokho, uma usebenzisa ukuhlolwa kwe-X-ray, akukho thunzi olungena. Ngakho-ke, ukuhlolwa kwe-X-ray kusebenza kahle kumabhodi wesifunda anezingxenye eziminyene. Imishini yokuhlola i-X-ray ingasetshenziselwa ukuhlola i-X-ray ngesandla, noma isistimu ye-X-ray ezenzakalelayo ingasetshenziselwa ukuhlola i-X-ray okuzenzakalelayo (AXI).

Ukuhlolwa kwe-X-ray kuwukukhetha okuhle kwamabhodi esekethe ayinkimbinkimbi, futhi kunemisebenzi ethile ezinye izindlela zokuhlola ezingenayo, njengokukwazi ukungena kumaphakheji e-chip. Ingasetshenziswa futhi kahle ukuhlola ama-PCB agcwele phama, futhi ingenza ukuhlola okunemininingwane eminingi kumajoyinti e-solder. Ubuchwepheshe busha kancane, buyinkimbinkimbi kakhulu, futhi bungase bubize kakhulu. Kuphela uma unenani elikhulu lamabhodi esekethe aminyene ane-BGA, CSP namanye amaphakheji anjalo, udinga ukutshala imishini yokuhlola i-X-ray.