Kusho ukuthini lokhu embonini ye-PCB enejubane eliphezulu?
Okokuqala, lapho kuklanywa futhi kwakha izitaki ze-PCB, izici ezibonakalayo kumele zibekwe phambili. I-5G PCB kufanele ihlangabezane nakho konke ukucaciswa lapho ithwala futhi ithola ukuhanjiswa kwesiginali, ukuhlinzeka ukuxhumana ngogesi, nokunikeza ukulawula imisebenzi ethile. Ngaphezu kwalokho, izinselelo zokwakhiwa kwe-PCB kuzodingeka zibhekwe, njengokugcina ubuqotho besiginali ngesivinini esiphakeme, ukuphathwa kwe-thermal, nokuthi ungavimbela kanjani ukuphazanyiswa kwe-electromagnete (EMI) phakathi kwedatha namabhodi.
Isiginali exubile ethola i-Circuit Board Design
Namuhla, amasistimu amaningi abhekene ne-4G ne-3G PCB. Lokhu kusho ukuthi i-Comenent's idlulisela futhi yamukele ibanga lokuvama yi-600 MHZ kuye ku-5.925 GHz, futhi isiteshi se-bandwidth singama-20 mhz, noma ama-200 KHZ we-IOT Systems. Lapho uklama ama-PCB ama-5G Network Systems, lezi zingxenye zizodinga ama-millimeter wave amaza we-28 GHZ, 30 GHZ noma ngisho no-77 GHz, kuya ngohlelo lokusebenza. Eziteshini ze-bandwidth, izinhlelo ze-5G zizocubungula i-100mhh ngezansi nge-6GHz ne-400mhz ngenhla kwe-6GHz.
Lawa majubane aphezulu kanye namafrikhwensi aphezulu azodinga ukusetshenziswa kwezinto ezifanele ku-PCB ukuze athwebule futhi adlulise amasiginali aphansi nangaphezulu ngaphandle kokulahleka kwesiginali kanye ne-EMI. Enye inkinga ukuthi amadivaysi azoba lula, aphatheke kakhulu, futhi ancanyana. Ngenxa yesisindo esiqinile, usayizi kanye nezingqinamba zesikhala, izinto ze-PCB kumele ziguquguquke futhi zisindile ukuze zihlalise wonke amadivaysi ama-microelectronic ebhodini lokujikeleza.
Ngeminonjana ye-PCB yethusi, umkhondo omncane kanye nokulawulwa kokuphazamiseka okujwayelekile kufanele kulandelwe. Inqubo yendabuko ephansi ye-Etching esetshenziselwa i-3G kanye ne-4G ephezulu ye-PCBS ingashintshwa kwinqubo esezingeni eliguquliwe. Lezi zinqubo ezenziwe ngcono ze-semi-additive zizohlinzeka ngemibala eqondile nezindonga ezinzima.
Isizinda sezinto ezibonakalayo siyaphindeka kabusha. Izinkampani eziphrintiwe zeBongile zeBoard zifunda izinto ze-dielectric zihlala ziphansi njenge-3, ngoba izinto ezijwayelekile zama-PC ezinamajubane aphansi zivame uku-3.5 kuye ku-5.5. I-Tipeng Glass Fibre Fire Marraire, impahla ephansi yokulahlekelwa factor kanye nephrofayili yephrofayili ephansi nayo izoba yisinqumo se-PCB enesivinini esiphezulu samasiginali edijithali, ngaleyo ndlela ukuvimbela ukulahleka kwesiginali nokwenza ngcono ukuthembeka kwesiginali kanye nokwenza ngcono ubuqotho besiginali.
Inkinga yokuvikela i-EMI
I-EMI, iCrostalk kanye ne-parasitic capacitance yizinkinga eziphambili zamabhodi wesifunda. Ukuze ubhekane ne-crosstalk ne-EMI ngenxa yemvamisa ye-analog neyedijithali ebhodini, kunconywa kakhulu ukuhlukanisa umkhondo. Ukusetshenziswa kwamabhodi we-multilayer kuzohlinzeka ngezindlela ezingcono kakhulu zokuthola ukuthi ungabeka kanjani iminonjana enesivinini esikhulu ukuze izindlela zokubuyiselwa kwezimbuyiselo ze-analog kanye nezedijithali zigcinwa kude komunye nomunye, ngenkathi zigcina imibuthano ye-AC ne-DC ihlukanisa. Ukungeza Ukuvikelwa Nokuhlunga Lapho Ukubeka Izakhi kufanele futhi kunciphise inani le-EMI yemvelo kwi-PCB.
Ukuze uqinisekise ukuthi azikho izici eziphikisanayo kanye namasekethe amafushane afushane noma amaseliphu avulekile endaweni yokuhlola okuzenzakalelayo (auto ezenzakalelayo yokuhlola (AIO) ngemisebenzi ephezulu kanye ne-2D metrology izosetshenziselwa ukubheka iminonjana. Lezi zibuchwepheshe zizosiza abakhiqizi be-PCB babheke ubungozi bokuncipha kwesiginali okungenzeka.
Izinselelo Zokuphathwa Kwe-Thermal
Ijubane lesiginali eliphakeme lizodala okwamanje nge-PCB ukukhiqiza ukushisa okwengeziwe. Izinto ze-PCB zezinto zokwenziwa kwe-dielectric kanye nezendlalelo ze-core substrate kuzodinga ukusingatha kahle isivinini esiphakeme esidingekayo ngobuchwepheshe be-5G. Uma lokho okuqukethwe kunganele, kungadala ukulandelwa kwethusi, ukukhonkotha, ukushwabana nokubhala, ngoba lezi zinkinga zizokwenza ukuthi i-PCB iye yawohloka.
Ukuze ubhekane nalawa mazinga okushisa aphezulu, abakhiqizi bazodinga ukugxila ekukhetheni kwezinto zokwakha ezikhuluma ngezinto ezishisayo nezinkinga ze-coefficient ezishisayo. Izinto zokwakha eziphakeme eziphakeme ezishisayo, ukudluliswa okungcono kakhulu kokushisa, kanye ne-dielectric engaguquki njalo kufanele kusetshenziselwe ukwenza i-PCB enhle ukuhlinzeka zonke izici ze-5G ezidingekayo kulolu hlelo lokusebenza.