1. Pinhole
I-pinhole ngenxa ye-adsorption yegesi ye-hydrogen ebusweni bezingxenye ezinama-plated, ezingeke zikhishwe isikhathi eside. Isixazululo se-platiating asikwazi ukumanzisa ingaphezulu lezingxenye ze-plated, ukuze ungqimba lwe-electrolytic platical akwazi ukuhlaziya ngogesi. Njengoba ukushuba kwe-coating kwanda endaweni ezungeze indawo yokuziphendukela kwemvelo ye-hydrogen, kwakhiwa iPinhole endaweni yokuziphendukela kwe-hydrogen. Kubonakaliswa umgodi oyindilinga ocwebezelayo futhi kwesinye isikhathi umsila omncane okhuphukile. Lapho kunokuntuleka kwe-ejenti enamanzi esikhandlani sokusebenzisa ama-plating kanye nokuqina kwamanje kuphezulu, ama-mainholes kulula ukuwathola.
2. Ukukhonkotha
Ama-pockmarks ngenxa yobuso obungavuthiwe abuhlanzekile, kunezinto eziqinile ama-adsorbed, noma izinto eziqinile zimiswe esikhandlani se-plating. Lapho befika ebusweni bendawo yokusebenza ngaphansi kwesenzo sensimu kagesi, badidekile kuso, okuthinta i-electrolysis. Lezi zinto eziqinile zifakwa engxenyeni ye-electroplating, ama-bump amancane (ama-dumps) ayakhiwa. Isimo ukuthi kungama-convex, asikho into ekhanyayo, futhi asikho isimo esinqunyelwe. Ngamafuphi, kubangelwa umsebenzi wokusebenza ongcolile nesixazululo esingcolile se-plating.
3. Imivimbo ye-Airflow
I-Airflow Streaks ngenxa yezithasiselo ngokweqile noma i-cathode ephakeme yamanje noma i-ejenti eyinkimbinkimbi, enciphisa ukusebenza kahle kwamanje kanye nemiphumela ngenani elikhulu le-hydrogen volutivo. Uma isixazululo se-platiating sigeleza kancane futhi i-cathode yahamba kancane, igesi ye-hydrogen izothinta ukuhlelwa kwamakristalu e-electrolytic ngesikhathi senqubo yokuvuka kobuso bendawo yokusebenza, yakha imivimbo yezimbali kusuka phansi.
I-4
I-mask plating ingenxa yokuthi i-flash ethambile endaweni yephinithi ebusweni bomsebenzi wesisebenzi ayisuswanga, futhi i-electrolytic division coating ayinakwenziwa lapha. Izinto ezifuywayo zingabonakala ngemuva kwe-electroplating, ngakho-ke ibizwa nge-expeced phansi (ngoba i-soft flash iyingxenye ye-resin eguqukayo noma esobala).
5. Ukuhlanganiswa kwe-brittleness
Ngemuva kwe-Electroplating ye-SMD nokusika nokwakha, kungabonakala ukuthi kukhona okuqhekekile ekugobani kwe-PIN. Lapho kunokuqhekeka phakathi kwesendlalelo se-nickel kanye ne-substrate, kwahlulelwa ukuthi ungqimba lwe-nickel aluphumeleli. Lapho kukhona ukuqhekeka phakathi kwesendlalelo se-tin kanye ne-nickel ungqimba, kunqunywa ukuthi ungqimba lwe-tin aluphumeleli. Iningi lezimbangela zobucwebecwebe yizengezo, izicanuko ezengeziwe, noma ukungcola okuningi kwe-inorganic ne-organic kusixazululo se-platiating.
