1. Imbobo yephini
I-pinbole ibangelwa ukukhanyiswa kwegesi ye-hydrogen ebusweni bezingxenye ezicwecwe, ezingeke zikhishwe isikhathi eside. Isixazululo sokucwenga asikwazi ukumanzisa ingaphezulu lezingxenye ezipuletiwe, ukuze ungqimba lwe-electrolytic plating lungakwazi ukuhlaziywa ngogesi. Njengoba ukushuba kwe-coating kukhula endaweni ezungeze indawo ye-hydrogen evolution, kwakheka imbobo endaweni yokuguquguquka kwe-hydrogen. Ibonakala ngembobo eyindilinga ecwebezelayo futhi kwesinye isikhathi nomsila omncane ophendulwe phezulu. Uma kunokuntuleka kwe-ejenti yokumanzisa esixazululweni sokucwenga futhi ukuminyana kwamanje kuphezulu, ama-pinholes kulula ukwakha.
2. Ukubhoboza
Omaka abakhwabanisi bangenxa yokuthi indawo ebekwe phezu kwayo ayihlanzekile, kukhona izinto eziqinile ezikhangisiwe, noma izinto eziqinile zimisiwe kusixazululo se-plating. Lapho befika ebusweni bomsebenzi ngaphansi kwesenzo sensimu kagesi, bakhangiswa kuwo, okuthinta i-electrolysis. Lezi zinto eziqinile zifakwe kungqimba lwe-electroplating, amaqhubu amancane (ama-dumps) akhiwa. Isici siwukuthi i-convex, ayikho into ekhanyayo, futhi asikho isimo esimisiwe. Ngamafuphi, kubangelwa i-workpiece engcolile kanye nesisombululo se-plating esingcolile.
3. Imigqa yokugeleza komoya
I-Airflow streaks ibangelwa izithasiselo ezeqile noma ukuminyana kwamanje kwe-cathode ephezulu noma i-ejenti eyinkimbinkimbi, okunciphisa ukusebenza kahle kwamanje kwe-cathode futhi kubangele inani elikhulu lokuguquguquka kwe-hydrogen. Uma isixazululo se-plating sigeleza kancane futhi i-cathode ihamba kancane, igesi ye-hydrogen izothinta ukuhlelwa kwamakristalu e-electrolytic phakathi nenqubo yokukhuphuka ngokumelene nobuso bomsebenzi wokusebenza, okwenza imigqa yokugeleza komoya kusukela phansi kuya phezulu.
4. I-mask plating (iphansi elisobala)
I-mask plating kungenxa yokuthi ukukhanya okuthambile endaweni yephini ebusweni bomsebenzi wokusebenza akukasuswa, futhi i-electrolytic deposition coating ayikwazi ukwenziwa lapha. Izinto eziyisisekelo zingabonakala ngemuva kwe-electroplating, ngakho-ke kubizwa ngokuthi ngezansi obala (ngoba ukukhanya okuthambile kuyisici se-resin translucent noma esobala).
5. Ukuqina kwe-coating
Ngemuva kwe-SMD electroplating nokusika nokwenza, kungabonakala ukuthi kukhona ukuqhekeka ekugobeni kwephini. Uma kukhona ukuqhekeka phakathi kongqimba lwe-nickel kanye ne-substrate, kubhekwa ukuthi ungqimba lwe-nickel luhlakazekile. Uma kukhona ukuqhekeka phakathi kongqimba lwe-tin kanye nongqimba lwe-nickel, kunqunywa ukuthi ungqimba lukathayela luhlakazekile. Iningi lezimbangela zokonakala yizithasiselo, izikhanyisi ezikhanyayo, noma ukungcola okuningi kwe-inorganic kanye ne-organic kusixazululo se-plating.
