Ukuhlaziywa kwezizathu ezintathu eziyinhloko zokwenqatshwa kwe-PCB

I-PCB wire yethusi iyawa (evame ukubizwa ngokuthi ukulahla ithusi). Izimboni ze-PCB zonke zithi yinkinga ye-laminate futhi idinga ukuthi izimboni zabo zokukhiqiza zithwale ukulahlekelwa okubi.

 

1. I-foil yethusi ibhalwe ngokweqile. Ucwecwe lwethusi lwe-electrolytic olusetshenziswa emakethe ngokuvamile luwuthayela olunohlangothi olulodwa (oluvame ukwaziwa ngokuthi ucwecwe lomlotha) kanye nocwecwe lwekhopha oluhlangothi olulodwa (olwaziwa ngokujwayelekile ngokuthi ucwecwe olubomvu). Ithusi elivamise ukujikijelwa livamise ukuba yithusi elivundisiwe ngaphezu kuka-70um Foil, ucwecwe olubomvu kanye necwecwe lomlotha elingaphansi kuka-18um ngokuyisisekelo azinalo ukwenqatshwa kwe-batch yethusi. Lapho umklamo wesifunda sekhasimende ungcono kunomugqa wokufaka, uma ukucaciswa kwe-foil yethusi kushintshiwe kodwa imingcele ye-etching ihlala ingashintshiwe, isikhathi sokuhlala se-foil yethusi kusixazululo se-etching side kakhulu. Ngenxa yokuthi i-zinc ekuqaleni iyinsimbi esebenzayo, lapho ucingo lwethusi oluku-PCB lucwiliswa esixazululweni se-etching isikhathi eside, nakanjani luzoholela ekulimaleni okukhulu okuseceleni kwesekethe, kubangele ungqimba oluthile lwesekethe olusekela i-zinc ukuba lusabele ngokuphelele futhi. ihlukaniswe ne-substrate. Okusho ukuthi, ucingo lwethusi luyawa. Esinye isimo ukuthi akukho nkinga ngemingcele yokunamathisela ye-PCB, kodwa ngemva kokuba i-etching igezwe ngamanzi nokomiswa okungekuhle, ucingo lwethusi luphinde luzungezwe isisombululo esisele se-etching endaweni ye-PCB. Uma ingacutshungulwa isikhathi eside, izophinde ibangele ukushumeka kohlangothi okweqile kocingo lwethusi. Phonsa ithusi. Lesi simo ngokuvamile sibonakala njengokugxila emigqeni emincane, noma ngezikhathi zesimo sezulu esiswakeme, amaphutha afanayo azovela kuyo yonke i-PCB. Hlikihla ucingo lwethusi ukuze ubone ukuthi umbala wendawo yokuthintana nesendlalelo sesisekelo (okuthiwa i-roughened surface) ushintshile. Umbala we-foil yethusi uhlukile ku-foil yethusi evamile. Umbala wethusi wokuqala wongqimba olungezansi uyabonakala, futhi amandla okuxebuka ecwecwe lethusi emgqeni owugqinsi nawo ajwayelekile.

2. Ukungqubuzana kwenzeka endaweni kwinqubo ye-PCB, futhi intambo yethusi ihlukaniswa ne-substrate ngamandla omshini angaphandle. Lokhu kusebenza okungekuhle kuwukungami kahle noma umumo. Intambo yethusi eyehlisiwe izoba nokusonteka okusobala noma ukuklwebheka/amamaki okuthinta ohlangothini olufanayo. Uma ukhumula ucingo lwethusi engxenyeni enesici futhi ubheka ubuso obumangelengele be-foil yethusi, ungabona ukuthi umbala we-foil yethusi ujwayelekile, ngeke kube nokuguguleka kwe-side, namandla e-peel. ye-foil yethusi ijwayelekile.

3. Idizayini yesekethe ye-PCB ayinangqondo. Uma i-foil yethusi ewugqinsi isetshenziselwa ukuklama isekethe elincanyana kakhulu, izophinde ibangele ukuqoshwa ngokweqile kwesekethe kanye nokwenqatshwa kwethusi.

2. Izizathu zenqubo yokukhiqiza i-laminate:

Ngaphansi kwezimo ezijwayelekile, inqobo nje uma i-laminate ishisa ngaphezu kwemizuzu engu-30, i-foil yethusi kanye ne-prepreg izohlanganiswa ngokuphelele, ngakho ukucindezela ngokuvamile ngeke kuthinte amandla okubopha kwe-foil yethusi kanye ne-substrate ku-laminate. . Kodwa-ke, ngesikhathi sokupakisha kanye nokupakisha ama-laminates, uma i-PP ingcolile noma i-foil yethusi yonakalisiwe, amandla okubopha phakathi kwe-foil yethusi kanye ne-substrate emva kokugcoba ngeke anele, okuholela ekumiseni (kuphela amapuleti amakhulu) Amagama. ) noma izintambo zethusi ezingavamile ziwe, kodwa amandla ecwecwe ecwecwe lethusi eduze kwezintambo ezicishiwe ngeke abe angajwayelekile.

3. Izizathu zezinto zokusetshenziswa kwe-laminate:

1. Njengoba kushiwo ngenhla, ama-foil ethusi e-electrolytic avamile yonke imikhiqizo efakwe uthayela noma i-copper-plated. Uma ukuphakama kungavamile ngesikhathi sokukhiqizwa kwe-wool foil, noma ngesikhathi se-galvanizing/copper plating, amagatsha e-crystal plating mabi, okwenza i-foil yethusi ngokwayo Amandla okucwenga awanele. Uma i-foil ecindezelwe okokusebenza kweshidi lenziwa ku-PCB kanye ne-plug-in efekthri ye-electronics, intambo yethusi izowa ngenxa yomthelela wamandla angaphandle. Lolu hlobo lokwenqatshwa kwethusi olubi ngeke lubangele ukugqwala okusobala ohlangothini ngemuva kokuxebula ucingo lwethusi ukuze lubone indawo eqinile ye-foil yethusi (okungukuthi, indawo yokuxhumana ne-substrate), kodwa amandla e-peel ayo yonke i-foil yethusi azoba mpofu. .

2. Ukungaguquguquki kahle kwe-foil yethusi ne-resin: amanye ama-laminates anezici ezikhethekile, njengamashidi e-HTg, asetshenziswa manje ngenxa yezinhlelo ezihlukene ze-resin. I-ejenti yokwelapha esetshenziswayo ngokuvamile i-PN resin, futhi isakhiwo se-resin molecular chain silula. Izinga le-crosslinking liphansi, futhi kuyadingeka ukusebenzisa i-copper foil ene-peak ekhethekile ukuyifanisa. Lapho kukhiqizwa ama-laminates, ukusetshenziswa kwe-foil yethusi akufani nesistimu ye-resin, okuholela ekuqineni okunganele kokucwenga kwe-sheet metal-clad metal foil, kanye nokuchithwa kwezintambo zethusi ezimbi lapho kufakwa.