I-aluminium substrate iyi-chepper esekelwe kwi-cherper yensimbi ye-lansinate enomsebenzi omuhle wokuhlanza ukushisa. Indwangu efana neplate eyenziwe ngendwangu ye-elekthronikhi ye-elekthronikhi noma ezinye izinto ezigcizelelwa ezifakwe nge-resin, i-resin eyodwa, njll. Njengenhlanganisela ye-adhesive yethusi, ebhekiswe ku-aluminium-based Pherper-Clad Plate. I-Kangxin Circuit yethula ukusebenza kwe-aluminium substrate kanye nokwelashwa komhlaba.

Ukusebenza kwe-Aluminium Substrate

I-1.Excellent Heat Dissipation Performance

Amapuleti we-Aluminium-based Copper-Clad anokusebenza okuhle kakhulu kokushisa kokushisa, okuyisici esivelele kunazo zonke salolu hlobo lwepuleti. I-PCB eyenziwe ngayo ayikwazi ukuvimba ngempumelelo kuphela izinga lokushisa elisebenzayo lezakhi kanye nezindawo zokubopha ezilayishwe kulo kusuka ekukhuphukeni, kodwa futhi nokushisa okukhiqizwayo okwenziwe yizakhi zamandla aphezulu, izingxenye zamandla amakhulu, ukushintshwa kwamandla amakhulu okujikeleza kanye nezinye izingxenye. Kusatshalaliswa futhi ngenxa yobuningi bawo obuncane, isisindo esikhanyayo (2.7g / cm3), i-anti-oxidation, nentengo eshibhile, ngakho-ke sekuyinani eliguquguqukayo nelikhulu kakhulu leshidi le-composite chepper clad laquates. Ukumelana okufudumele kwe-aluminium substrate okufakiwe kungu-1.10 ℃ / W kanye nokumelana okushisayo kungu-2.8 ℃ / W, okuthuthukisa kakhulu indwangu yamanje yocingo lwethusi.

2.I-2.Proven ukusebenza kahle nekhwalithi yemishini

I-Aluminium-based Copper-clad laminates inamandla amakhulu okusebenza kanye nokuqina, okungcono kakhulu kune-competris esekelwe ku-resin-isekele ama-lamin-cladiates nama-ceramic substrates. Kungakuqaphela ukwenziwa kwamabhodi amakhulu aphrintiwe e-substrates yensimbi, futhi kufanelekile ikakhulukazi ukukhwela izakhi ezisindayo ezitolo ezinjalo. Ngaphezu kwalokho, i-aluminium substrate ibuye ibe nokugcwala okuhle, futhi ingaqoqwa futhi icutshungulwe engxenyeni engezansi ngokhamba, ngokuvuselelwa, njll.

Ukuqina kobukhulu obukhulu

Okwehlukaniswa kweCopper Clad ehlukahlukene Isizathu esiyinhloko sokuthi ama-coefficience anwebekile ahlukahlukene ahlukile, anjengethusi, kanye nokwandiswa kokwenyuka okuqondile kwe-epoxy fiber furstrate kungu-3. I-coefficion ebanzi ye-linear ye-aluminium substrate iphakathi, incane kakhulu kune-resin evamile ye-resin, futhi isondele ekunikezelweni kokwenyuka okuqondile kwethusi, okulungele ukuqinisekisa ikhwalithi nokwethenjwa komjikelezo ophrintiwe.

Ukwelashwa okungaphezulu kwe-aluminium substrate impahla

1. Ukuhlukumeza

Ingaphezulu lepuleti elisuselwa ku-aluminium lihlanganiswe nongqimba kawoyela ngesikhathi sokucutshungulwa nokuhamba, futhi kufanele ihlanzwe ngaphambi kokusetshenziswa. Umgomo ukusebenzisa uphethiloli (uphethiloli ojwayelekile wezindiza) njenge-solvent, engachithwa, bese usebenzisa i-ejenti yokuhlanza amanzi ukuze asuse amabala kawoyela. Hlambulula ingaphezulu ngamanzi agobhozayo ukuyenza ihlanzeke futhi ingenawo amaconsi amanzi.

2. Ukucekela phansi

I-aluminium substrate ngemuva kokwelashwa okungenhla kusanamafutha angavunyelwa ebusweni. Ukuze uyisuse ngokuphelele, ifake nge-alkali sodium hydroxide ngo-50 ° C imizuzu emi-5, bese ihlanza ngamanzi ahlanzekile.

3. I-alkaline etching. Ingaphezulu lepuleti le-aluminium njengoba impahla eyisisekelo kufanele ibe nokuqina okuthile. Kusukela i-aluminium substrate kanye nongqimba wefilimu we-aluminium oximunga ebusweni yizo zombili izinto ze-amphoteric, ingaphezulu lezinto ezisetshenziswayo ze-aluminium zingacishwa ngokusebenzisa uhlelo lwe-acidic, alkali noma lwe-Alkalite Alkaline Solution. Ngaphezu kwalokho, ezinye izinto nezithasiselo zidinga ukufakwa kwikhambi lokulahla ukufeza izinhloso ezilandelayo.

4. I-Cheming Polishing (Ukucwilisa). Ngoba impahla eyisisekelo ye-aluminium iqukethe ezinye izinsimbi zokungcola, kulula ukwakha amakhompiyutha ama-inorganic anamathela ebusweni be-substrate ngesikhathi senqubo yokuncintisana, ngakho-ke amakhompiyutha akwa-inorganic akhiwa ebusweni kufanele ahlaziywe. Ngokwemiphumela yokuhlaziywa, lungiselela isixazululo esifanelekile sokudonsa, bese ubeka i-aluminium substrate evuthayo kwikhambi lokucwilisa ukuze uqinisekise isikhathi esithile, ukuze ingaphezulu lepuleti le-aluminium lihlanzekile futhi licwebezele.