Amabhodi esekethe aphrintiwe asetshenziswa kuma-electronics namadivayisi wanamuhla anezingxenye eziningi ze-elekthronikhi ezigxunyekwe ngokuhlangene. Lokhu kuyiqiniso elibalulekile, njengoba inani lezingxenye ze-elekthronikhi ebhodini lesifunda eliphrintiwe likhula, kanjalo nobukhulu bebhodi lesifunda. Kodwa-ke, usayizi webhodi lesifunda eliphrintiwe we-extrusion, iphakethe le-BGA liyasetshenziswa njengamanje.

Nazi izinzuzo eziyinhloko zephakheji le-BGA okufanele wazi mayelana nalokhu. Ngakho-ke, bheka ulwazi olunikezwe ngezansi:

1. Iphakethe le-BGA elidayisiwe elinomthamo omkhulu

Ama-BGA angesinye sezixazululo ezisebenza kahle kakhulu zenkinga yokudala amaphakheji amancane amasekhethi ahlanganisiwe aqukethe inani elikhulu lamaphini. Amaphakeji wohlelo lwegridi ekabili akhiqizwa ngokunciphisa ama-voids Amakhulu amaphini anesikhala phakathi kwalawa maphini.

Nakuba lokhu kusetshenziselwa ukuletha amazinga aphezulu okuminyana, lokhu kwenza inqubo yezikhonkwane ze-soldering kube nzima ukuphatha. Lokhu kungenxa yokuthi ubungozi bokuhlanganisa ngephutha amaphinikhodi asuka kunhlokweni kuya kusihloko ayakhula njengoba isikhala phakathi kwamaphini sincipha. Kodwa-ke, i-BGA Soldering iphakethe ingaxazulula le nkinga kangcono.

2. Ukushisa kokushisa

Enye yezinzuzo ezimangalisa kakhulu zephakheji ye-BGA ukwehliswa ukumelana nokushisa phakathi kwe-PCB nephakheji. Lokhu kuvumela ukushisa okukhiqizwa ngaphakathi kwephakheji ukuthi kugeleze kangcono ngesekethe ehlanganisiwe. Ngaphezu kwalokho, kuzophinde kuvimbele i-chip ekushiseni ngokweqile ngendlela engcono kakhulu.

3. I-inductance ephansi

Okuhle kakhulu, ama-conductor kagesi amafushane asho ukwehla kwe-inductance. I-inductance isici esingabangela ukuhlanekezela okungafuneki kwamasiginali kumasekhethi we-elekthronikhi anesivinini esikhulu. Njengoba i-BGA iqukethe ibanga elifushane phakathi kwe-PCB nephakheji, iqukethe i-lead inductance ephansi, izohlinzeka ngokusebenza okungcono kwamadivayisi wephini.