1. Lapho ubhaka ama-PCB amakhulu, sebenzisa ilungiselelo lokufaka okuvundlile. Kunconywa ukuthi inani eliphezulu lesitaki akufanele lidlule izingcezu ezingama-30. Ihhavini idinga ukuvulwa kungakapheli imizuzu eyi-10 ngemuva kokubhaka ukuze kukhiphe i-PCB bese kukubeka ifulethi ukuyipholisa. Ngemuva kokubhaka, kudinga ukucindezelwa. Ukulungiswa kwe-Anti-Bend. Ama-PCB amakhulu awunconywa ngokubhaka okuthe mpo, ngoba kulula ukugoba.
2. Lapho ubhaka ama-PCS amancane futhi aphakathi nendawo, ungasebenzisa ukufaka isicaba. Inani eliphakeme lesitaki linconyelwe ukungadluli izingcezu ezingama-40, noma lingaba qotho, futhi inombolo ayinqunyelwe. Udinga ukuvula i-oveni bese ukhipha i-PCB kungakapheli imizuzu eyi-10 yokubhaka. Vumela ukuthi iphole, bese ucindezela i-jig egoba ngokugoba ngemuva kokubhaka.
Ukuqapha lapho i-PCB Baking
1 Ezinsukwini zokuqala, iphuzu le-TG lama-PCB aholayo anezinhlaka lawo aphansi, futhi manje i-TG yama-PC ayi-PCs ahola kakhulu ngaphezulu kwe-150 ° C.
2. I-PCB ebhakiwe kufanele isetshenziswe ngokushesha okukhulu. Uma kungasetshenziswanga, kufanele kube yi-vacuum egcwele ngokushesha okukhulu. Uma kuvezwa umhlangano isikhathi eside kakhulu, kufanele kubhakwe futhi.
3. Khumbula ukufaka imishini yomoya yokuphefumula kuhhavini, ngaphandle kwalokho uSteam uzohlala kuhhavini futhi andise umswakama wawo ohlobene, okungalungile nge-PCB Dehumidication.
4. Kusuka endaweni yokubuka ikhwalithi, kusetshenziswa kakhulu i-PCB soler, ikhwalithi izoba ngcono. Noma ngabe i-PCB ephelelwe yisikhathi isetshenziswa ngemuva kokubhaka, kusekhona ingozi ethile yekhwalithi.
Izincomo ze-PCB Baking
1. Kunconywa ukusebenzisa amazinga okushisa angu-105 ± 5 ℃ ukubhaka i-PCB. Ngoba iphuzu lamanzi elibilayo lingu-100 ℃, inqobo nje uma lidlula iphuzu laso elibilayo, amanzi azoba umusi. Ngoba i-PCB ayiqukethe ama-molecule amaningi amaningi, ayidingi izinga lokushisa eliphakeme kakhulu lokukhulisa izinga lokuvezwa kwalo.
Uma izinga lokushisa liphezulu kakhulu noma isilinganiso se-sosification sishesha kakhulu, lizokwenza kalula ukuthi umphunga wamanzi ukhule ngokushesha, empeleni akufanele ngekhwalithi. Ikakhulu amabhodi ama-multilayer nama-PCB anezimbobo ezingcwatshwe, 105 ° C ingaphezulu kwendlela yokubila, futhi izinga lokushisa ngeke liphezulu kakhulu. , Ingahlehlisa futhi yehlise ubungozi be-oxidation. Ngaphezu kwalokho, amandla kahhavini wamanje ukulawula izinga lokushisa athuthukile kakhulu kunangaphambili.
2. Ukuthi ngabe i-PCB idinga ukuvakwa kuncike ekutheni ukupakisha kwaso kuyinto emanzi, okungukuthi, ukubona ukuthi i-hic (ikhadi lomswakama le-hic) kwiphakethe le-vacuum ikhombisile umswakama. Uma ukufakwa kulungile, i-hic ayikhombisi ukuthi umswakama empeleni ungaya ku-inthanethi ngaphandle kokubhaka.
3. Kunconywa ukusebenzisa i-baking "eqondile" ne-specid Kodwa-ke, kuma-PCB amakhulu ubukhulu, kungahle kudingeke ukubheka ukuthi uhlobo olum mpo luzodala ukugoba nokuguquguquka kwebhodi.
4. Ngemuva kwe-PCB kubhakwe, kunconywa ukuyibeka endaweni eyomile futhi akuvumele kuphole ngokushesha. Kungcono ukucindezela i- "Anti-Bring FIXTRE" ngaphezulu kweBhodi, ngoba into ejwayelekile kulula ukumunca umusi wamanzi kusuka esimweni esiphakeme sokushisa kuya kwinqubo yokupholisa. Kodwa-ke, ukupholisa okusheshayo kungadala ukugoba ipuleti, okudinga ukulinganisela.
Okubi kokubhaka kwe-PCB nezinto okufanele zikucabangele
1. Ukubhaka kuzosheshisa i-oxidation ye-PCB Surface Coating, kanye nokushisa okuphezulu, ukubhaka isikhathi eside, kunzima kakhulu.
2. Akunconyelwe ukubhaka amabhodi aphethwe ngaphandle kwamazinga okushisa aphezulu, ngoba ifilimu le-OSP lizodalula noma lehluleke ngenxa yokushisa okuphezulu. Uma kufanele ubhake, kunconywa ukubhaka emazingeni okushisa ka-105 ± 5 ° C, hhayi ngaphezu kwamahora ama-2, futhi kunconyelwa ukuyisebenzisa kungakapheli amahora angama-24 ngemuva kokubhaka.
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