1. Uma ubhaka ama-PCB anosayizi omkhulu, sebenzisa uhlelo lokupakisha oluvundlile. Kunconywa ukuthi inani eliphezulu lesitaki akufanele lidlule izingcezu ezingu-30. Ihhavini idinga ukuvulwa phakathi kwemizuzu eyi-10 ngemuva kokubhaka ukukhipha i-PCB futhi uyibeke phansi ukuze uyipholise. Ngemuva kokubhaka, idinga ukucindezelwa. Ama-anti-bend fixtures. Ama-PCB anosayizi omkhulu awanconyelwe ukubhaka okuqondile, njengoba kulula ukugoba.
2. Uma ubhaka ama-PCB amancane naphakathi, ungasebenzisa ukupakisha okuyisicaba. Inombolo enkulu yesitaki inconywa ukuthi ingadluli izingcezu ezingu-40, noma ingaba ngqo, futhi inombolo ayinqunyelwe. Udinga ukuvula ihhavini futhi ukhiphe i-PCB kungakapheli imizuzu eyi-10 yokubhaka. Livumele liphole, bese ucindezela i-anti-bending jig ngemva kokubhaka.
Izinyathelo zokuqapha lapho i-PCB ibhaka
1. Izinga lokushisa lokubhaka akufanele lidlule iphuzu le-Tg le-PCB, futhi imfuneko evamile akufanele idlule ku-125°C. Ezinsukwini zokuqala, iphoyinti le-Tg lamanye ama-PCB aqukethe umthofu laliphansi ngokuqhathaniswa, futhi manje i-Tg yama-PCB angenawo umthofu iningi lingaphezu kuka-150°C.
2. I-PCB ebhakiwe kufanele isetshenziswe ngokushesha ngangokunokwenzeka. Uma ingasetshenziswanga, kufanele ifakwe i-vacuum ngokushesha ngangokunokwenzeka. Uma ibekwe endaweni yokusebenzela isikhathi eside kakhulu, kufanele ibhakwe futhi.
3. Khumbula ukufaka imishini yokomisa umoya kuhhavini, ngaphandle kwalokho isitimu sizohlala kuhhavini futhi sikhulise umswakama waso oyisihlobo, ongafanele ukukhishwa kwe-PCB.
4. Ngokombono wekhwalithi, lapho kusetshenziswa i-solder ye-PCB entsha, ikhwalithi izoba ngcono. Ngisho noma i-PCB ephelelwe yisikhathi isetshenziswa ngemva kokubhaka, kusekhona ubungozi bekhwalithi ethile.
Izincomo zokubhaka kwe-PCB
1. Kunconywa ukusebenzisa izinga lokushisa elingu-105±5℃ ukubhaka i-PCB. Ngenxa yokuthi indawo yokubilisa yamanzi ingu-100℃, inqobo nje uma edlula indawo abilayo, amanzi azoba isitimu. Ngenxa yokuthi i-PCB ayinawo ama-molecule amanzi amaningi, ayidingi izinga lokushisa eliphezulu kakhulu ukuze kwandiswe izinga lokuhwamuka kwayo.
Uma izinga lokushisa liphezulu kakhulu noma izinga lokufakwa kwe-gasification lishesha kakhulu, lizokwenza kalula ukuthi umhwamuko ukhule ngokushesha, empeleni ongalungile ngekhwalithi. Ikakhulukazi kumabhodi we-multilayer nama-PCB anezimbobo ezigqitshiwe, i-105 ° C ingaphezu nje kwendawo yokubilisa yamanzi, futhi izinga lokushisa ngeke libe phezulu kakhulu. , Ingasusa umswakama futhi inciphise ingozi ye-oxidation. Ngaphezu kwalokho, ikhono likahhavini wamanje lokulawula izinga lokushisa libe ngcono kakhulu kunangaphambili.
2. Ukuthi i-PCB idinga ukubhakwa kuncike ekutheni ukupakishwa kwayo kunomswakama yini, okungukuthi, ukubheka ukuthi i-HIC (Ikhadi Lokukhomba Lomswakama) kuphakheji ye-vacuum ibonisile yini umswakama. Uma ukupakishwa kukuhle, i-HIC ayikhombisi ukuthi umswakama empeleni Ungangena ku-inthanethi ngaphandle kokubhaka.
3. Kunconywa ukusebenzisa ukubhaka "okuqondile" kanye nezikhala lapho ubhaka i-PCB, ngoba lokhu kungafinyelela umphumela omkhulu we-hot air convection, futhi umswakama kulula ukubhaka ngaphandle kwe-PCB. Nokho, kuma-PCB anosayizi omkhulu, kungase kudingeke ukuthi kubhekwe ukuthi uhlobo olume mpo luzobangela ukugoba nokuguqulwa kwebhodi yini.
4. Ngemuva kokuthi i-PCB ibhakiwe, kunconywa ukuthi uyibeke endaweni eyomile futhi uyivumele ukuthi iphole ngokushesha. Kungcono ukucindezela "i-anti-bending fixture" phezulu ebhodini, ngoba into evamile kulula ukumunca umhwamuko wamanzi kusukela esimweni sokushisa okuphezulu kuya enkambisweni yokupholisa. Nokho, ukupholisa ngokushesha kungase kubangele ukugoba kwepuleti, okudinga ibhalansi.
Ukungalungi kokubhaka kwe-PCB nezinto okufanele zicatshangelwe
1. Ukubhaka kuzosheshisa i-oxidation ye-PCB surface coating, futhi izinga lokushisa liphakeme, ukubhaka isikhathi eside, kubi kakhulu.
2. Akunconywa ukubhaka amabhodi e-OSP aphethwe phezulu ekushiseni okuphezulu, ngoba ifilimu ye-OSP izokwehlisa noma yehluleke ngenxa yokushisa okuphezulu. Uma kufanele ubhake, kunconywa ukuthi ubhake ekushiseni kwe-105 ± 5 ° C, hhayi amahora angaphezu kwama-2, futhi kunconywa ukuthi uyisebenzise kungakapheli amahora angu-24 ngemva kokubhaka.
3. Ukubhaka kungase kube nomthelela ekwakhiweni kwe-IMC, ikakhulukazi i-HASL (i-tin spray), i-ImSn (i-chemical tin, i-immersion tin plating) amabhodi okwelapha angaphezulu, ngoba ungqimba lwe-IMC (i-copper tin compound) empeleni lusengaphambili ku-PCB. isigaba Generation, okungukuthi, iye elakhiwe ngaphambi PCB soldering, kodwa ukubhaka kuzokwandisa ukushuba lolu ungqimba IMC eye elakhiwe, okubangela izinkinga ukwethembeka.