Ngaphezu kokuvinjwa komugqa wesiginali we-RF, ukwakheka kwe-lamined ye-RF PCB ibhodi eyodwa nakho kudinga ukubheka izingqinamba ezinjengokudilizwa kokushisa, okwenziwayo, amadivayisi, i-EMC, isakhiwo kanye nomphumela wesikhumba. Imvamisa sikusezingeni kanye nokufakwa kwamapulangwe aphrintiwe ama-multilayer. Landela izimiso ezithile eziyisisekelo:
A) Ungqimba ngalunye lwe-RF PCB lumbozwe yindawo enkulu ngaphandle kwendiza yamandla. Izendlalelo ezingaphezulu nezingaphansi eziseduze kwe-RF Wiring ungqimba kufanele kube izindiza zomhlaba.
Noma ngabe kuyibhodi ehlanganisiwe yedijithali, ingxenye yedijithali ingaba nendiza yamandla, kepha indawo ye-RF isenokuhlangabezana nesidingo sendawo enkulu edonsayo esitezi ngasinye.
B) ngephaneli ephindwe kabili ye-RF, ungqimba oluphezulu lungqimba lwesiginali, futhi ungqimba olungaphansi luyindiza yomhlaba.
Ibhodi elilodwa le-RF le-RF Ezimweni ezikhethekile, ezinye izimpawu zesiginali ye-RF zingasetshenziswa engqikithini lesithathu. Izingqimba eziningi zamabhodi e-rf, njalonjalo.
C) Ukuze uthole i-rf backplane, izingqimba ezingaphezulu nangaphansi zaphansi zisendaweni ethile. Ukuze unciphise ukunqamulwa kwe-impedance okubangelwa yi-vias kanye nezixhumi, owesibili, wesithathu, owesine, nezendlalelo zesihlanu zisebenzisa amasiginali edijithali.
Ezinye izingqimba ze-stripline ezansi ezingaphansi ziyizingqimba ezingezansi zesiginali. Ngokufanayo, lezi zingqimba zombili eziseduze ze-RF Signal ungqimba kufanele zibe yindawo, futhi ungqimba ngalunye kufanele lumbozwe ngendawo enkulu.
D) Amandla aphezulu, amabhodi aphezulu we-RF, isixhumanisi esikhulu se-RF kufanele sibekwe engxenyeni ephezulu futhi exhunywe ngomugqa obanzi we-microsrip.
Lokhu kulungele ukushisa ukushisa kanye nokulahleka kwamandla, kunciphisa amaphutha wokugqwala ngentambo.
E) Indiza yamandla yengxenye yedijithali kufanele ibe seduze kwendiza yomhlabathi futhi ihlelwe ngezansi kwendiza yomhlabathi.
Ngale ndlela, amandla phakathi kwalawa mapuleti amabili ensimbi angasetshenziswa njenge-capacitor ebushelelezi yokuhlinzekwa kwamandla, futhi ngasikhathi sinye, indiza yomhlabathi ingavimbela futhi i-radiation yamanje esatshalaliswa endizeni yamandla.
Izidingo ezithile zokufaka kanye nezidingo zokuhlukaniswa kwezindiza zingabhekisela kwizidingo ze- "20050818 eziphrintiwe eziphrintiwe ze-EMPLITED BOSPION SPRICE-EMC" ezikhuliswe ngumnyango we-EDA Design, futhi izindinganiso ze-inthanethi zizonqoba.
2
Izidingo ze-Wiring Board RF
Ikona
Uma umkhondo wesiginali we-RF uhamba ngama-engeli angakwesokudla, ububanzi obusebenzayo emakhoneni buzokwanda, futhi ukubulawa kuzoba ukunqatshwa futhi kubangele ukuboniswa. Ngakho-ke, kuyadingeka ukubhekana namakhona, ikakhulukazi ngezindlela ezimbili: ukusika ekhoneni kanye nokujikeleza.
(1) Ikona elisikiwe lilungele ukugoba okuncane, futhi imvamisa efanelekile ekhoneni elisikiwe lingafinyelela ku-10ghtz
(2) I-radius ye-argle angle kufanele ibe nkulu ngokwanele. Ngokuvamile, qinisekisa: r> 3w.
2.2 MicroSTrip Wiring
Ungqimba oluphezulu lwe-PCB luthwala isinali ye-RF, futhi ungqimba lwendiza ngaphansi kwesiginali ye-RF kumele kube yindiza ephelele yomhlaba ukwakha isakhiwo somugqa we-microstrip. Ukuqinisekisa ubuqotho bezinhlekelele bomugqa we-microstrip, kunezidingo ezilandelayo:
(1) Imiphetho ezinhlangothini zombili zomugqa we-microSTrip kumele okungenani ibe yi-3W ububanzi emaphethelweni endiza yomhlaba ngezansi. Futhi ebangeni le-3W, akumelwe kube khona i-vias engasekelwe esisekelweni.
(2) Ibanga phakathi komugqa we-microSTrip nodonga lokuvikela kufanele lugcinwe ngenhla kwe-2w. (Qaphela: w ububanzi be-LINE).
. Isikhala se-hole singaphansi kwe-λ / 20, futhi bahlelwa ngokulinganayo.
Unqenqema lomhlabathi we-Copper Foil kufanele bube bushelelezi, bube bushelelezi, futhi akukho burrs obukhali. Kunconywa ukuthi umphetho wethuli lomhlabathi-clad mkhulu kune- noma ulingane nobubanzi be-1.5w noma i-3H kusuka emaphethelweni womugqa we-micro micross, futhi imele ubukhulu be-microSCRIP substrate mediate.
(4) Kwenqatshelwe nge-Wiring yesiginali ye-RF ukuwela igebe lendiza lomhlabathi lesendlalelo sesibili.
2.3 i-wiring wiring
Isibonakaliso se-Radio Frequency kwesinye isikhathi sidlula engxenyeni ephakathi ye-PCB. Okuvame kakhulu kusuka engqikingeni lesithathu. Izendlalelo zesibili nelesine kumele zibe yindiza ephelele yomhlaba, okungukuthi, isakhiwo se-stripline e-eccentric. Ubuqotho bezinhlekelele komugqa we-strip buzoqinisekiswa. Izidingo zizoba:
.
(2) Kwenqatshelwe nge-stripline ye-RF ukuwela igebe phakathi kwezindiza ezingaphezulu neziphansi zomhlaba.
. Isikhala se-hole singaphansi kwe-λ / 20, futhi bahlelwa ngokulinganayo. Unqenqema lomhlabathi we-Copper Foil kufanele bube bushelelezi, bube bushelelezi futhi akukho burrs obukhali.
Kunconywa ukuthi umphetho we-Ground-Clad Copper Skin ukhulu noma ulingana nobubanzi be-1.5w noma ububanzi be-3H kusuka emaphethelweni omugqa we-strip. I-H imele ubukhulu obuphelele bezendlalelo ze-dielectric ezingenhla nephansi zomugqa we-strip.
. kukhishwe ngaphandle.