Ukuze kube lula ukukhiqiza nokukhiqiza, i-PCBpcb circuit board jigsaw ngokuvamile kufanele idizayine i-Mark point, i-V-groove, kanye ne-processing edge.
PCB ukubukeka design
1. Uhlaka (i-clamping edge) yendlela yokuhlanganisa ye-PCB kufanele yamukele isikimu sedizayini yokulawula iluphu evaliwe ukuze kuqinisekiswe ukuthi indlela yokuhlanganisa ye-PCB ayigogeki kalula ngemva kokulungiswa kwesakhiwo.
2. Ububanzi obuphelele bendlela ye-PCB yokuhlanganisa ≤260Mm (umugqa we-SIEMENS) noma ≤300mm (umugqa we-FUJI); uma i-gluing ezenzakalelayo idingeka, ububanzi obuphelele bendlela ye-PCB yokuhlanganisa ingu-125mm × 180mm.
3. Ukwakheka kokubukeka kwendlela yokugibela ye-PCB kuseduze nesikwele ngangokunokwenzeka, futhi kunconywa kakhulu ukusebenzisa 2×2, 3×3, … kanye nendlela yokugibela; kodwa akudingekile ukupela amabhodi amahle kanye namabhodi;
pcbV-Sika
1. Ngemva kokuvula i-V-cut, ukujiya okusele X kufanele kube (1/4～1/3) ubukhulu bepuleti L, kodwa ubuncane bokujiya X kumele bube ≥0.4mm. Imikhawulo iyatholakala kumabhodi anemithwalo esindayo, futhi imikhawulo ephansi iyatholakala kumabhodi anemithwalo elula.
2. Ukufuduka kuka-S kwesilonda ohlangothini lwesobunxele nakwesokudla se-V-cut kufanele kube ngaphansi kuka-0 mm; ngenxa yomkhawulo omncane wokujiya onengqondo, indlela ye-V-cut splicing ayifanele ibhodi enogqinsi olungaphansi kuka-1.3mm.
Maka iphuzu
1. Lapho usetha iphoyinti elijwayelekile lokukhetha, ngokuvamile phuma endaweni engenakuvinjelwa engavinjelwe engu-1.5 mm enkulu kunomngcele wendawo yokukhetha.
2. Isetshenziselwa ukusiza i-electronic optics yomshini wokubeka i-smt ukuthola ngokunembile ikhona eliphezulu lebhodi le-PCB elinezingxenye ze-chip. Kukhona okungenani amaphuzu amabili okulinganisa ahlukene. Amaphuzu okulinganisa okubekwa okunembile kwe-PCB yonke ngokuvamile aba ucezu olulodwa. Ukuma okuhlobene kwekhona eliphezulu le-PCB; izindawo zokulinganisa zokuma okunembile kwe-PCB enezingqimba ze-electronic Optics ngokuvamile zisekhoneni eliphezulu lebhodi lesekhethi ye-PCB egqinsiwe.
3. Ezingxenyeni ze-QFP (iphakheji eliyisikwele eliyisikwele) elinezikhala zezintambo ≤0.5 mm kanye ne-BGA (iphakheji yohlu lwegridi yebhola) enezikhala zebhola ≤0.8 mm, ukuze kuthuthukiswe ukunemba kwe-chip, icaciswa ukusetha kokubili. amakhona aphezulu ephuzu Lokukala le-IC.
ukucubungula uhlangothi lobuchwepheshe
1. Umngcele phakathi kohlaka nebhodi eliyinhloko langaphakathi, indawo ephakathi kwebhodi elikhulu nebhodi elikhulu akufanele libe likhulu noma lilengele, futhi unqenqema lwedivayisi ye-elekthronikhi nebhodi lesifunda le-PCBpcb kufanele lishiye ngaphezu kuka-0.5 mm wangaphakathi. isikhala. Ukuqinisekisa ukusebenza okuvamile laser cutting CNC izindwani.
Izimbobo zokubeka eziqondile ebhodini
1. Isetshenziselwa ukuma okunembile kwayo yonke ibhodi yesifunda ye-PCB yebhodi lesifunda le-PCBpcb kanye namamaki ajwayelekile okubekwa okunembile kwezingxenye ezinezikhala ezinhle. Ngaphansi kwezimo ezijwayelekile, i-QFP enesikhawu esingaphansi kuka-0.65mm kufanele isethwe ekhoneni layo eliphezulu; Amamaki ajwayelekile okuma anembile ebhodi lendodakazi ye-PCB yebhodi kufanele asetshenziswe ngababili futhi abekwe emakhoneni aphezulu ezici zokuma ezinembile.
2. Izikhala ezinembile zokuma noma izimbobo zokubeka ezinembile kufanele zigcinelwe izingxenye ezinkulu ze-elekthronikhi, ezifana nojeke be-I/O, imibhobho, ojeke bebhethri abangaphinda bashajwe, amaswishi e-toggle, ojeke be-earphone, amamotho, njll.
Umklami omuhle we-PCB kufanele acabangele izici zokukhiqiza nokukhiqiza lapho ethuthukisa uhlelo lokuklama iphazili ukuze aqinisekise ukukhiqizwa nokucubungula okulula, ukuthuthukisa ukukhiqiza, nokunciphisa izindleko zomkhiqizo.
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