Iphakheji ye-DIP(I-Dual In-line Package), eyaziwa nangokuthi ubuchwepheshe bokupakisha okukabili emgqeni, isho ama-chips esekethe ahlanganisiwe apakishwa ngendlela ekabili emugqeni. Inombolo ngokuvamile ayidluli ku-100. I-chip ye-CPU ehlanganisiwe ye-DIP inemigqa emibili yamaphini okumele afakwe kusokhethi ye-chip enesakhiwo se-DIP. Yiqiniso, ingabuye ifakwe ngokuqondile ebhodini lesifunda elinenombolo efanayo yezimbobo ze-solder kanye nokuhlelwa kwejometri ye-soldering. Ama-chips apakishwe nge-DIP kufanele axhunywe futhi akhishwe kusokhethi se-chip ngokucophelela okukhethekile ukugwema ukulimala kwezikhonkwane. Amafomu esakhiwo sephakeji ye-DIP yilawa: i-DIP ye-ceramic ye-multi-layer ye-ceramic DIP, i-DIP ye-ceramic yongqimba olulodwa, i-DIP yohlaka oluholayo (kubandakanya uhlobo lokuvala uphawu lwengilazi ye-ceramic, uhlobo lwesakhiwo sokupakisha sepulasitiki, uhlobo lokupakisha lwengilazi encibilikayo ye-ceramic)

Iphakheji ye-DIP inezici ezilandelayo:

1. Ilungele ukushiswa kwe-perforation ku-PCB (ibhodi lesifunda eliphrintiwe), kulula ukuyisebenzisa;

2. Isilinganiso phakathi kwendawo ye-chip nendawo yephakheji sikhulu, ngakho-ke ivolumu nayo inkulu;

I-DIP iyiphakheji ye-plug-in ethandwa kakhulu, futhi izinhlelo zayo zifaka i-IC ejwayelekile ye-logic, inkumbulo kanye namasekhethi e-microcomputer. Eyokuqala engu-4004, 8008, 8086, 8088 namanye ama-CPU wonke asetshenziswa amaphakheji e-DIP, futhi imigqa emibili yezikhonkwane kuwo ingashuthekwa ezikhaleni ebhodini lomama noma ithengiswe ebhodini lomama.