Iphakethe le-DIP(Iphakethe le-Dual in-line), elaziwa nangokuthi ubuchwepheshe bokupakisha obubili be-in-line, buyabhekisa kuma-chip ahlanganisiwe ahlanganiswe ngefomu le-in-line. Inombolo ngokuvamile ayidluli ama-100. I-CIP efakwe i-CPU chip inezintambo ezimbili zezikhonkwane ezidinga ukufakwa kwisokhethi le-chip ngesakhiwo se-chip. Vele, ingafakwa ngqo ebhodini lesekethe elinenombolo efanayo yezimbobo ze-solder kanye nelungiselelo lejometri lokuthengisa. Ama-Chips ahlanganiswe nge-DIP kufanele axhunywe futhi afakwe ngaphakathi kusokhethi le-chip ngokunakekelwa okukhethekile ukugwema ukulimala kwezikhonkwane. Amafomu we-DIP Package Adfords yile: I-Multi-ungqimba ceramic dip dip, i-single-ungqimba ceramic dip dip, i-leadfle yohlaka lwe-ceramic

I-DIP Package inezimpawu ezilandelayo:

1. Kuyamangaza ukuthi i-Welding ye-Welding ku-PCB (I-Prints Circuit Board), Kulula ukusebenza;

2. Isilinganiso esiphakathi kwendawo ye-chip nendawo yephakheji inkulu, ngakho-ke ivolumu likhulu futhi;

I-DIP iyiphakethe elidume kakhulu le-plug-in, futhi izinhlelo zalo zifaka phakathi i-IGOCE ENCOGIC, Memory kanye neMicrocomputer Circuits. Esekuqaleni 4004, 8008, 8086, 8088 namanye ama-CPU asetshenzisiwe wonke amaphakethe we-DIP, futhi imigqa emibili yezikhonkwane kuwo ingafakwa kuma-slots ku-makeboard noma ithengiswe kubhodi lomama.