Turnkey product design services

Awọn iṣẹ apẹrẹ ọja Turnkey

Ni Fastline a ṣe amọja lori apẹrẹ awọn ẹrọ IoT ati iṣelọpọ.

Apẹrẹ ile-iṣẹ

Lati imọran si iṣẹ-ọnà

A ṣakoso gbogbo ilana apẹrẹ ile-iṣẹ. Lati iṣiro oni-nọmba ati aesthetics si titete apakan ati apejọ.

Enjinnia Mekaniki

Fastline nipa oniru

Ihamọ iwọn ti awọn ohun elo ti o wọ jẹ ki apẹrẹ wọn jẹ ọgbọn amọja. Awọn onise-ẹrọ wa mọ awọn ipalara ati bi a ṣe le yago fun wọn. Pẹlu imọ-jinlẹ jinlẹ ni aaye, a bo gbogbo facet lati apẹrẹ nipasẹ si iṣelọpọ ati aabo olumulo.

Apẹrẹ ọja fun iṣelọpọ ati apejọ (DFMandDFA)

Apẹrẹ fun ailewu, igbẹkẹle, lilo, ati modularity

Itanna ati Mechanical Bill-of- elo (BOM) isakoso

Eto Ibeere Ohun elo (MRP)

Jiometirika Dimensioning ati Tolencig

Ifarada akopọ-soke onínọmbà

Imudara iye owo

Apẹrẹ fun darí ati ki o gbona wahala

Akosile ọja

Awọn iwe aṣẹ deede fun kongẹ
gbóògì

Pari, awọn iwe aṣẹ deede jẹ pataki fun pinpin awọn ibeere ọja pẹlu olupese adehun kan. Ni Fastline ẹgbẹ wa ti o ni iriri ṣe agbekalẹ iwe si awọn iṣedede ISO ti kariaye, gbigba iyipada didan si iṣelọpọ pupọ.

Fun darí awọn ẹya ara ati pilasitik

Awọn aworan apakan / SUBASSY / ASSY .Apá / SUBASSY / ASSY CAD awọn faili

Fun Tejede Circuit Board Apejọ

.Gerber faili oniru ati (Apẹrẹ fun Manufacturing) DFM onínọmbà
Awọn faili Gerber pupọ pẹlu ọrọ alaye ti o rọrun faili README
.Board Layer Stack soke
Bill of Materials pẹlu kikun apakan awọn orukọ / awọn nọmba fun idiwon pack opoiye ti 3k + sipo ati ọpọ yiyan fun palolo irinše
.Mu ati ki o gbe faili / Akojọ placement paati .Assembly schematics
.PCB Golden Ayẹwo fun benchmarking

Fun titẹ sii ati iṣakoso didara iṣelọpọ

.Awọn itọnisọna idanwo
.Input igbeyewo fun kọọkan apakan (ti o ba beere) ati ki o wu lati wa ni won
Ṣiṣan idanwo iṣelọpọ fun Awọn apakan / SUBASSY / ASSY ati Apejọ Ipari (FA) awọn ipele idanwo ẹrọ
Awọn ibeere iṣelọpọ ati awọn pato
.Ayẹwo jigs ati amuse

Hardware oniru

Išẹ ti o ga julọ nipasẹ apẹrẹ

Apẹrẹ ohun elo jẹ ifosiwewe bọtini ni ṣiṣe ipinnu aṣeyọri ti wearable. Imọye wa ṣe abajade ni ohun elo gige-eti ti o ṣe iwọntunwọnsi awọn ifosiwewe bii apẹrẹ agbara kekere ati ṣiṣe agbara, pẹlu aesthetics ati iṣẹ.

Apẹrẹ ti PCB Stack soke, ohun elo yiyan ati mojuto akọkọ be

Apẹrẹ ti multilayer High - iwuwo Interconnector PCBs

Apẹrẹ ti eka apẹrẹ Awọn iyika Titẹ Irọrun-tinrin (FPC)

Awọn iṣẹ akanṣe hardware nipa lilo ọpọlọpọ awọn MCUs

Idagbasoke ti Kekere - Awọn iyika Iṣakoso Agbara Agbara (PMCs) fun awọn ẹrọ ifosiwewe fọọmu kekere

Iṣiro ti Awọn ibatan Dielectric Constant (εr)

Itanna kikọlu (EMI) idabobo fun kosemi PCBs

Idagbasoke ti PCB igbeyewo methodologies

Imuse ti o pọju itanna idogba ati Electrostatic Discharge (ESD) Idaabobo Circuit eto

Apẹrẹ ti iṣakoso batiri ati awọn eto aabo fun idii batiri LiPo

Apẹrẹ famuwia

Ilé ni iṣakoso awọn orisun to dara julọ

Awọn agbara sisẹ akoko gidi ti IoT ṣe pataki ilosi giga. Lati pade awọn ibeere ibeere wọnyi, ẹgbẹ wa ti awọn onimọ-ẹrọ famuwia ṣe amọja ni sisọ agbara kekere, famuwia ti o munadoko fun awọn orisun to dara julọ ati iṣakoso agbara.

Idagbasoke ti o da lori Lainos ifibọ, Android, RTOS, Bare-Metal

Idagbasoke ti biometric ati awọn algorithms išipopada fun pulse oximetry, gyroscope / accelerometer, otutu, ati idahun awọ ara galvanic (GSR)

Asopọmọra Alailowaya (BLE, Wi-fi, LTE), awọn imudojuiwọn aabo lori afẹfẹ (OTA)

Idagbasoke famuwia fun ESP (ESP32), ST (STM32), Nordic (NRF32), Unisoc (SL8541E), Mediatek (W350), Goodix (GR551), Telink (TLSR9), Nations (N32), Realtek (RTL87), ajọṣọ (RTL87) DA14), Semtech (LR1110)

Idagbasoke batiri - awọn ohun elo daradara ati FWdrivers

Cellular ati Asopọmọra module design

Nmu awọn olumulo sopọ ati aabo

Ni asopọ ala-ilẹ IoT jẹ pataki. cellular ti a ṣe sinu ati awọn modulu Asopọmọra gba awọn olumulo laaye lati ṣii lati awọn fonutologbolori wọn. Ni Fastline ẹgbẹ ile-iṣẹ wa ni ero lati fi Asopọmọra didara ga julọ ti o jẹ ki awọn olumulo sopọ mọ ati alaye wọn ni aabo.

01 Igbohunsafẹfẹ Radio (RF) Imọ ọna, kikopa, ati ibaramu

02 IoTSIM Applet fun Ibaraẹnisọrọ Ipari Ipari-2-Ipamọ (IoTSAFE) ni ibamu

03 IoT Aabo Foundation (IoTSF) ni ibamu.

04 Imuse ti SIM ti a fi sinu (eSIM)/Kaadi Circuit Integrated Universal (eUICC) ti a fi sinu Ipele Ipele Ipele Wafer (WLCSP) tabi Fọọmu Fọọmu Ẹrọ-si-ẹrọ (MFF2)

Isọdiwọn 05 RF fun awọn atọkun alailowaya bii LTE, GSM, Wi-Fi, BT, GNSS ati bẹbẹ lọ.

LDS ati Chip eriali ilẹ ofurufu design

.Laser Direct Structuring (LDS) ati Chip Antennas ilẹ ofurufu ti PCB design

.LDS ati Chip eriali prototyping, iṣapeye, ati afọwọsi

Awọn Batiri Aṣa

Agbara to munadoko

Iwapọ Fit

Lilo ọgbọn ti aaye jẹ pataki ni imọ-ẹrọ wearable. Nitorinaa, awọn batiri gbọdọ jẹ daradara ati pese iwuwo agbara giga.
A ṣe iranlọwọ pẹlu apẹrẹ ati iṣelọpọ awọn orisun agbara lati pade awọn ibeere ọja deede ti awọn ẹrọ ifosiwewe fọọmu kekere.

Module Design

Ifọwọsi

Alagbase olupese

Ijẹrisi aabo

Ijẹrisi UL

Afọwọkọ

Mu imọ-ẹrọ wearable lati apẹrẹ si iṣelọpọ

Prototyping jẹ ilana bọtini ni idagbasoke ti imọ-ẹrọ wearable. Ju gbogbo rẹ lọ, o ngbanilaaye fun iwadii olumulo-ipari, titọ-tuntun
ti iriri olumulo ati pe o le mu idalaba iye ọja rẹ pọ si. Awọn ilana iṣapẹẹrẹ wa n pese ipilẹ ti o ni iduroṣinṣin fun ijẹrisi ọja, gbigba data ati gige idiyele.

Ṣiṣe iṣelọpọ

Iṣelọpọ didara-giga ni idiyele kekere

A pese ijumọsọrọ ati atilẹyin jakejado ilana iṣelọpọ. Ẹgbẹ iṣakoso iṣelọpọ wa ni igbẹhin si mimu ati imudarasi didara ọja lakoko idinku awọn idiyele iṣelọpọ ati awọn akoko idari.

01 Olupese Orisun

02 Apẹrẹ fun iṣelọpọ (DFM)

03 Apejọ

04 Idanwo iṣẹ-ṣiṣe (FCT) ati Iṣakoso Didara

05 Iṣakojọpọ ati eekaderi

Ijẹrisi ọja

Ibamu fun ọja agbaye

Nini ibamu pẹlu awọn iṣedede kariaye jẹ akoko ti n gba, ilana eka ti o ṣe pataki lati jẹki tita kọja awọn agbegbe eto-ọrọ. NiLaini iyara, A ni kikun loye awọn ilana ati awọn ilana lati rii daju pe awọn ọja wa pade awọn iṣedede okun.

01 Awọn ilana igbohunsafẹfẹ redio (CE, FCC, RED, RCM)

02 Awọn iṣedede ailewu gbogbogbo (CE, WEEE, ROHS, REACH, CPSIA),

03 Awọn Ilana Aabo Batiri (UL, UN 38.3, IEC-62133-2) ati diẹ sii.