1. Umphezulu wePCB: OSP, HASL, I-HASL engenalo iLead, iTin yokuntywila, i-ENIG, iSilver yokuntywila, iHard gold plating, Ukufaka igolide kwibhodi yonke, umnwe wegolide, ENEPIG...
I-OSP: ixabiso eliphantsi, ukuthengiswa okulungileyo, iimeko zokugcina ezinzima, ixesha elifutshane, itekhnoloji yokusingqongileyo, i-welding elungileyo, igudileyo ...
HASL: idla ngokuba multilayers HDI PCB Samples (4 – 46 layers), sele isetyenziswe ngonxibelelwano ezininzi ezinkulu, iikhompyutha, izixhobo zonyango kunye namashishini aerospace kunye neeyunithi zophando.
Umnwe weGolide: lunxibelelwano phakathi kwendawo yememori kunye ne-chip yememori, zonke iimpawu zithunyelwa ngomnwe wegolide.
Umnwe wegolide ubandakanya inani lezinto zokunxibelelana zegolide, ezibizwa ngokuba "ngomnwe wegolide" ngenxa yomgangatho wazo wegolide kunye nokucwangciswa okufana neminwe. Umnwe weGolide ngokwenene USEBENZISA inkqubo ekhethekileyo yokwambathisa intsimbi yobhedu ngegolide, exhathisa kakhulu kwi-oxidation kunye ne-conductive kakhulu. Kodwa ixabiso legolide liyabiza, i-tin plating yangoku isetyenziselwa ukubuyisela imemori eninzi. Ukusukela kwinkulungwane yokugqibela yee-90s, izinto ze-tin zaqala ukusasazeka, i-motherboard, inkumbulo, kunye nezixhobo zevidiyo ezinje “ngomnwe wegolide” phantse zisoloko zisetyenziswa imathiriyeli yetin, kuphela ezinye izixhobo ezisebenza kakhulu/izixhobo zokusebenzela eziya kuthi ziqhagamshelane nendawo yokuqhubeka umkhuba wokusebenzisa igolide ecandiweyo, ngoko ke ixabiso linexabiso elincinci.
2. Kutheni kufuneka usebenzise ibhodi yegolide?
Ngokudityaniswa kwe-IC ephezulu nangaphezulu, iinyawo ze-IC zixinene ngakumbi. Ngelixa inkqubo yokutshiza ye-tin ethe nkqo kunzima ukuvuthela i-welding pad ye-flat, ezisa ubunzima ekufakeni i-SMT; Ukongezelela, ubomi beshelufu yepleyiti yokutshiza i-tin bufutshane kakhulu. Nangona kunjalo, ipleyiti yegolide isombulula ezi ngxaki:
1.) Kwitekhnoloji yokunyuswa komphezulu, ngakumbi kwi-0603 kunye ne-0402 i-ultra-small table mount, kuba i-flatness ye-welding pad ihambelana ngokuthe ngqo nomgangatho wenkqubo yokushicilela i-solder paste, ngasemva komgangatho we-welding welding has. Impembelelo eqinisekileyo, ke, yonke ipleyiti yegolide ebekwe ekuxineni okuphezulu kunye nethekhnoloji encinci yokubeka itafile ihlala ibonwa.
2.) Kwinqanaba lophuhliso, iimpembelelo zezinto ezinje ngokuthengwa kwamacandelo kaninzi ayisiyiyo ibhodi ukuya kwiwelding kwangoko, kodwa kaninzi kufuneka ilinde iiveki ezimbalwa okanye iinyanga ngaphambi kokusetyenziswa, ubomi beshelufa yebhodi ebekwe ngegolide bude kune-terne. metal amaxesha amaninzi, ngoko ke wonke umntu ukulungele ukwamkela. Ngaphandle koko, i-PCB efakwe ngegolide kwiidigri zexabiso lesampulu yenqanaba xa kuthelekiswa neepleyiti zepewter
Kodwa ngocingo oluxineneyo ngakumbi nangakumbi, ububanzi bomgca, isithuba sifikelele kwi-3-4MIL
Ke ngoko, izisa ingxaki yesekethe emfutshane yocingo lwegolide: ngokunyuka rhoqo komqondiso, impembelelo yokuhanjiswa komqondiso kwiingubo ezininzi ngenxa yesiphumo solusu iya ibonakala ngakumbi.
(isiphumo solusu : I-high frequency alternating current, i-current will tend to concentrate on the surface of the flow of wire flow. Ngokwezibalo, ubunzulu bolusu bunxulumene nobuninzi.)
3. Kutheni usebenzise iPCB yegolide yokuntywiliselwa?
Kukho ezinye iimpawu zokuntywiliselwa kwi-PCB yegolide bonisa ngokulandelayo:
1.) Ulwakhiwo lwekristale olwenziwe ngokuntywiliselwa kwegolide kunye nokufakwa kwegolide lwahlukile, umbala wegolide wokuntywiliselwa uya kuba ulunge ngakumbi kunokubekwa kwegolide kwaye umthengi wanelisekile. Emva koko ukuxinzezeleka kwepleyiti yegolide ephantsi kwamanzi kulula ukuyilawula, ehambelana ngakumbi nokulungiswa kweemveliso. Kwangaxeshanye nangenxa yokuba igolide ithambile kunegolide, ngoko ke ipleyiti yegolide musa ukunxiba – umnwe wegolide oxhathisayo.
2.) Ukuntywiliselwa kweGolide kulula ukutyhutyha ngaphezu kokufakwa kwegolide, kwaye akuyi kubangela i-welding engafanelekanga kunye nezikhalazo zabathengi.
3.) igolide ye-nickel ifumaneka kuphela kwi-welding pad kwi-ENIG PCB, ukuhanjiswa komqondiso kwimpembelelo yesikhumba kwi-copper layer, engayi kuchaphazela umqondiso, kwaye musa ukukhokela i-short-circuit kwi-wire yegolide. I-soldermask kwisiphaluka idibaniswe ngakumbi kunye neengqimba zobhedu.
4.) Ubume bekristale bokuntywiliselwa kwegolide buxinene kuneplating yegolide, kunzima ukuvelisa i-oxidation.
5.) Akuyi kuba nefuthe kwizithuba xa imbuyekezo yenziwe
6.) Ukuba mcaba kunye nobomi bomsebenzi wepleyiti yegolide bufana nobo bepleyiti yegolide.
4. Ukuntywiliselwa kweGolide VS ukucwenga kweGolide
Kukho iintlobo ezimbini zetekhnoloji yokucoca igolide: enye yigolide yombane, enye yiImmersion Gold.
Kwinkqubo yegolide yegolide, umphumo we-tin uyancipha kakhulu, kwaye umphumo wegolide ungcono; Ngaphandle kokuba umenzi ufuna ukubophelela, okanye ngoku uninzi lwabavelisi baya kukhetha inkqubo yokutshona kwegolide!
Ngokubanzi, unyango lomphezulu we-PCB lunokwahlulwa lube lolu hlobo lulandelayo: ukufakwa kwegolide (i-electroplating, igolide yokuntywiliselwa), isilivere yokucwenga, i-OSP, i-HASL (kunye nangaphandle kwelothe), ezizezi FR4 okanye iipleyiti ze-CEM-3, isiseko sephepha. izinto kunye ne-rosin yokwaleka unyango lomhlaba; Kwitoti ihlwempuzekileyo (ukutya inkonkxa ihlwempu) oku ukuba ukususwa kwabenzi bentlama kunye nezizathu zokwenziwa kwezinto.
Kukho ezinye izizathu zengxaki yePCB:
I-1.Ngexesha lokuprintwa kwe-PCB, nokuba kukho i-oyile etyhutyha ifilimu kwi-PAN, inokuthintela umphumo we-tin; oku kunokuqinisekiswa ngovavanyo lwe-solder float
2.Ingaba indawo yokuhlobisa ye-PAN inokuhlangabezana neemfuno zokuyila, oko kukuthi, ingaba i-welding pad ingenziwa ukuze kuqinisekiswe ukuxhaswa kwamacandelo.
I-3.I-welding pad ayingcoliswanga, enokulinganiswa ngokungcoliswa kwe-ion.
Malunga nomphezulu:
I-Gold plating, inokwenza ixesha lokugcina i-PCB libe lide, kwaye ngokusingqongileyo kwangaphandle ubushushu kunye nokutshintsha kokufuma kuncinci (xa kuthelekiswa nolunye unyango olungaphezulu), ngokubanzi, kunokugcinwa malunga nonyaka; I-HASL okanye iholele i-HASL simahla yonyango lomphezulu wesibini, i-OSP kwakhona, unyango lomphezulu amabini kwindawo yobushushu kunye nexesha lokugcina ukufuma ukunikela ingqalelo kwizinto ezininzi phantsi kweemeko eziqhelekileyo, unyango lomphezulu wesilivere luhluke kancinci, ixabiso likwaphezulu, ukulondolozwa. iimeko zifuna ngakumbi, imfuneko yokusebenzisa akukho sulfur paper ukupakisha processing! Kwaye yigcine malunga neenyanga ezintathu! Kwisiphumo se-tin, igolide, i-OSP, i-tin spray iphantse ifane, abavelisi bafanele baqwalasele ukusebenza kweendleko!