Unyango ngaphambi kokutshona kobhedu

1. Ukuchithwa: I-substrate ihamba ngenkqubo yokomba ngaphambi kokuzika kobhedu. Nangona le nkqubo ithandeka kwi-burrs, yeyona ngozi ibalulekileyo efihliweyo eyenza i-metalization yemingxuma ephantsi. Kufuneka isebenzise indlela yetekhnoloji yokuhlawulela ukusombulula. Ngokuqhelekileyo iindlela zoomatshini zisetyenziselwa ukwenza umda womngxuma kunye nodonga lwangaphakathi lomngxuma ngaphandle kweebarbs okanye iplagi.
2. Ukunciphisa amafutha
3. Unyango olurhabaxa: ikakhulu ukuqinisekisa ukomelela okuhle kokubopha phakathi kwentsimbi kunye ne-substrate.
4. Unyango olusebenzayo: ikakhulu lwenza "iziko lokuqalisa" ukwenza i-copper deposition uniform.

Izinto ezibangela ukuba kubekho i-voids kwi-plating yodonga lomngxuma:
Umngxuma wokufakwa eludongeni lomngxuma obangelwa yi-1PTH
(1) Umxholo wobhedu, i-sodium hydroxide kunye ne-formaldehyde concentration kwi-copper sink
(2) Ubushushu bebhafu
(3) Ukulawulwa kwesisombululo sokusebenza
(4) Ukucoca ubushushu
(5) Ubushushu bokusetyenziswa, ugxininiso kunye nexesha le-pore modifier
(6) Sebenzisa ubushushu, ugxininiso kunye nexesha lokunciphisa i-arhente
(7) I-oscillator kunye ne-swing

2 Umngxuma wokufakwa kwi-voids yodonga olubangelwa kukudluliselwa kwepateni
(1) Ipleyiti yebrashi yonyango kwangaphambili
(2) Iglu eshiyekileyo kwi-orifice
(3) Unyango lwangaphambili lwe-micro-etching

3 Umngxuma wokufakwa eludongeni lwe-voids ebangelwa yipateni yokwaleka
(1) I-Micro-etching ye-pattern plating
(2) ITinning (itoti yelothe) ayinakusasazwa kakuhle

Kukho izinto ezininzi ezibangela i-coating voids, eyona nto ixhaphake kakhulu yi-PTH yokugqoka i-voids, enokunciphisa ngokufanelekileyo ukuveliswa kwe-PTH yokugqoka i-voids ngokulawula iiparitha zenkqubo efanelekileyo ye-potion. Noko ke, ezinye izinto azinakubethwa ngoyaba. Kuphela ngokuqwalaselwa ngokucophelela kunye nokuqonda izizathu zokugubungela i-voids kunye neempawu zeziphene ezinokuthi iingxaki zisonjululwe ngexesha elifanelekileyo kunye nomgangatho weemveliso unokugcinwa.