A. PCB factor factor process
1. Ukugqithisa ngokugqithiseleyo i-foil yobhedu
Ifoyile yobhedu ye-electrolytic esetyenziswa emarikeni idla ngokuba yigalvanized enecala elinye (eyaziwa ngokuba yifoyile yothuthu) kunye necala elinye lobhedu lokutyabeka (okwaziwa njengefoyile ebomvu). Ifoyile yobhedu eqhelekileyo idla ngokuba yifoyile yobhedu eyenziwe ngesinyithi ngaphezu kwe-70um, ifoyile ebomvu kunye ne-18um. Le foil ilandelayo yothuthu ayinakho ukwaliwa kobhedu lwebhetshi. Xa uyilo lwesekethe lungcono kunomgca we-etching, ukuba i-foil yobhedu iyatshintsha kodwa i-parameters etching ayitshintshi, oku kuya kwenza ukuba i-foil yobhedu ihlale kwisisombululo se-etching ixesha elide.
Ngenxa yokuba i-zinc ekuqaleni iyintsimbi esebenzayo, xa ucingo lobhedu kwi-PCB lufakwe kwisisombululo se-etching ixesha elide, luya kubangela ukugqwala okugqithisileyo komgca, kubangela ukuba umgca onqabileyo oxhasayo we-zinc usabele ngokupheleleyo kwaye wahlulwe. i-substrate, oko kukuthi, ucingo lobhedu luyawa.
Enye imeko kukuba akukho ngxaki PCB etching parameters, kodwa ukuhlamba kunye nokoma akulunganga emva etching, ebangela ucingo lobhedu ukuba singqongwe isisombululo etching eseleyo kumphezulu PCB. Ukuba ayicutshungulwanga ixesha elide, iya kuphinda ibangele ukufakwa kwecala locingo lobhedu olugqithisileyo kunye nokulahlwa. ubhedu.
Le meko idla ngokugxila kwimigca ebhityileyo, okanye xa imozulu ifumile, iziphene ezifanayo ziya kuvela kwiPCB yonke. Hlubula ucingo lobhedu ukuze ubone ukuba umbala wendawo yokudibanisa kunye nomgangatho wesiseko (into ebizwa ngokuba yi-roughened surface) itshintshile, eyahlukileyo kubhedu oluqhelekileyo. Umbala we-foil uhlukile. Into oyibonayo ngumbala wobhedu wokuqala womaleko ongezantsi, kwaye amandla exolo efoyile yobhedu kumgca ongqindilili nawo aqhelekile.
2. Ungquzulwano lwendawo lwenzeka kwinkqubo yokuvelisa iPCB, kwaye ucingo lobhedu lwahlulwa kwi-substrate ngamandla angaphandle omatshini.
Lo msebenzi ombi unengxaki yokubeka indawo, kwaye ucingo lobhedu luya kuguqulwa ngokucacileyo, okanye ukukrweleka okanye iimpawu zempembelelo kwicala elifanayo. Hlubula ucingo lobhedu kwindawo enesiphene kwaye ujonge kwindawo erhabaxa yefoyile yobhedu, unokubona ukuba umbala wobuso oburhabaxa befoyile yobhedu uqhelekile, akusayi kubakho mhlwa kwicala elibi, kunye namandla okuxobula. ifoyile yobhedu iqhelekile.
3. Uyilo lwesekethe yePCB olungenangqiqo
Ukuyila iisekethe ezibhityileyo ngefoyile yobhedu eshinyeneyo kuya kubangela ukubaleka okugqithisileyo kwesekethe kunye nokulahla ubhedu.
B.Isizathu senkqubo ye-laminate
Kwiimeko eziqhelekileyo, i-foil yobhedu kunye ne-prepreg iya kudibaniswa ngokupheleleyo nje kuphela icandelo lobushushu obuphezulu be-laminate lishushu licinezelekile ngaphezu kwemizuzu engama-30, ngoko ke ukucinezela akuyi kuchaphazela amandla okubambisana kwefoyile yobhedu kunye i-substrate kwi-laminate. Nangona kunjalo, kwinkqubo yokupakisha kunye nokupakisha i-laminates, ukuba ungcoliseko lwePP okanye ifoyile yobhedu umonakalo orhabaxa womphezulu, oko kuya kukhokelela kumandla angonelanga okudibanisa phakathi kwefoyile yobhedu kunye ne-substrate emva kokulanywa, okukhokelela ekuphambukeni kokubeka (kuphela amacwecwe amakhulu) iingcingo zobhedu ziyawa, kodwa ukomelela kwexolo lefoyile yobhedu kufutshane ne-off-line ayiqhelekanga.
C. Izizathu zelaminate ekrwada:
1. Njengoko kukhankanyiwe ngasentla, iifoyile zobhedu eziqhelekileyo ze-electrolytic zizo zonke iimveliso ezifakwe i-galvanized okanye i-copper-plated kwi-foil yoboya. Ukuba ixabiso lepeak ye-wool foil ayiqhelekanga ngexesha lokuvelisa, okanye xa i-galvanizing / i-copper plating, amasebe e-crystal yokucwenga ahluphekile, abangela i-foil yobhedu ngokwayo Amandla okuxobula akwanele. Emva kokuba icwecwe elibi elicinezelweyo lenziwe kwi-PCB, ucingo lobhedu luya kuwa ngenxa yempembelelo yamandla angaphandle xa lufakwa kwi-plug-in kumzi-mveliso wombane. Olu hlobo lokwaliwa kobhedu olubi aluyi kuba nomhlwa ocacileyo wecala xa uxobula ucingo lobhedu ukuze ubone indawo erhabaxa yefoyile yobhedu (oko kukuthi, umphezulu wokudibana kunye ne-substrate), kodwa amandla exolo efoyile yobhedu yonke iya kuba kakhulu. ihlwempu.
2. Ukulungelelaniswa okungahambi kakuhle kwe-foil yobhedu kunye ne-resin: Ezinye i-laminates ezineempawu ezikhethekileyo, ezifana namaphepha e-HTG, asetyenziswa ngoku, kuba inkqubo ye-resin ihluke, i-agent ephilisayo esetyenziswayo ngokubanzi i-PN resin, kunye ne-resin molecular chain structure ilula. Iqondo le-crosslinking liphantsi, kwaye kuyimfuneko ukusebenzisa i-foil yobhedu kunye nencopho ekhethekileyo ukuyifanisa. I-foil yobhedu esetyenziselwa ukuveliswa kwe-laminates ayihambelani nenkqubo ye-resin, okubangela ukungonelanga kwamandla e-peel ye-sheet metal-clad metal foil, kunye nokuchithwa kocingo lobhedu olubi xa ufaka.