A. I-A. PCB yeMicimbi yeFayile
I-1. Ukuhamba kakhulu kwe-foil yobhedu
I-moilper ye-electrolytic yobhedu esetyenziswe kwimarike yeyona nto isetyenziswayo engatshatanga (eyaziwa ngokuba yi-tish tiil) kunye nokubekwa ecaleni kwe-papper enye (okwaziwa ngokuba yi-foil ebomvu). I-foil yobhedu i-foil ye-piil ixhaphake kakhulu kwi-foariper yobhedu ngaphezulu kwe-77m, i-foil ebomvu kunye ne-18m. Le ndlu yokuhlamba ilandelayo ayikho ngokusisiseko ukwaliwa kobhedu. Xa kuyilo lwesekethe lungcono kunomgca we-etching, ukuba i-foil ye-foil ye-foil tions kodwa iiparamitha ze-etching azitshintshi, oku kuyakwenza ukuba i-foil yobhedu ihlale ixesha elide.
Kuba i-zinc ikwisinyithi esisebenzayo, xa ucingo lobhedu kwi-PCB lifakwe kwisisombululo se-etching ixesha elide, iya kubangela ukungabinamgca we-zinc, oko kukuthi, ucingo lobhedu luyawa.
Enye imeko kukuba akukho ngxaki kunye neparamitha yokuhlamba, kodwa ukuhlamba kunye nokoma akulunganga emva kokubekwa, kubangela ukuba ucingo lobhedu lujikelezwe sisisombululo se-etching eseleyo kumhlaba wePCB. Ukuba ayiqwalaselwa ixesha elide, iya kubangela i-cire egqithisileyo ye-etching kunye nokwaliwa. Ubhedu.
Le meko igxile ngokubanzi kwimigca emincinci, okanye xa imozulu inomswakama, iziphene ziya kuvela kwi-PCB iyonke. Hluza ucingo lobhedu ukuze ubone ukuba umbala womphezulu wayo kunye nomaleko wesiseko (obizwa ngokuba yi-rousched) itshintshile, eyahlukileyo kobhedu oluqhelekileyo. Umbala we-foil wahlukile. Into oyibonayo ngumbala wobhedu olwenziwe ongezantsi, kunye namandla e-Peel ye-foil yobhedu i-foil emgceni nayo iqhelekile.
2. Ukungqubana kwengingqi kwenzeka kwinkqubo yemveliso ye-PCB, kwaye ucingo lobhedu lwahlulwa kwi-substratey ngamandla angaphandle
Oku kusebenza kakubi kunengxaki yokubeka, kwaye ucingo lobhedu luya kujijeka, okanye lukrweqe okanye lukrweqe okanye luphawu lwefuthe kwicala elinye. Phola ucingo lobhedu kwilungu elineziphene kwaye ujonge umphezulu we-foil yobhedu, unokubona ukuba umbala womphezulu we-foil yobhedu oqhelekileyo, kwaye amandla obhengezo aqhelekileyo.
I-3. Uyilo lwesekethe olungenangqondo lwePCB
Ukuyila imijikelezo emihle nge-foil ye-foil yobhedu ikwanokubangela i-etching yesekethe kunye nokulahla ubhedu.
B. Isizathu senkqubo ye-lamite
Phantsi kweemeko eziqhelekileyo, i-foil yobhedu kunye ne-Preprere iya kudityaniswa ngokupheleleyo okoko isebe lamanzi amaqondo eline icinezelwe ngaphezulu kwemizuzu engama-30 icinezelwe i-Food Food kunye ne-chillate. Nangona kunjalo, kwinkqubo yokufaka kunye nokufaka imiphetha, ukuba ungcoliseko lwe-PP okanye i-foil ye-foil yomonakalo, kuya kukhokelela kumapleyili awonekiweyo, kodwa i-Poel ye-Poel ye-Poel ye-Worper ye-Off ingekhoyo.
C. Izizathu zeZinto zeMfazwe:
1. Njengoko sele kukhankanyiwe apha ngasentla, i-elektrolytical ye-electrolytic yobhedu zonke ziimveliso eziye zazezwa okanye zobhedu kwi-copper kwi-Woodol Foil. Ukuba ixabiso le-piak yoboya lwemizila yoboya ingaqhelekanga ngexesha lokuveliswa, okanye xa i-gavaning / ukubekwa kobhedu, amasebe e-crystal bahlwempuzekile, ebangela ukuba ubhedu banele. Emva kwe-foil embi ye-foil icinezelwe i-PCB yenziwa kwi-PCB, ucingo lobhedu luya kuwa ngenxa yefuthe lamandla angaphandle xa ingena kumzi-mveliso we-elektroniki. Olu hlobo lokungafunwa kobhedu oluhlwempuzekileyo aluyi kuba nokubonakala kwecala lokungazicingeli xa kusenziwa umphezulu wobhedu lwe foil yobhedu
2. Ukulungelelaniswa okungalunganga kwe-foil ye-capper foil kunye ne-resin: amanye amaqela anepropathi ekhethekileyo, afana ne-HTG Fars, esetyenziswayo ngoku, kuba i-resen ye-pin ilula. Inqanaba lokucofa inqamleza, kwaye kuyimfuneko ukusebenzisa i-foil yobhedu ngencam ekhethekileyo ukuyingqinelana nayo. I-foil yobhedu esetyenziselwa ukuveliswa kwamanzi ayihambelani nenkqubo ye-resin, ikhokelela kumandla aneleyo e-Poel-Clod Foil, kunye ne-Wire yoLawulo lwePosi ye-Foire, kunye ne-wire engalunganga yokufaka.