Umngxuma ohambisa i-Via yaziwa ngokuba ngomngxuma.Ukuze kuhlangatyezwane neemfuno zabathengi, ibhodi yesekethe ngomngxuma kufuneka iplagwe.Emva kokuziqhelanisa okuninzi, inkqubo ye-aluminiyam yesiqhelo yokuplaga iyatshintshwa, kwaye imaski yebhodi yesekethe yomphezulu we-solder kunye neplagi igqitywe nge-mesh emhlophe.umngxuma.Imveliso ezinzileyo kunye nomgangatho othembekileyo.

I-Via hole idlala indima yokudibanisa kunye nokuqhuba iisekethe.Uphuhliso loshishino lombane lukwakhuthaza uphuhliso lwePCB, kwaye lukwabeka phambili iimfuno eziphezulu kwinkqubo yokwenziwa kwebhodi eprintiweyo kunye nobuchwepheshe bokunyusa umgangatho.Itekhnoloji yokuplaga yomngxuma ibekho, kwaye kufuneka ihlangabezane nezi mfuno zilandelayo ngaxeshanye:

(1) Kukho ubhedu kumngxuma odlulayo, kwaye isigqubuthelo sobuso sinokuxhunywa okanye singaxhunywanga;

(2) Kufuneka kubekho inkonkxa kunye nelothe kumngxuma odlulayo, kunye nemfuneko ethile yobukhulu (ii-microns ezi-4), kwaye akukho inki ye-solder yesigqumathelo kufuneka ingene emngxunyeni, ebangela ukuba amaso e-tin afihlwe emngxunyeni;

(3) Umngxuma wokuphumela kufuneka ube nomngxuma weplagi yesigqubuthelo sobuso, ovuleke, kwaye kufuneka ungabi nezangqa zenkcenkce, amaso enkcenkce, kunye neemfuno zokucaca.

Ngophuhliso lweemveliso ze-elektroniki kwicala "lokukhanya, elibhityileyo, elifutshane, nelincinci", ii-PCBs nazo ziphuhliselwe ukuxinana okuphezulu kunye nobunzima obukhulu.Ke ngoko, kuye kwavela inani elikhulu le-SMT kunye ne-BGA PCBs, kwaye abathengi bafuna ukuplaga xa kunyuswa izinto, ngakumbi kubandakanya imisebenzi emihlanu:

(1) Thintela inkonkxa ekudluleni kumphezulu wecandelo ngomngxuma ophumelayo ukwenza isekethe emfutshane xa iPCB ithengiswa;ingakumbi xa sibeka via kwi pad BGA, kufuneka siqale senze umngxuma iplagi emva koko ngegolide-atyatyekwe ukuba kube lula ukusoda BGA.

(2) Ziphephe iintsalela eziguquguqukayo kwimingxuma edlulayo;

(3) Emva kokunyuswa komphezulu kumzi-mveliso we-elektroniki kunye nokudityaniswa kwamalungu kugqityiwe, i-PCB kufuneka icocwe ukuze yenze uxinzelelo olubi kumatshini wovavanyo ukuze igqibezele:

(4) Thintela intlama yesolder engaphezulu ekungeneni emngxunyeni, ibangele ukusoda okungeyonyani kwaye kuchaphazele nokubekwa;

(5) Thintela iibhola zenkcenkce ukuba zingaphumi ngexesha le-wave soldering, ebangela iisekethe ezimfutshane.

Ukufezekiswa kweNkqubo yokuPlaga komngxuma ohambisayo

Kwiibhodi zokuxhoma umphezulu, ngakumbi ukunyuswa kwe-BGA kunye ne-IC, iplagi edlula umngxuma mayibe sicaba, iconvex kwaye ibe concave dibanisa okanye thabatha 1mil, kwaye akufuneki kubekho toti ebomvu kwincam yomngxuma odlulayo;Umngxuma ufihla ibhola yetoti, ukuze ufikelele kumthengi Ngokweemfuno, inkqubo yokuplaga ngomngxuma ngokudlula umngxuma ingachazwa njengeyahlukeneyo, inkqubo yokuhamba inde kakhulu, inkqubo yolawulo inzima, kwaye ioyile ihlala iwiswa ngexesha. umgangatho womoya oshushu kunye novavanyo lokumelana ne-oyile eluhlaza;iingxaki ezifana nokuqhuma kweoli emva kokuqina.Ngoku ngokweemeko zokwenyani zemveliso, iinkqubo ezahlukeneyo zokuplaga zePCB zishwankathelwa, kwaye ezinye uthelekiso kunye neenkcazo zenziwa kwinkqubo kunye nezibonelelo kunye nokungalunganga:

Qaphela: Umgaqo wokusebenza wokulinganisa umoya oshushu kukusebenzisa umoya oshushu ukususa i-solder engaphezulu ukusuka kumphezulu kunye nemingxuma yebhodi yesekethe eprintiweyo, kwaye i-solder eseleyo ifakwe ngokulinganayo kwiipads, imigca ye-solder engathintekiyo kunye neendawo zokupakisha zomhlaba, leyo yindlela yonyango yomphezulu yebhodi yesekethe eprintiweyo enye.

1. Inkqubo yokuplaga umngxuma emva komgangatho womoya oshushu
Ukuqukuqela kwenkqubo yile: imaski yesoda yomphezulu webhodi→HAL→umngxuma weplagi→ukunyanga.Inkqubo engeyiyo iplagi yamkelwe kwimveliso.Emva kokuba umoya oshushu ulinganisiwe, isikrini sephepha le-aluminiyam okanye isikrini sokuthintela i-inki sisetyenziselwa ukugqibezela ukuplaga ngomngxuma ofunwa ngumthengi kuzo zonke iinqaba.I-inki yomngxuma weplagi inokuba yi-inki ye-photosensitive okanye i-inki ye-thermosetting.Kwimeko yokuqinisekisa umbala ofanayo wefilimu emanzi, i-inki yomngxuma weplagi ingcono ukusebenzisa i-inki efanayo nomgangatho webhodi.Le nkqubo inokuqinisekisa ukuba imingxuma ngemingxuma ayiyi kuphulukana neoyile emva kokuba umoya oshushu ulinganiswe, kodwa kulula ukubangela ukuba i-inki yokuplaga ingcolise umphezulu webhodi kwaye ingalingani.Abathengi baxhomekeke kwi-soldering yobuxoki (ingakumbi kwi-BGA) ngexesha lokunyuka.Ke abathengi abaninzi abayamkeli le ndlela.

2. Inkqubo yokulinganisa umoya oshushu kumngxuma weplagi ongaphambili

2.1 Sebenzisa i-aluminiyam sheet ukuplaga umngxuma, ukuqinisa, kunye nokupolisha ibhodi ukuhambisa imizobo.

Le nkqubo yezobuchwepheshe isebenzisa umatshini wokulawula amanani ukukhupha iphepha le-aluminiyam ekufuneka iplagwe ukwenza isikrini, kwaye iplage imingxuma ukuqinisekisa ukuba i-pluging ye-aluminiyam igcwele.I-inki yomngxuma weplagi ingasetyenziswa kunye ne-inki ye-thermosetting.Iimpawu zayo kufuneka ziphakame ngobulukhuni., I-shrinkage ye-resin incinci, kwaye amandla okudibanisa kunye nodonga lomngxuma lulungile.Inkqubo yokuhamba yile: unyango lwangaphambili → umngxuma weplagi → ipleyiti yokusila → ugqithiso lwepateni → ukudibanisa → isigqubuthelo somphezulu webhodi

Le ndlela inokuqinisekisa ukuba umngxuma weplagi womngxuma odlulayo usicaba, kwaye akusayi kubakho zingxaki zobulunga ezifana nogqabhuko-dubulo lwe-oyile kunye nokuwa kwe-oyile ekupheleni komngxuma xa ulinganisa ngomoya oshushu.Nangona kunjalo, le nkqubo idinga ukuqina kwexesha elinye lobhedu ukwenza ubukhulu bobhedu bodonga lomngxuma buhlangabezane nomgangatho womthengi.Ngoko ke, iimfuno zokubeka ubhedu kwibhodi yonke ziphezulu kakhulu, kwaye ukusebenza komatshini wokugaya ipleyiti kuphezulu kakhulu, ukuqinisekisa ukuba i-resin ebusweni bobhedu isuswe ngokupheleleyo, kwaye ubuso bobhedu bucocekile kwaye alungcoliswanga. .Iifektri ezininzi ze-PCB azinayo inkqubo yobhedu yokutyebisa okwexesha elinye, kwaye ukusebenza kwezixhobo akuhlangabezani neemfuno, kubangele ukusetyenziswa kakhulu kwale nkqubo kwiifektri zePCB.

2.2 Emva kokuplaga umngxuma ngephepha le-aluminium, ngqo kwisikrini-printa imaski ye-solder yebhodi

Le nkqubo isebenzisa umatshini wokugaya i-CNC ukukhupha iphepha le-aluminium elidinga ukuxhunywa ukwenza isikrini, lifake kumatshini wokushicilela isikrini ukuze uvale umngxuma, kwaye upake ngaphandle kwemizuzu engama-30 emva kokuba iplagi igqityiwe, kwaye sebenzisa isikrini se-36T ukukhangela ngqo umphezulu webhodi.Inkqubo yokuhamba yile: unyango lwangaphambili-iplagi yomngxuma-isilika yesikrini-phambi kokubhaka-uveliso-uphuhliso-ukunyanga

Le nkqubo inokuqinisekisa ukuba i-via hole igutyungelwe kakuhle ngeoli, umngxuma weplagi usicaba, kwaye umbala wefilimu emanzi uyahambelana.Emva kokuba umoya oshushu ulungelelanisiwe, unokuqinisekisa ukuba umngxuma odlulayo awufakwanga kwaye i-bead ye-tin ayifihlwanga emngxunyeni, kodwa kulula ukwenza i-inki emngxunyeni emva kokunyanga.Iipads ze-soldering zibangela ukungahambi kakuhle kwe-solderability;emva kokuba umoya oshushu ulinganiswe, imida ye-bubble ye-vias kunye nokulahlekelwa yioli.Kunzima ukusebenzisa le nkqubo ukulawula imveliso, kwaye kuyimfuneko ukuba iinjineli zenkqubo zisebenzise iinkqubo ezikhethekileyo kunye neeparitha zokuqinisekisa umgangatho wemingxuma yeeplagi.

2.3 Iphepha le-aluminiyam liplagiswe emingxunyeni, liphuhliswe, lilungiswe kwangaphambili, lipolishwe, emva koko imaski ye-solder yenziwe phezulu.

Sebenzisa umatshini wokugaya we-CNC ukukhupha iphepha le-aluminiyam efuna imingxuma yokuplaga ukwenza isikrini, uyifake kumatshini wokushicilela wesikrini sokutshintsha kwimingxuma yokuplaga.Imingxuma yokuplaga kufuneka igcwale kwaye iphumele kumacala omabini, kwaye emva koko iqiniswe kwaye igaye ibhodi yonyango lomphezulu.Inkqubo yokuhamba yile: iplagi yangaphambili yonyango-iplagi umngxuma-phambi-ukubhaka-uphuhliso-ngaphambi kokunyanga-ibhodi umphezulu solder imaski

Ngenxa yokuba le nkqubo isebenzisa ukunyanga umngxuma weplagi ukuqinisekisa ukuba umngxuma odlulayo awuphulukani neoyile okanye uqhushumba emva kwe-HAL, kodwa emva kwe-HAL, kunzima ukuyisombulula ngokupheleleyo ingxaki yogcino lwe-tin bead kumngxunya kunye netoti kumngxuma odlulayo. abathengi abaninzi abayamkeli.

2.4 Imaski ye-solder kunye nomngxuma weplagi zigqitywa ngaxeshanye.

Le ndlela isebenzisa isikrini se-36T (43T), esifakwe kumatshini wokuprinta kwesikrini, usebenzisa i-pad okanye ibhedi yezikhonkwane, kwaye xa ugqibezela umphezulu webhodi, yonke imingxuma ephumayo ixhunyiwe.Inkqubo yokuhamba yile: pretreatment-screen printing- -Pre-baking-exposure-development-curing.

Ixesha lenkqubo lifutshane kwaye izinga lokusetyenziswa kwezixhobo liphezulu.Inokuqinisekisa ukuba imingxunya edlulayo ayizukuphulukana neoyile emva komgangatho womoya oshushu, kwaye imingxunya edlulayo ayizukufakwa.Nangona kunjalo, ngenxa yokusetyenziswa kwesikrini sesilika ukuplaga imingxuma, kukho isixa esikhulu somoya kwimingxuma., Umoya uyanda kwaye uqhekeza imaski ye-solder, okukhokelela kwimingxuma kunye nokungalingani.Kuya kubakho inani elincinci lokudlula kwimingxuma efihliweyo kwizinga lomoya oshushu.Okwangoku, emva kwenani elikhulu leemvavanyo, inkampani yethu ikhethe iintlobo ezahlukeneyo zeinki kunye ne-viscosity, yahlengahlengisa uxinzelelo loshicilelo lwesikrini, njl., kwaye ngokusisiseko yasombulula i-voids kunye nokungalingani kwe-vias, kwaye yamkele le nkqubo yobuninzi. imveliso.