Xa uyila PCB, omnye lo mbuzo isiseko ukuqwalasela kukuphumeza iimfuno imisebenzi yesekethe kufuneka kangakanani umaleko iingcingo, inqwelomoya emhlabeni kunye nenqwelomoya amandla, kunye eprintiweyo ibhodi yesekethe umaleko wiring, inqwelomoya emhlabeni kunye namandla. ukuzimisela kwendiza yenani leengqimba kunye nomsebenzi wesekethe, ingqibelelo yomqondiso, i-EMI, i-EMC, iindleko zokuvelisa kunye nezinye iimfuno.

Kuyilo oluninzi, kukho iimfuno ezininzi eziphikisanayo kwiimfuno zokusebenza kwePCB, iindleko ezijoliswe kuyo, iteknoloji yokuvelisa, kunye nobunzima benkqubo. Uyilo olulaminethiweyo lwe-PCB ludla ngokuba sisigqibo sokulalanisa emva kokuqwalasela izinto ezahlukeneyo. Iisekethe zedijithali ezihamba ngesantya esiphezulu kunye neesekethe ze-whisker zidla ngokuyilwa ngeebhodi ezininzi.

Nantsi imigaqo esibhozo yoyilo lwe-cascading:

1. Dukukhanya

Kwi-PCB ye-multilayer, ngokuqhelekileyo kukho i-signal layer (S), i-power supply (P) indiza kunye ne-grounding (GND) indiza. Inqwelomoya yamandla kunye nenqwelomoya ye-GROUND zidla ngokuba ziinqwelomoya eziqinileyo ezingacalulwanga eziza kubonelela ngendlela elungileyo yokubuya kwe-impedance ekhoyo ngoku yemigca yemiqondiso ekufutshane.

Uninzi lwemigangatho yemiqondiso ibekwe phakathi kwale mithombo yamandla okanye iileya zenqwelo-moya ezibhekiselele emhlabeni, zenza iilayini ezibhantiweyo ezilinganayo okanye ezilinganayo. Imigangatho ephezulu kunye nesezantsi ye-PCB ye-multilayer idla ngokusetyenziselwa ukubeka amacandelo kunye nexabiso elincinci le-wiring. Iingcingo zale miqondiso akufanele zibe nde kakhulu ukunciphisa imitha ethe ngqo ebangelwa yi-wiring.

2. Qinisekisa inqwelomoya yesalathiso samandla enye

Ukusetyenziswa kwe-decoupling capacitors ngumlinganiselo obalulekileyo wokusombulula ingqibelelo yokunikezelwa kwamandla. I-Decoupling capacitors inokubekwa kuphela phezulu nasezantsi kwePCB. Umzila we-capacitor decoupling, i-solder pad, kunye ne-hole pass iya kuchaphazela kakhulu umphumo we-decoupling capacitor, efuna ukuyila kufuneka ithathele ingqalelo ukuba umzila we-decoupling capacitor kufuneka ube mfutshane kwaye ube banzi kangangoko kunokwenzeka, kunye nocingo oluqhagamshelwe emngxunyeni kufuneka. kwakhona ube mfutshane kangangoko. Ngokomzekelo, kwisekethe yedijithali enesantya esiphezulu, kunokwenzeka ukuba ubeke i-capacitor yokuqhawula kumaleko aphezulu we-PCB, unike umaleko wesi-2 kwisekethe yedijithali enesantya esiphezulu (njengeprosesa) njengomaleko wamandla, umaleko 3 njengomaleko wesiginali, kunye ne-4 njengomhlaba wesekethe yedijithali enesantya esiphezulu.

Ukongeza, kuyimfuneko ukuba kuqinisekiswe ukuba umzila umqondiso iqhutywa isixhobo efanayo-high-speed yedijithali ithatha umaleko amandla efanayo njengoko inqwelomoya reference, kwaye lo maleko amandla umaleko unikezelo lwamandla kwisixhobo high-speed yedijithali.

3. Misela inqwelomoya yereferensi yamandla amaninzi

Inqwelomoya yesalathiso samandla amaninzi iya kwahlulwa ibe yimimandla emininzi eyomeleleyo enevoltheji ezahlukeneyo. Ukuba umgca wesignali usondelene ne-multi-power layer, i-signal current kwi-signal layer ekufutshane iya kuhlangana nendlela yokubuya enganelisiyo, eya kubangela izithuba kwindlela yokubuya.

Kwiimpawu zedijithali ezikhawulezayo, olu yilo lwendlela yokubuya olungenangqiqo lunokubangela iingxaki ezinzulu, ngoko ke kufuneka ukuba i-high-speed digital signal wiring kufuneka ibe kude ne-multi-power reference plane.

4.Misela iindiza ezininzi zesalathiso emhlabeni

 Iinqwelomoya ezininzi ezibhekiselele emhlabeni (iinqwelomoya eziphantsi komhlaba) zinokubonelela ngendlela efanelekileyo yokubuya kwe-low-impedance yangoku, enokunciphisa i-EMl eqhelekileyo. Inqwelomoya ephantsi komhlaba kunye nenqwelomoya yamandla kufuneka zidityaniswe ngokuqinileyo, kwaye umaleko womqondiso kufuneka udityaniswe ngokuqinileyo kwinqwelomoya ekufuphi. Oku kunokufezekiswa ngokunciphisa ubukhulu be-medium phakathi kweeleyile.

5. Yila indibaniselwano yeentambo ngokufanelekileyo

Amacandelo amabini agqitywe ngumzila wesignali abizwa ngokuba "yindibaniselwano ye-wiring". Eyona ndibaniselwano ye-wiring yenzelwe ukunqanda umbane obuyayo oqukuqelayo ukusuka kwenye inqwelomoya ukuya kwenye, kodwa endaweni yoko uqukuqela ukusuka kwindawo enye (ubuso) benqwelomoya enye ukuya kwenye. Ukuze ugqibezele i-wiring eyinkimbinkimbi, ukuguqulwa kwe-interlayer ye-wiring akunakugwenywa. Xa umqondiso uguqulwa phakathi kweengqimba, ukubuya kwangoku kufuneka kuqinisekiswe ukuba kuhamba kakuhle ukusuka kwelinye inqwelomoya ukuya kwelinye. Kuyilo, kunengqiqo ukuqwalasela iileya ezikufutshane njengendibaniselwano ye-wiring.

Ukuba indlela yomqondiso ifuna ukunweba iileya ezininzi, ngokuqhelekileyo ayilulo uyilo olufanelekileyo lokuyisebenzisa njengendibaniselwano yocingo, kuba indlela edlula kwiileya ezininzi ayinayo i-patchy kwimisinga yokubuya. Nangona intwasahlobo ingancitshiswa ngokubeka i-capacitor decoupling kufuphi nomngxuma wokudlula okanye ukunciphisa ubukhulu be-medium phakathi kweenqwelo-moya zokubhekisela, akusiyo uyilo oluhle.

6.Ukuseta umkhombandlela wocingo

Xa ulwalathiso lwe-wiring lusekwe kwinqanaba elifanayo lomqondiso, kufuneka liqinisekise ukuba uninzi lwezalathiso ze-wiring zihambelana, kwaye kufuneka zibe yi-orthogonal kwiindlela zocingo zeempawu zesignali ezikufutshane. Ngokomzekelo, ulwalathiso lwe-wiring yolunye uphawu lwesignali lunokusetwa kwi-"Y-axis" isalathiso, kwaye isalathiso se-wiring somnye umgca wesignali osondeleyo unokusetwa kwi-"X-axis" indlela.

7. AIchaphaze ubume obulinganayo 

Inokufunyanwa kwi-PCB eyilwe lamination ukuba uyilo lamination classical phantse yonke nkqu umaleko, kunokuba umaleko odd, le nto ibangelwa ezahlukeneyo izinto.

Ukusuka kwinkqubo yokwenziwa kwebhodi yesekethe eprintiweyo, sinokwazi ukuba yonke umaleko conductive kwibhodi yesekethe igcinwa kwi umaleko engundoqo, izinto umaleko core ngokubanzi ibhodi yokugquma emacaleni kabini, xa ukusetyenziswa ngokupheleleyo umaleko core. , umaleko wokuqhuba webhodi yesekethe eprintiweyo ilinganayo

Nkqu iibhodi zesekethe eprintiweyo umaleko zineenzuzo iindleko. Ngenxa yokungabikho komaleko wemithombo yeendaba kunye nokugqunywa kobhedu, ixabiso leeleya ezinamanani angaqhelekanga zemathiriyeli ekrwada ye-PCB lingaphantsi kancinane kunexabiso leeleya zePCB. Nangona kunjalo, iindleko zokusetyenzwa kwe-ODd-layer PCB ngokucacileyo ziphezulu kunezo ze-PCB zomaleko kuba i-ODd-layer PCB idinga ukongeza inkqubo yokudibanisa engundoqo elaminated engundoqo ngokwesiseko senkqubo yolwakhiwo olungundoqo. Xa kuthelekiswa nolwakhiwo oluqhelekileyo olungundoqo, ukongeza i-copper cladding ngaphandle kwe-core layer iya kukhokelela ekusebenzeni okuphantsi kwemveliso kunye nomjikelo wemveliso omde. Ngaphambi kwe-laminating, umaleko ongundoqo wangaphandle ufuna ukuqhutyelwa phambili okongeziweyo, okwandisa umngcipheko wokukrazula kunye nokuphosa umaleko wangaphandle. Ukuphathwa kwangaphandle okwandisiweyo kuya kwandisa kakhulu iindleko zokuvelisa.

Xa iileya zangaphakathi nangaphandle zebhodi yesekethe eprintiweyo zipholile emva kwenkqubo yokudibanisa i-multi-layer circuit bonding, i-lamination tension eyahlukileyo iya kuvelisa idigri ezahlukeneyo zokugoba kwibhodi yesekethe eprintiweyo. Kwaye njengoko ubukhulu bebhodi bukhula, umngcipheko wokugoba ibhodi yesiphaluka edibeneyo eprintiweyo kunye nezakhiwo ezimbini ezahlukeneyo ziyanda. Iibhodi zeesekethe ezinqabileyo zilula ukugoba, ngelixa iibhodi zesekethe eziprintiweyo ezidibeneyo zinokuphepha ukugoba.

Ukuba ibhodi yesekethe eprintiweyo yenzelwe inani elingaqhelekanga leengqimba zamandla kunye nenani elilinganayo leempawu zesignali, indlela yokongeza iileyile zamandla inokwamkelwa. Enye indlela elula kukongeza umaleko womhlaba phakathi kwesitaki ngaphandle kokutshintsha ezinye iiSetingi. Oko kukuthi, i-PCB ifakwe kwinani elingaqhelekanga lomaleko, kwaye emva koko umaleko wokumisa uphindwa kabini embindini.

8.  Ukuqwalaselwa kweendleko

Ngokwendleko yokuvelisa, iibhodi zesekethe ezininzi ngokuqinisekileyo zibiza kakhulu kuneebhodi zesekethe ezinomaleko ophindwe kabini ezinendawo enye yePCB, kwaye okukhona iileya ezininzi, ixabiso eliphezulu. Nangona kunjalo, xa kuqwalaselwa ukuphunyezwa kwemisebenzi yesiphaluka kunye nebhodi yesekethe ye-miniaturization, ukuqinisekisa ingqibelelo yesignali, i-EMl, i-EMC kunye nezinye izibonakaliso zokusebenza, iibhodi zeesekethe ezininzi kufuneka zisetyenziswe ngokusemandleni. Lilonke, umahluko weendleko phakathi kweebhodi zesekethe ezinomaleko amaninzi kunye neebhodi zesekethe ezinomaleko-mbini aziphezulu kakhulu kunokuba bekulindelwe.