Umngxuma ohambisa i-Via yaziwa ngokuba ngomngxuma. Ukuze kuhlangatyezwane neemfuno zabathengi, ibhodi yesekethe ngomngxuma kufuneka iplagwe. Emva kokuziqhelanisa okuninzi, inkqubo ye-aluminiyam yesiqhelo yokuplaga iyatshintshwa, kwaye imaski yebhodi yesekethe yomphezulu we-solder kunye neplagi igqitywe nge-mesh emhlophe. umngxuma. Imveliso ezinzileyo kunye nomgangatho othembekileyo.
I-Via hole idlala indima yoqhagamshelo kunye nokuqhuba imigca. Uphuhliso loshishino lombane lukwakhuthaza uphuhliso lwePCB, kwaye lukwabeka phambili iimfuno eziphezulu kwinkqubo yokwenziwa kwebhodi eprintiweyo kunye nobuchwepheshe bokunyusa umgangatho. Itekhnoloji yokuplaga ngomngxuma ibekho, kwaye kufuneka ihlangabezane nezi mfuno zilandelayo:
(1) Kukho ubhedu kuphela kumngxuma ophumela ngaphandle, kwaye isigqubuthelo sobuso sinokutsalwa okanye singatsalwa;
(2) Kufuneka kubekho inkonkxa kunye nelothe kumngxuma odlulayo, kunye nemfuneko ethile yobukhulu (ii-microns ezi-4), kwaye akukho inki ye-solder yesigqubuthelo kufuneka ingene emngxunyeni, ebangela amaso enkcenkce emngxunyeni;
(3) Imingxuma ephumela kwimingxuma kufuneka ibenemingxuma ye-inki yesigqubuthelo semaski ye-solder, i-opaque, kwaye mayingabi nezangqa zenkcenkce, amaso enkcenkce kunye neemfuno zokucaca.
Ngokuphuhliswa kweemveliso ze-elektroniki kwicala "lokukhanya, elibhityileyo, elifutshane kunye nelincinci", ii-PCBs nazo ziphuhliselwe ukuxinana okuphezulu kunye nobunzima obukhulu. Ke ngoko, kuye kwavela inani elikhulu le-SMT kunye ne-BGA PCBs, kwaye abathengi bafuna ukuplaga xa kunyuswa izinto, ikakhulu imisebenzi emihlanu:
(1) Thintela isiphaluka esifutshane esibangelwa yitoti edlula kumphezulu wecandelo ukusuka kumngxuma xa i-PCB ithengiswa ngamaza; ingakumbi xa sibeka via emngxunyeni kwi pad BGA, kufuneka siqale senze umngxuma iplagi emva koko ngegolide-atyatyekwe lula ukujolisa BGA.
(2) Ziphephe iintsalela eziguquguqukayo kwimingxuma edlulayo;
(3) Emva kokunyuswa komphezulu kumzi-mveliso we-elektroniki kunye nokudityaniswa kwamalungu kugqityiwe, i-PCB kufuneka icocwe ukuze yenze uxinzelelo olubi kumatshini wovavanyo ukuze igqibezele:
(4) Thintela intlama yesolder engaphezulu ekungeneni emngxunyeni, ibangele ukusoda okungeyonyani kwaye kuchaphazele nokubekwa;
(5) Thintela amaso enkcenkce ukuba angaphumi ngexesha lokusongelwa kwamaza, okubangela imijikelezo emifutshane.
Ukufezekiswa kwenkqubo yokuplaga umngxuma conductive
Kwiibhodi zokuxhoma umphezulu, ngakumbi i-BGA kunye ne-IC yokunyuswa, iiplagi ezidlula ngomngxuma kufuneka zibe mcaba, zibe convex kwaye zibe concave dibanisa okanye thabatha 1mil, kwaye akufuneki kubekho inkonkxa ebomvu kwincam yomngxuma odlulayo; umngxuma odlulayo ufihla ibhola yetoti, ukuze ufikelele kubathengi Inkqubo yokuplaga ngemingxuma ingachazwa njengeyahlukeneyo. Inkqubo yokuhamba ngokukhawuleza inde kwaye ulawulo lwenkqubo lunzima. Kuhlala kukho iingxaki ezifana nokuhla kweoli ngexesha lokulinganisa umoya oshushu kunye novavanyo lokumelana ne-solder oil eluhlaza; ukuqhuma kweoli emva kokunyanga. Ngoku ngokweemeko zokwenyani zemveliso, iinkqubo ezahlukeneyo zokuplaga zePCB zishwankathelwa, kwaye ezinye uthelekiso kunye neenkcazo zenziwa kwinkqubo kunye nezibonelelo kunye nokungalunganga:
Qaphela: Umgaqo wokusebenza wokulinganisa umoya oshushu kukusebenzisa umoya oshushu ukususa i-solder engaphezulu ukusuka kumphezulu kunye nemingxuma yebhodi yesekethe eprintiweyo, kwaye i-solder eseleyo ifakwe ngokulinganayo kwiipads, imigca ye-solder engathintekiyo kunye neendawo zokupakisha zomhlaba, leyo yindlela yonyango yomphezulu yebhodi yesekethe eprintiweyo enye.
1. Inkqubo yokuplaga emva komgangatho womoya oshushu
Ukuqukuqela kwenkqubo yile: imaski yesoda yomphezulu webhodi→HAL→umngxuma weplagi→ukunyanga. Inkqubo yokungafaki iplagi yamkelwe kwimveliso. Emva komgangatho womoya oshushu, isikrini se-aluminium okanye isikrini sokuthintela i-inki sisetyenziselwa ukugqibezela ukuplaga ngomngxuma ofunwa ngabathengi kuzo zonke iinqaba. I-inki yokuplaga ingaba yi-inki ye-photosensitive okanye i-inki ye-thermosetting. Kwimeko yokuqinisekisa umbala ofanayo wefilimu emanzi, kungcono ukusebenzisa i-inki efanayo nebhodi lebhodi. Le nkqubo inokuqinisekisa ukuba imingxuma yokutyhutyha ayiyi kuphulukana neoyile emva kokuba umoya oshushu ulinganiswe, kodwa kulula ukubangela ukuba i-inki yomngxuma weplagi ingcolise umphezulu webhodi kwaye ingalingani. Abathengi baxhomekeke kwi-soldering yobuxoki (ingakumbi kwi-BGA) ngexesha lokunyuka. Ke abathengi abaninzi abayamkeli le ndlela.
2. Umgangatho womoya oshushu kunye nenkqubo yokuplaga
2.1 Sebenzisa i-aluminiyam sheet ukuplaga umngxuma, ukuqinisa, kunye nokupolisha ibhodi ukuze kudluliselwe imizobo
Le nkqubo yethekhnoloji isebenzisa umatshini wokomba we-CNC ukukhupha iphepha le-aluminiyam ekufuneka iplagwe ukwenza isikrini, kwaye uvale umngxuma ukuqinisekisa ukuba umngxuma odlulayo ugcwele. I-inki yomngxuma weplagi ingasetyenziswa nge-inki ye-thermosetting, kwaye iimpawu zayo kufuneka zomelele. , I-shrinkage ye-resin incinci, kwaye amandla okudibanisa kunye nodonga lomngxuma lulungile. Inkqubo yokuhamba yile: unyango lwangaphambili → umngxuma weplagi → ipleyiti yokusila → ugqithiso lwepateni → ukudibanisa → imaski yomphezulu webhodi. Le ndlela inokuqinisekisa ukuba umngxuma weplagi womngxuma odlulayo usicaba, kwaye akusayi kubakho zingxaki zobulunga ezifana nogqabhuko-dubulo lwe-oyile kunye nokuwa kwe-oyile ekupheleni komngxuma xa umoya ushushu. Nangona kunjalo, le nkqubo idinga ukuqina kwexesha elilodwa lobhedu ukwenza ubukhulu bobhedu bodonga lomngxuma buhlangabezane nomgangatho womthengi. Ngoko ke, iimfuno zokubethelwa kobhedu kwepleyiti yonke ziphezulu kakhulu, kwaye ukusebenza komatshini wokugaya ipleyiti nako kuphezulu kakhulu, ukuqinisekisa ukuba i-resin phezu kobhedu isuswe ngokupheleleyo, kwaye ubuso bobhedu bucocekile kwaye alungcoliswa. . Iifektri ezininzi ze-PCB azinayo inkqubo yobhedu yokutyebisa okwexesha elinye, kwaye ukusebenza kwezixhobo akuhlangabezani neemfuno, kubangele ukusetyenziswa kakhulu kwale nkqubo kwiifektri zePCB.
2.2 Emva kokuplaga umngxuma ngephepha le-aluminium, ngqo kwisikrini-printa imaski ye-solder yebhodi
Le nkqubo isebenzisa umatshini wokugaya we-CNC ukukhupha iphepha le-aluminium elifuna ukutsalwa ukwenza isikrini, lifake kumatshini wokushicilela wesikrini ukuze uplage, kwaye upake ngaphandle kwemizuzu engama-30 emva kokugqiba ukuplaga, kwaye usebenzise i-36T. ikhusi kwikhusi ngqo umphezulu webhodi. Inkqubo yokuqukuqela yile: pretreatment-plug hole-silk screen-pre-baking-exposure-development-curing
Le nkqubo inokuqinisekisa ukuba umngxuma odlulayo ugqunywe kakuhle ngeoyile, umngxuma weplagi usicaba, kwaye umbala wefilimu omanzi uyahambelana. Emva kokuba umoya oshushu ulungelelaniswe, unokuqinisekisa ukuba i-via hole ayifakwanga, kwaye umngxuma awufihli ubuhlalu be-tin, kodwa kulula ukubangela inki emngxunyeni emva kokunyanga I-soldering pads ibangela ukuba i-solderability embi; emva kokuba umoya oshushu uhlanjululwe, imiphetho ye-vias i-blistered kwaye ioli iyasuswa. Kunzima ukusebenzisa le nkqubo ukulawula imveliso, kwaye kuyimfuneko ukuba iinjineli zenkqubo zisebenzise iinkqubo ezikhethekileyo kunye neeparitha zokuqinisekisa umgangatho wemingxuma yeeplagi.
2.3 Icwecwe le-aluminiyam liplagiswe emngxunyeni, liphuhliswe, lilungiswe kwangaphambili, lize lipolishwe, emva koko kwenziwe imaski ye-solder.
Sebenzisa umatshini wokugaya we-CNC ukukhupha iphepha le-aluminiyam efuna imingxuma yokuplaga ukwenza isikrini, uyifake kumatshini wokushicilela wesikrini sokutshintsha kwimingxuma yokuplaga. Imingxuma yokuplaga kufuneka igcwale kwaye iphumele kumacala omabini, kwaye emva koko iqinise kwaye icolile ibhodi yonyango lomphezulu. Inkqubo yokuhamba yile: i-pre-plag hole-pre-baking-development-pre-curing-board surface solder mask. Kuba le nkqubo isebenzisa ukunyanga umngxuma weplagi ukuqinisekisa ukuba umngxuma ophumela ngaphandle awehli okanye uqhushumba emva kwe-HAL, kodwa emva kwe-HAL, amaso eTin afihlwe ngemingxunya kunye netoti etyhutyha imingxunya kunzima ukuyicombulula ngokupheleleyo, abathengi abaninzi abawamkeli.
2.4 Imaski yomphezulu webhodi ye-solder kunye nomngxuma weplagi zigqitywa ngaxeshanye.
Le ndlela isebenzisa i-36T (43T) isikrini, efakwe kumatshini wokushicilela kwesikrini, usebenzisa i-backing plate okanye i-nail bed, ngelixa ugqibezela umgangatho webhodi, uvale yonke imingxuma, ukuhamba kwenkqubo kukuba: i-pretreatment-silk screen- -Pre- ukubhaka-ukuvezwa-uphuhliso-ukunyanga. Ixesha lenkqubo lifutshane, kwaye izinga lokusetyenziswa kwezixhobo liphezulu. Inokuqinisekisa ukuba imingxuma ngemingxuma akayi kulahlekelwa ioli kunye nemingxuma ngemingxuma akayi kufakwa kwinkonkxa emva kokuba umoya oshushu ulinganiswe, kodwa ngenxa yokuba isikrini sesilika sisetyenziselwa ukuplaga , Kukho isixa esikhulu somoya kwi-vias. Ngexesha lokunyanga, umoya uyakhula kwaye uqhekeze imaski ye-solder, ibangela imingxuma kunye nokungalingani. Kuya kubakho umlinganiselo omncinci wetoti kwimingxuma yokumisa umoya oshushu. Okwangoku, emva kwenani elikhulu leemvavanyo, inkampani yethu ikhethe iintlobo ezahlukeneyo zeinki kunye ne-viscosity, yahlengahlengisa uxinzelelo loshicilelo lwesikrini, njl., kwaye ngokusisiseko yasombulula i-voids kunye nokungalingani kwe-vias, kwaye yamkele le nkqubo yobuninzi. imveliso.