Kwinkqubo yokufunda i-electronics, sihlala siqaphela ibhodi yesekethe eprintiweyo (PCB) kunye nesekethe edibeneyo (IC), abantu abaninzi "badidekile" malunga nezi ngcamango zimbini. Enyanisweni, azikho nzima kangako, namhlanje siza kucacisa umahluko phakathi kwe-PCB kunye nesekethe edibeneyo.
Yintoni iPCB?
Ibhodi yeSekethe eprintiweyo, ekwabizwa ngokuba yiBhodi yeSekethe eprintiweyo ngesiTshayina, yinxalenye ebalulekileyo ye-elektroniki, iqumrhu elixhasayo lamacandelo e-elektroniki kunye nomthwali woqhagamshelo lombane lwamacandelo e-elektroniki. Ngenxa yokuba yenziwe ngokuprintwa kwe-elektroniki, ibizwa ngokuba yibhodi yesekethe "eprintiweyo".
Ibhodi yesekethe yangoku, ikakhulu iqulunqwe umgca kunye Surface (Pattern), Dielectric layer (Dielectric), umngxuma (Ngomngxuma / nge), ukuthintela inki welding (Solder resistant/Solder Mask), ushicilelo lwesikrini (Legend/Marking/Silk screen ), unyango Surface, Surface Finish), njl.
Izinto eziluncedo zePCB: ukuxinana okuphezulu, ukuthembeka okuphezulu, ukuyila, ukuvelisa, ukuvavanywa, ukuhlangana, ukugcinwa.
Yintoni isekethe edibeneyo?
Isekethe edibeneyo sisixhobo sombane esincinci okanye inxalenye. Ukusebenzisa inkqubo ethile, amacandelo kunye ne-wiring interconnection ezifana ne-transistors, resistors, capacitors kunye ne-inductors ezifunekayo kwisekethe zenziwe kwiqhekeza elincinci okanye amaqhekeza amancinci amaninzi e-semiconductor chip okanye i-dielectric substrate kwaye emva koko ifakwe kwiqokobhe ukuba ibe yi-microstructure. kunye nemisebenzi yesekethe efunekayo. Onke amacandelo adityaniswe ngokwesakhiwo, okwenza amacandelo e-elektroniki abe linyathelo elikhulu elibhekiselele kwi-miniaturization, ukusetyenziswa kwamandla aphantsi, ubukrelekrele, kunye nokuthembeka okuphezulu. Imelwe ngonobumba “IC” kwisekethe.
Ngokomsebenzi kunye nesakhiwo sesekethe edibeneyo, inokwahlulwa ibe yimijikelezo edibeneyo ye-analog, i-digital edityanisiweyo yesekethe kunye ne-digital / analog edibeneyo edibeneyo.
Isekethe edityanisiweyo ineenzuzo zobukhulu obuncinci, ubunzima, intambo encinci yokukhokela, kunye nenqaku le-welding, ubomi obude, ukuthembeka okuphezulu, ukusebenza kakuhle, njl.
Ubudlelwane phakathi kwePCB kunye nesekethe edibeneyo.
Isekethe edibeneyo ngokuqhelekileyo ibizwa ngokuba yi-chip integration, njenge-motherboard kwi-chip ye-Northbridge chip, i-CPU yangaphakathi, ibizwa ngokuba yisekethe edibeneyo, igama lokuqala likwabizwa ngokuba yibhloko edibeneyo. Kwaye i-PCB yibhodi yesekethe esiqhele ukuyazi kwaye iprintwe kwibhodi yesekethe ye-welding chips.
Isekethe edibeneyo (IC) idityaniswe kwibhodi yePCB. Ibhodi yePCB ngumthwali wesekethe edibeneyo (IC).
Ngamagama alula, isiphaluka esidibeneyo sisijikelezo esiqhelekileyo esihlanganiswe kwi-chip, esipheleleyo. Emva kokuba yonakele ngaphakathi, i-chip iya konakala. I-PCB iyakwazi ukuwelda iinxalenye ngokwayo, kwaye iinxalenye zinokutshintshwa ukuba zophukile.