Kwi-PCBA processing kunye nemveliso, kukho izinto ezininzi ezichaphazela umgangatho we-SMT welding, njenge-PCB, i-electronic components, okanye i-solder paste, izixhobo kunye nezinye iingxaki nakweyiphi na indawo iya kuchaphazela umgangatho we-SMT welding, emva koko inkqubo yonyango ye-PCB banaliphi ifuthe kumgangatho we-SMT welding?

Inkqubo yonyango yomphezulu we-PCB ikakhulu ibandakanya i-OSP, igolide yombane yokubeka, itoti yokutshiza / idiphu yetoti, igolide / isilivere, njl., ukhetho oluthile lwenkqubo ekufuneka igqitywe ngokweemfuno zemveliso yokwenyani, unyango lomphezulu wePCB linyathelo elibalulekileyo lenkqubo. kwinkqubo yokwenziwa kwe-PCB, ikakhulu ukunyusa ukuthembeka kwe-welding kunye ne-anti-corrosion kunye ne-anti-oxidation indima, ngoko ke, inkqubo yonyango yomphezulu we-PCB ikwayeyona nto iphambili echaphazela umgangatho wokuwelda!

Ukuba kukho ingxaki ngenkqubo yonyango ye-PCB yomphezulu, ngoko iya kuqala ikhokelela kwi-oxidation okanye ukungcoliswa kwe-solder joint, echaphazela ngokuthe ngqo ukuthembeka kwe-welding, okukhokelela ekudibaniseni kakubi, kulandelwa yinkqubo yonyango ye-PCB nayo iya kuchaphazela. iimpawu zomatshini we-solder joint, njengobunzima bomphezulu buphezulu kakhulu, kuya kuba lula ukukhokelela ekubeni i-solder joint ziwe okanye i-solder joint cracking.