Kule mihla, intsingiselo ekhulayo yeemveliso ze-elektroniki ifuna uyilo olunemigangatho emithathu yeebhodi zesekethe eziprintiweyo ezininzi.Nangona kunjalo, ukupakishwa kweengqimba kuphakamisa imiba emitsha ehambelana nale mbono yoyilo.Enye yeengxaki kukufumana ulwakhiwo olukumgangatho ophezulu weprojekthi.
Njengoko iisekethe eziprintiweyo ezingakumbi nezintsonkothileyo ezenziwe ngeeleya ezininzi ziveliswa, ukupakishwa kweePCB kubaluleke kakhulu.
Uyilo olululo lwe-PCB yesitaki luyimfuneko ekunciphiseni i-radiation ye-loops ye-PCB kunye neesekethe ezinxulumeneyo.Ngokuchasene noko, ukuqokelela okubi kunokunyusa kakhulu imitha, eyingozi kwindawo yokhuseleko.
Yintoni ukupakishwa kwePCB?
Phambi kokuba uyilo lokugqibela loyilo lugqitywe, i-PCB yokupakishwa kwe-stackup ibeka isigqubuthelo kunye nobhedu lwe-PCB.Ukuphuhlisa i-stacking esebenzayo yinkqubo enzima.I-PCB idibanisa amandla kunye nemiqondiso phakathi kwezixhobo eziphathekayo, kunye nokubekwa okuchanekileyo kwezinto zebhodi yesekethe kuchaphazela ngokuthe ngqo umsebenzi wayo.
Kutheni kufuneka laminate PCB?
Ukuphuhliswa kwe-PCB stackup kubalulekile ekuyileni iibhodi zesekethe ezisebenzayo.I-PCB stackup ineenzuzo ezininzi, kuba ulwakhiwo lwe-multilayer lunokuphucula ukuhanjiswa kwamandla, luthintele ukuphazamiseka kwe-electromagnetic, ukunciphisa ukuphazamiseka komnqamlezo, kunye nokuxhasa ukuhanjiswa komqondiso wesantya esiphezulu.
Nangona injongo ephambili yokupakishwa kukubeka iisekethe ezininzi ze-elektroniki kwibhodi enye ngokusebenzisa iileya ezininzi, ulwakhiwo olupakishweyo lweePCB lukwabonelela nezinye iingenelo ezibalulekileyo.La manyathelo abandakanya ukunciphisa ubuthathaka beebhodi zeesekethe kwingxolo yangaphandle kunye nokunciphisa i-crosstalk kunye neengxaki ze-impedance kwiinkqubo zesantya esiphezulu.
Ukupakishwa kwePCB elungileyo kunokunceda ekuqinisekiseni iindleko ezisezantsi zokugqibela zokuvelisa.Ngokwandisa ukusebenza kakuhle kunye nokuphucula ukuhambelana kwe-electromagnetic kuyo yonke iprojekthi, ukupakishwa kwePCB kunokonga ngokufanelekileyo ixesha kunye nemali.
Ukhuseleko kunye nemithetho yoyilo lwelaminate PCB
● Inani leeleya
Ukupakisha okulula kunokubandakanya ii-PCB ezinomaleko amane, ngelixa iibhodi ezintsonkothileyo zifuna ukucwangciswa kolandelelwano lobuchwephesha.Nangona kunzima ngakumbi, inani eliphezulu leeleya livumela abaqulunqi ukuba babe nendawo yokucwangcisa ngakumbi ngaphandle kokunyusa umngcipheko wokuhlangabezana nezisombululo ezingenakwenzeka.
Ngokubanzi, iileya ezisibhozo okanye ngaphezulu ziyafuneka ukuze kufunyanwe olona lungiselelo lomaleko kunye nesithuba sokwandisa ukusebenza.Ukusebenzisa iinqwelomoya ezisemgangathweni kunye neenqwelo-moya zamandla kwiibhodi ze-multilayer nako kunokunciphisa i-radiation.
● Ulungelelwaniso lomaleko
Ulungelelwaniso lomaleko wobhedu kunye nomaleko wokugquma obandakanya isekethe ubandakanya ukusebenza kwe-PCB ethelelanayo.Ukuthintela i-PCB warping, kuyimfuneko ukwenza icandelo lomnqamlezo webhodi lilingane kwaye lilungelelaniswe xa ubeka iileya.Ngokomzekelo, kwibhodi yesibhozo, ubukhulu besibini kunye nesixhenxe kufuneka bufane nokuphumeza ibhalansi engcono.
Umaleko wesiginali kufuneka uhlale usecaleni kwenqwelomoya, ngelixa inqwelomoya yamandla kunye nenqwelomoya esemgangathweni zidityaniswe ngokungqongqo kunye.Kungcono ukusebenzisa iindiza ezininzi zomhlaba, kuba ngokubanzi zinciphisa i-radiation kunye ne-impedance ephantsi komhlaba.
● Uhlobo lwemathiriyeli yomaleko
Thermal, mechanical, kunye neempawu zombane substrate nganye kunye nendlela ezinxibelelana ngayo zibalulekile ekukhetheni izinto PCB laminate.
Ibhodi yesekethe idla ngokuqulunqwa yintsimbi eyomeleleyo yeglasi yefiber substrate, ebonelela ngobungqingqwa kunye nobungqongqo bePCB.Ezinye iiPCB ezibhetyebhetye zisenokwenziwa ngeeplastiki ezibhetyebhetye ezinobushushu obuphezulu.
Uluhlu olungaphezulu luyi-foil encinci eyenziwe nge-copper foil efakwe kwibhodi.Ubhedu lukhona kumacala omabini ePCB enamacala amabini, kwaye ubukhulu bobhedu buyohluka ngokwenani leeleya zesitaki sePCB.
Gquma umphezulu wefoyile yobhedu kunye ne-solder mask ukuze wenze imikhondo yobhedu idibane nezinye iintsimbi.Esi sixhobo siyimfuneko ukunceda abasebenzisi ukuba baphephe ukuthengisa indawo echanekileyo yeentambo ze-jumper.
Umaleko wokuprinta kwesikrini usetyenziswa kwimaski ye-solder ukongeza iisimboli, amanani kunye neeleta ukuququzelela indibano kunye nokuvumela abantu ukuba baqonde ngcono ibhodi yesekethe.
● Khangela iingcingo kunye nemingxuma
Abaqulunqi kufuneka bahambise imiqondiso enesantya esiphezulu kumaleko aphakathi phakathi kweeleya.Oku kuvumela inqwelomoya ephantsi ukuba ibonelele ngokhuselo oluqulethe imitha ephuma kumzila ngesantya esiphezulu.
Ukubekwa kwenqanaba lesignali kufutshane nenqanaba lendiza kuvumela ukubuya kwangoku ukuhamba kwinqwelo-moya ekufutshane, ngaloo ndlela kuncitshiswe i-inductance yendlela yokubuya.Akukho capacitance eyaneleyo phakathi kwamandla akufutshane kunye neenqwelomoya zomhlaba ukubonelela ngokuqhawula ngaphantsi kwe-500 MHz usebenzisa iindlela zokwakha eziqhelekileyo.
● Izithuba phakathi kweeleya
Ngenxa yokunciphisa amandla, ukudibanisa ngokuqinileyo phakathi kwesiginali kunye nendiza yokubuya yangoku kubalulekile.Amandla kunye neenqwelomoya zomhlaba kufuneka zidityaniswe ngokuqinileyo kunye.
Iingqimba zeempawu kufuneka zihlale zisondelelene kunye nokuba zibekwe kwiinqwelomoya ezikufutshane.Ukudityaniswa okuqinileyo kunye nesithuba phakathi kweeleyile kubalulekile kwimiqondiso engaphazamisekiyo kunye nokusebenza ngokubanzi.
ukushwankathela
Kukho iibhodi ezininzi ezahlukeneyo zoyilo lwebhodi yePCB kwitekhnoloji yokupakisha yePCB.Xa iileya ezininzi zibandakanyeka, indlela ye-three-dimensional eqwalasela isakhiwo sangaphakathi kunye nokuhlelwa kwendawo kufuneka kudibaniswe.Ngezantya eziphezulu zokusebenza zeesekethe zanamhlanje, uyilo lokupakisha ngocoselelo lwePCB kufuneka lwenziwe ukuphucula isakhono sokuhambisa kunye nokuthintela ukuphazamiseka.I-PCB eyilwe kakubi inokunciphisa ukuhanjiswa komqondiso, ukwenziwa kwezinto, ukuhanjiswa kwamandla, kunye nokuthembeka kwexesha elide.