KwiPCBinkqubo yokuhlanganisa kunye ne-soldering, abavelisi be-chip ye-SMT banabasebenzi abaninzi okanye abathengi ababandakanyekayo kwimisebenzi, njengokufakwa kweplagi, uvavanyo lwe-ICT, ukwahlula kwe-PCB, ukusebenza kwe-PCB ye-solder, ukunyuswa kwe-screw, ukunyuswa kwe-rivet, i-crimp connector manual, i-PCB cycling, njl., umsebenzi oqhelekileyo ngumntu omnye ophakamisa ibhodi ngesandla esinye, eyona nto ibalulekileyo ekungaphumeleli kwe-BGA kunye ne-chip capacitors. Ngoko kutheni le nto ibangela ukungasebenzi kakuhle? Vumela umhleli wethu akucacisele namhlanje!
Iingozi zokubamba iPCBibhodi ngesandla esinye:
(1) Ukubamba ibhodi ye-PCB ngesandla esinye kuvunyelwe ngokubanzi ezo bhodi zesekethe ezinobungakanani obuncinci, ubunzima obulula, akukho BGA kunye nomthamo wetshiphu; kodwa kwezo zijikelezo ezinobukhulu obukhulu, ubunzima obunzima, i-BGA kunye ne-chip capacitors kwiibhodi zecala, ekufuneka ziphetshwe ngokuqinisekileyo. Ngenxa yokuba olu hlobo lokuziphatha lunokubangela ukuba amalungu e-solder ye-BGA, amandla e-chip kunye nokuchasana kwe-chip kungasebenzi. Ngoko ke, kuxwebhu lwenkqubo, iimfuno zendlela yokuthatha ibhodi yesekethe kufuneka iboniswe.
Eyona ndawo ilula yokubamba iPCB ngesandla esinye yinkqubo yomjikelo webhodi yesekethe. Enokuba ususa ibhodi kwibhanti lokuhambisa okanye ubeka ibhodi, abantu abaninzi bengazi bamkela uqheliselo lokubamba iPCB ngesandla esinye kuba yeyona iluncedo. Xa i-soldering ngesandla, ncamathelisa i-radiator kwaye ufake izikrufu. Ukugqibezela umsebenzi, uya kusebenzisa isandla esinye ukusebenza kwezinye izinto ebhodini. Le misebenzi ibonakala iqhelekile ihlala ifihla umngcipheko omkhulu womgangatho.
(2) Faka izikrufu. Kwiifektri ezininzi ze-SMT zokucubungula i-chip, ukuze kugcinwe iindleko, izixhobo zokusebenza zishiywe. Xa izikrufu zifakwe kwi-PCBA, amacandelo angasemva kwi-PCBA ahlala ekhubazekile ngenxa yokungalingani, kwaye kulula ukukrazula amalungu e-solder anoxinzelelo.
(3) Ukufaka amacandelo emngxunyeni
Amacandelo ngomngxuma, ingakumbi iiguquli ezinezikhokelo ezishinyeneyo, zidla ngokuba nzima ukuzifaka ngokuchanekileyo kwimingxunya enyukayo ngenxa yonyamezelo olukhulu lwendawo yokukhokela. Abaqhubi abayi kuzama ukufumana indlela yokuchaneka, ngokuqhelekileyo usebenzisa i-rigid press-in operation, eya kubangela ukugoba kunye nokuguqulwa kwebhodi ye-PCB, kwaye kuya kubangela umonakalo kwi-chip capacitors ejikelezileyo, i-resistors, kunye ne-BGA.