1.Uyilo lokwenziwa kwePCBA
Uyilo manufacturability ye PCBA ikakhulu usombulula ingxaki assemblability, kwaye injongo kukuphumeza eyona ndlela imfutshane inkqubo, izinga lokupasa iphezulu soldering, kunye nexabiso eliphantsi imveliso. Umxholo woyilo ikakhulu ubandakanya: uyilo lwendlela yenkqubo, uyilo lwecandelo loyilo kumphezulu wendibano, i-pad kunye noyilo lwemaski ye-solder (enxulumene nesantya sokudlula), uyilo lwe-thermal yendibano, uyilo lokuthembeka kwendibano, njl.
(1)PCBA Manufacturability
Uyilo lokwenziwa kwe-PCB lugxile “kukwenziwa kwezinto”, kwaye umxholo woyilo ubandakanya ukukhetha ipleyiti, ulwakhiwo lwe-press-fit, uyilo lomsesane we-annular, uyilo lwemaski ye-solder, unyango lomphezulu kunye noyilo lwephaneli, njl. iPCB. Ukukhawulwa yindlela yokusetyenzwa kunye nekhono, ubuncinci bobubanzi bomgca kunye nesithuba somgca, ubuncinci bedayamitha yomngxunya, ubuncinci beringi yobubanzi, kunye nesithuba semaski esisezantsi kufuneka sihambelane nesakhono sokusetyenzwa kwePCB. Isitaki esenziweyo Umaleko kunye nolwakhiwo lwelamination kufuneka luhambelane neteknoloji yokucubungula iPCB. Ke ngoko, uyilo lokwenziwa kwe-PCB lujolise ekuhlangabezaneni nesakhono senkqubo yomzi-mveliso wePCB, kunye nokuqonda indlela yokuvelisa iPCB, ukuhamba kwenkqubo kunye nobuchule benkqubo sisiseko sokuphumeza uyilo lwenkqubo.
(2) Ukudityaniswa kwePCBA
Uyilo oludityanisiweyo lwePCBA lugxile “kwi-assemblability”, oko kukuthi, ukuseka inkqubo ezinzileyo neyomeleleyo, nokuphumeza umgangatho ophezulu, ukusebenza kakuhle kunye nexabiso eliphantsi lokuthengisela. Umxholo woyilo ubandakanya ukhetho lwephakheji, uyilo lwephedi, indlela yokuhlanganisa (okanye uyilo lwenkqubo), uyilo lwamacandelo, uyilo lwe-mesh yensimbi, njl.njl. Zonke ezi mfuno zoyilo zisekelwe kwisivuno esiphezulu se-welding, ukusebenza okuphezulu kokuvelisa, kunye neendleko eziphantsi zokuvelisa.
2.Inkqubo yokuthambisa iLaser
Itekhnoloji yokuthengisa ngelaser kukuntywizisa indawo yephedi ngendawo egxininiswe ngokuchanekileyo yomqadi welaser. Emva kokufunxa amandla e-laser, indawo ye-solder iyatshisa ngokukhawuleza ukunyibilikisa i-solder, kwaye emva koko iyeke i-laser irradiation ukupholisa indawo ye-solder kwaye iqinise i-solder ukwenza i-solder joint. Indawo yokuwelda iyafudunyezwa ekuhlaleni, yaye ezinye iinxalenye zendibano iphela azichatshazelwa bubushushu. Ixesha le-laser irradiation ngexesha le-welding lidla ngokuba ngama-milliseconds angamakhulu ambalwa. I-soldering engabonakaliyo, akukho xinzelelo lomatshini kwi-pad, ukusetyenziswa kwendawo ephezulu.
I-laser welding ifanelekile kwinkqubo yokuphinda iphinde ifakwe kwi-soldering okanye izihlanganisi usebenzisa ucingo lwe-tin. Ukuba licandelo le-SMD, kufuneka ufake i-solder paste kuqala, kwaye emva koko i-solder. Inkqubo ye-solder ihlukaniswe ngamanyathelo amabini: okokuqala, i-solder paste ifuna ukufudumeza, kwaye i-solder joints nayo i-preheated. Emva koko, i-solder paste esetyenziselwa i-solder iyancibilika ngokupheleleyo, kwaye i-solder imanzisa ngokupheleleyo i-pad, ekugqibeleni yenza i-solder joint. Ukusebenzisa i-laser generator kunye ne-optical focusing components for welding, uxinano lwamandla aphezulu, ukusebenza kakuhle kokudlulisa ubushushu, ukungadibanisi ne-welding, i-solder inokuba yi-solder paste okanye i-tin wire, ilungele ngakumbi ukuwelda iindawo ezincinci ze-solder kwiindawo ezincinci okanye iindawo ezincinci ze-solder ezinamandla aphantsi. , ukonga amandla.
3.Laser iimfuneko zokuyila welding for PCBA
(1) Ukuhanjiswa kwePCBA ngokuzenzekelayo kunye noyilo lokubeka
Kwimveliso ezenzekelayo kunye nendibano, i-PCB kufuneka ibe neesimboli ezihambelana nokumiswa kwamehlo, njengamanqaku eMarko. Okanye umahluko wepadi uyabonakala, kwaye ikhamera ebonakalayo ibekwe.
(2) Indlela ye-welding inquma ukucwangciswa kwamacandelo
Indlela nganye ye-welding ineemfuno zayo zokucwangciswa kwamacandelo, kwaye ukucwangciswa kwamacandelo kufuneka kuhlangabezane neemfuno zenkqubo ye-welding. Uyilo lwezenzululwazi kunye nengqiqo lunokunciphisa amajoyina amabi e-solder kunye nokunciphisa ukusetyenziswa kwezixhobo.
(3) Uyilo lokuphucula izinga lokupasa nge-welding
Uyilo oluhambelanayo lwe-pad, i-solder resist, kunye ne-stencil I-pad kunye ne-pin structure imisela imilo ye-solder joint kunye nokumisela ukukwazi ukufunxa i-solder etyhidiweyo. Uyilo olunengqiqo lomngxuma wokunyuka lufezekisa izinga lokungena kwe-tin ye-75%.