Ngokubanzi, izinto ezichaphazela ukubaluleka kwe-PCB zezi: ubukhulu be-Deectric to, uCecture Thick t, umkhondo we-trace ububanzi bezinto ezikhethwe kwisitaki, kwaye ubungqingqwa bemaski yeThutho.

Ngokubanzi, kokukhona ukhulu ukuphakama kwe-diectrick kunye nakwinqanaba lomgca, kokukhona ixabiso elikhulu; Oyena mkhulu kwiDelectric rhoqo, ubukhulu becala, ububanzi belayini, kunye ne-mesk yomgangatho wemaski, incinci ixabiso lokufumana.

Eyokuqala: Ubunzima obuphakathi, ukwandisa ubukhulu obuphakathi kunokunyusa ukunyathela, kwaye ukunciphisa ubukhulu obuphakathi kunokunciphisa ukumisela; I-Pregs eyahlukeneyo ineeglug ezahlukeneyo kunye nobubanzi. Ubunzima emva kokucinezelwa bunxulumene neflethi yomatshini wokushicilela kunye nenkqubo yeplate yokucinezela; Ngoluphi na uhlobo lweplate esetyenzisiweyo, kunyanzelekile ukuba ufumane ubukhulu bobume bemithombo yeendaba enokuveliswa, elungele uyilo lwe-IPTE, ukulungisa i-Plates, ukulungisa i-Plate yeyona nto iphambili kulawulo lweendaba.

Okwesibini: Ububanzi bomgca, ukwandisa ububanzi bomlilo bunganciphise imvume, ukunciphisa ububanzi bomgca bunokongeza ukunyanzeliswa. Ulawulo lobubanzi bomgca kufuneka lube ngaphakathi kokunyamezelana kwe +/- 10% ukufezekisa ulawulo lwemowudi. Umqalo womqondiso uchaphazela lonke ulwalamano. Ukunyanzeliswa kwenqaku lakhe elinye liphezulu, kwenza konke ukubekwa okungalingani, kwaye umgca wokuthintela awuvunyelwa ukuba enze umgca, umsantsa awunakudlula kwi-10%. Ububanzi bomgca bulawulwa bulawulo lwe-etching. Ukuqinisekisa ububanzi bomgca, ngokwexabiso le-etching ye-etching ye-etching, imposiso yokuhambisa ukukhanya, kunye nempazamo yokudlulisela kwimodeli, le filimu ihlawulelwa inkqubo yokufezekisa imfuneko yokuhlangabezana nemfuno yobubanzi.

Okwesithathu: Ukuphakama kwesithathu: ukunciphisa ubukhulu bomgca kunokunyusa ukunyathela, ukwandisa ubukhulu bomgca kunokunciphisa ukumisela; Ubungakanani bomgca bunokulawulwa yipateni yepateni okanye ukukhetha ubukhulu obuhambelana ne-foil yesiseko se-foil. Ulawulo lobubanzi be-copper luyafuneka ukuba iyunifomu. Ibhloko ye-shint yongezwa kwibhodi yeengcingo ezicekeceke kunye neengcingo ezizezodwa ukuze zilungelelanise ubunzima be-coppen kwi-wire i-wire i-wire i-wire kwaye ichaphazele ukusasazwa kobhedu kwi-CS kunye ne-SS. Kuyimfuneko ukuwela iBhodi ukuba ifezekise injongo yobukhulu be-iyunifomu kumacala omabini.

Okwesine: Ukuphucula i-Deectric rhoqo kunokunciphisa ukunyathela, ukunciphisa i-dielectric rhoqo kunokunyusa ukunyathela, i-dielectric rhoqo ilawulwa yimpahla. I-dielectric rhoqo yeepleyiti ezahlukeneyo yahlukile, enxulumene nempahla ye-resen esetyenzisiweyo: i-dielectric rhoqo ye-FT4 i-2,3- ifuna ukuhanjiswa okuphezulu kwe-2,2 kufuna ukuba kubekho ixabiso eliphantsi eliphantsi.

Elesihlanu: Ubungqingqwa bemaski yomrhwebi. Ukuprinta iMaski yomthengi kuya kunciphisa ukumelana nokuchasana ne-sub yangaphandle. Phantsi kweemeko eziqhelekileyo, ukuprinta imask yeThuqu enye inokukunciphisa ukwehla kwe-2 yee-ohis, kwaye kunokwenza ihla ngendlela eyahlukileyo nge-8 OHMS. Ukuprinta kabini ngexabiso lokuphelisa liphindwe kabini kwenye. Xa uprinta ngaphezu kwamaxesha amathathu, ixabiso lokufumana aliyi kutshintsha.