Ngokubanzi, izinto ezichaphazela i-impedance ye-PCB zezi: Ubukhulu be-dielectric H, ubukhulu bobhedu T, i-trace wide W, i-trace space, i-dielectric engaguqukiyo i-Er yezinto ezikhethelwe isitaki, kunye nobukhulu bemaski ye-solder.
Ngokubanzi, ubukhulu be-dielectric ubukhulu kunye nezithuba zemigca, likhulu ixabiso le-impedance; Ubukhulu be-dielectric engaguqukiyo, ubukhulu bobhedu, ububanzi bomgca, kunye nobukhulu bemaski ye-solder, lincinci ixabiso le-impedance.
Eyokuqala: ubukhulu obuphakathi, ukwandisa ubukhulu obuphakathi kunokonyusa i-impedance, kwaye ukunciphisa ubukhulu obuphakathi kunokunciphisa i-impedance; prepregs ezahlukeneyo zinemixholo yeglu ezahlukeneyo kunye nobukhulu. Ubunzima emva koxinzelelo luhambelana nokucotha komshicileli kunye nenkqubo yeplate yokucinezela; kuba naluphi na uhlobo ipleyiti esetyenziswayo, kuyimfuneko ukufumana ubunzima umaleko eendaba ezinokuthi ziveliswe, nto leyo eluncedo ukubala calculation, kunye noyilo lobunjineli, ngokucinezela ulawulo ipleyiti, Unyamezelo engenayo isitshixo ulawulo eendaba.
Okwesibini: ububanzi bomgca, ukwandisa ububanzi bomgca kunokunciphisa i-impedance, ukunciphisa ububanzi bomgca kunokunyusa i-impedance. Ukulawulwa kobubanzi bomgca kufuneka kube ngaphakathi kokunyamezela +/- 10% ukufezekisa ulawulo lwe-impedance. Isithuba somgca wesignali sichaphazela lonke uhlobo lwamaza ovavanyo. I-impedance yayo ye-single-point iphezulu, yenza ukuba i-waveform yonke ingalingani, kwaye umgca we-impedance awuvumelekanga ukuba wenze Umgca, i-gap ayinakudlula i-10%. Ububanzi bomgca bulawulwa ikakhulu ngokulawula i-etching. Ukuze kuqinisekiswe ububanzi bomgca, ngokwemali ye-etching side etching, impazamo yokukhanya komzobo, kunye nempazamo yokudlulisa ipateni, ifilimu yenkqubo ihlawulelwa inkqubo yokuhlangabezana nemfuneko yobubanzi bomgca.
Okwesithathu: ubukhulu bobhedu, ukunciphisa ubukhulu bomgca kunokunyusa i-impedance, ukwandisa ubukhulu bomgca kunokunciphisa i-impedance; ubukhulu bomgca bunokulawulwa ngokutyalwa kwepatheni okanye ukukhetha ubukhulu obuhambelanayo besiseko sento yobhedu. Ukulawulwa kobunzima bobhedu bufunekayo ukuba bufane. Ibhloko ye-shunt yongezwa kwibhodi yeengcingo ezibhityileyo kunye neengcingo ezizimeleyo ukuze zilungelelanise i-current ukunqanda ukutyeba kobhedu olungalinganiyo kwintambo kwaye kuchaphazele ukusabalalisa ngokugqithisileyo kobhedu kwi-cs kunye nemiphezulu ye-ss. Kuyimfuneko ukuwela ibhodi ukufezekisa injongo yobunzima bobhedu obufanayo kumacala omabini.
Okwesine: i-dielectric constant, ukunyusa i-dielectric constant inokunciphisa i-impedance, ukunciphisa i-dielectric rhoqo kunokunyusa i-impedance, i-dielectric constant ilawulwa ikakhulu yizinto eziphathekayo. I-dielectric constant of plates different plates ihluke, ehambelana nesixhobo se-resin esetyenzisiweyo: i-dielectric constant of FR4 plate yi-3.9-4.5, eya kuncipha ngokunyuka kwexesha lokusetyenziswa, kunye ne-dielectric constant ye-PTFE plate yi-2.2. - Ukufumana ukuhanjiswa kwesignali ephezulu phakathi kwe-3.9 kufuna ixabiso eliphezulu le-impedance, elifuna i-dielectric ephantsi.
Eyesihlanu: Ubukhulu bemaski yesolder. Ukuprinta imaski ye-solder kuya kunciphisa ukuchasana komgangatho wangaphandle. Ngaphantsi kweemeko eziqhelekileyo, ukuprinta imaski enye ye-solder kunokunciphisa ukuhla kwe-single-end nge-ohms ezi-2, kwaye kunokwenza umehluko wehle nge-8 ohms. Ukuprinta kabini ixabiso ledrophu liphindwe kabini kunelo lokupasa elinye. Xa uprinta ngaphezu kwamaxesha amathathu, ixabiso le-impedance aliyi kutshintsha.