Inkqubo yemveliso ye-PCBA inokwahlulwa ngokweenkqubo ezininzi ezinkulu:
Uyilo lwePCB nophuhliso →ukwenziwa kwepetshi ye-SMT →ukwenziwa kweplagi ye-DIP →uvavanyo lwePCBA → ezintathu zokuchasa ukugquma → ukudityaniswa kwemveliso egqityiweyo.
Okokuqala, uyilo lwePCB kunye nophuhliso
1.Imfuno yemveliso
Iskimu esithile sinokufumana ixabiso lenzuzo ethile kwimarike yangoku, okanye abanomdla bafuna ukugqiba uyilo lwabo lwe-DIY, emva koko imfuno yemveliso ehambelanayo iya kuveliswa;
2. Uyilo kunye nophuhliso
Idityaniswe neemfuno zemveliso yomthengi, iinjineli ze-R & D ziya kukhetha i-chip ehambelanayo kunye nendibaniselwano yesekethe yangaphandle yesisombululo sePCB ukufezekisa iimfuno zemveliso, le nkqubo ide kakhulu, umxholo obandakanyekayo apha uya kuchazwa ngokwahlukileyo;
I-3, imveliso yovavanyo lwesampula
Emva kokuphuhliswa kunye noyilo lwe-PCB yokuqala, umthengi uya kuthenga izinto ezihambelanayo ngokuhambelana ne-BOM ebonelelwe ngophando kunye nophuhliso lokuqhuba imveliso kunye nokulungiswa kwemveliso, kwaye imveliso yesilingo yahlulahlulwe ngobungqina (10pcs), ubungqina besibini (10pcs), imveliso yovavanyo lwebhetshi encinci (50pcs ~ 100pcs), imveliso yovavanyo lwebhetshi enkulu (100pcs ~ 3001pcs), kwaye ke iya kungena kwinqanaba lokuvelisa ubuninzi.
Okwesibini, i-SMT patch processing
Ulandelelwano lwe-SMT patch processing yahlulahlulwe ibe: ukubhaka imathiriyeli → ukufikelela kwi-solder paste →SPI→ ukunyusa → ukuphinda kufakwe i-solder →AOI→ ukulungisa
1. Izinto zokubhaka
Kwii-chips, iibhodi ze-PCB, iimodyuli kunye nezixhobo ezizodwa eziye zahlala ngaphezu kweenyanga ezi-3, kufuneka zibhakwe kwi-120 ℃ 24H. Kwii-microphone ze-MIC, izibane ze-LED kunye nezinye izinto ezingenakunqanda ukushisa okuphezulu, kufuneka zibhakwe kwi-60 ℃ 24H.
2, ukufikelela kwi-solder paste (ukubuyisela ubushushu → ukushukumisa → sebenzisa)
Ngenxa yokuba intlama yethu ye-solder igcinwe kwindawo ye-2 ~ 10 ℃ ixesha elide, kufuneka ibuyiselwe kunyango lweqondo lokushisa ngaphambi kokusetyenziswa, kwaye emva kokushisa okubuyayo, kufuneka ishukunyiswe nge-blender, kwaye ke iyakwazi. ziprintwe.
3. Ukufunyanwa kwe-SPI3D
Emva kokuba i-solder paste ishicilelwe kwibhodi yesiphaluka, i-PCB iya kufikelela kwisixhobo se-SPI ngebhanti yokuhambisa, kwaye i-SPI iya kubona ubukhulu, ububanzi, ubude be-solder paste yoshicilelo kunye nemeko enhle ye-tin surface.
4. Ntaba
Emva kokuba i-PCB igeleza kumatshini we-SMT, umatshini uya kukhetha imathiriyeli efanelekileyo kwaye uyinamathisele kwi-bit number ehambelanayo ngeprogram emiselweyo;
5. Reflow welding
I-pcb ezaliswe yimpahla equkuqelayo ukuya phambi kwe-welding ye-reflow, kwaye idlula kwiindawo ezilishumi zeqondo lokushisa ukusuka kwi-148 ℃ ukuya kwi-252 ℃ ngokulandelelana, idibanisa ngokukhuselekileyo amacandelo ethu kunye nebhodi ye-PCB kunye;
6, uvavanyo lwe-AOI kwi-intanethi
I-AOI sisixhobo esizenzekelayo sokujonga i-optical detector, esinokujonga ibhodi ye-PCB iphuma nje eziko ngokusebenzisa i-high-definition scanning, kwaye inokukhangela ukuba kukho izinto ezincinci kwibhodi ye-PCB, ingaba i-material iguquliwe, nokuba i-solder joint ixhunyiwe phakathi. Amalungu kunye nokuba ithebhulethi ivaliwe.
7. Ukulungisa
Ngeengxaki ezifunyenwe kwibhodi ye-PCB kwi-AOI okanye ngesandla, kufuneka ilungiswe yinjineli yokulondoloza, kwaye ibhodi ye-PCB elungisiweyo iya kuthunyelwa kwi-plug-in ye-DIP kunye nebhodi eqhelekileyo engaxhunyiwe kwi-intanethi.
Eyesithathu, iplagi ye-DIP
Inkqubo ye DIP plug-in yahlulwe ibe: ukubumba → iplagi-ngaphakathi → wave solder → ukusika unyawo → ukubamba itoti → ipleyiti yokuvasa → ukuhlolwa komgangatho
1. Utyando lwePlastiki
Izixhobo ze-plug-in esizithengileyo zizinto zonke eziqhelekileyo, kwaye ubude bepini bezinto esizidingayo buhluke, ngoko kufuneka simise iinyawo zezixhobo kwangaphambili, ukwenzela ukuba ubude kunye nokuma kweenyawo zilungele thina. ukwenza i-plug-in okanye ukuthumela i-welding.
2. Iplagi-in
Amacandelo agqityiweyo aya kufakwa ngokwethempleyithi ehambelana nayo;
3, i-wave soldering
Ipleyiti efakiweyo ibekwe kwi-jig ukuya ngaphambili kwi-solder wave. Okokuqala, i-flux iya kutshizwa ezantsi ukuze incede i-welding. Xa ipleyiti ifika phezulu kwesithando somlilo, amanzi e-tin kwisithando somlilo aya kudada kwaye aqhagamshelane nepini.
4. Sika iinyawo
Ngenxa yokuba izinto zokwenziwa kwangaphambili ziya kuba neemfuneko ezithile zokubeka bucala isikhonkwane eside kancinane, okanye izinto ezingenayo ngokwazo azilungele ukusetyenzwa, ipini iya kucuthwa ukuya kubude obufanelekileyo ngokucutha ngesandla;
5. Ukubamba itoti
Kusenokubakho izinto ezimbi ezinje ngemingxuma, imingxunya, ukuwelda okuphosiweyo, ukuwelda okungeyonyani njalo njalo kwizikhonkwane zebhodi yethu yePCB emva kweziko. Isibambi sethu setoti siya kuzilungisa ngokuzilungisa ngesandla.
6. Hlamba ibhodi
Emva kokuba i-wave soldering, ukulungiswa kunye namanye amakhonkco angaphambili, kuya kubakho ukuguquguquka okushiyekileyo okanye ezinye iimpahla ezibiweyo ezifakwe kwindawo ye-pin yebhodi ye-PCB, efuna abasebenzi bethu bacoce umphezulu wayo;
7. Ukuhlolwa komgangatho
PCB ibhodi components imposiso kunye ukuvuza itshekhi, ibhodi PCB ongafanelekanga kufuneka zilungiswe, de bafanelekele ukuya kwinyathelo elilandelayo;
4. Uvavanyo lwe-PCBA
Uvavanyo lwe-PCBA lunokwahlulwa lube luvavanyo lwe-ICT, uvavanyo lwe-FCT, uvavanyo lokuguga, uvavanyo lokungcangcazela, njl
Uvavanyo lwe-PCBA luvavanyo olukhulu, ngokweemveliso ezahlukeneyo, iimfuno ezahlukeneyo zabathengi, uvavanyo luthetha ukuba olusetyenziswayo lwahlukile. Uvavanyo lwe-ICT kukubona imeko ye-welding yamacandelo kunye nemeko ye-on-off yemigca, ngelixa uvavanyo lwe-FCT kukubona i-input and output parameters yebhodi ye-PCBA ukujonga ukuba bayahlangabezana neemfuno.
Ezintlanu: PCBA ezintathu anti-ukwaleka
PCBA amanyathelo amathathu enkqubo yokuchasa ukugquma ngala: icala lokubrasha A → umphezulu owomileyo → icala lokubrasha B → ukunyanga ubushushu begumbi 5. Ukutshiza ubukhulu:
0.1mm-0.3mm6. Yonke imisebenzi yokugquma iya kwenziwa kwiqondo lobushushu elingekho ngaphantsi kwe-16℃ kunye nokufuma okuhambelanayo ngaphantsi kwe-75%. PCBA ezintathu anti-ukwaleka iseninzi, ngakumbi ubushushu kunye nokufuma okusingqongileyo ngqwabalala ngakumbi, PCBA ukutyabeka ezintathu anti-ipeyinti ukugquma eliphezulu, ukufuma, ukuvuza, ukothuka, uthuli, umhlwa, anti-ukuguga, anti-ukungunda, anti- iinxalenye ezikhululekileyo kunye ne-insulation corona resistance performance, inokwandisa ixesha lokugcinwa kwe-PCBA, ukwahlukaniswa kokhukuliseko lwangaphandle, ungcoliseko njalo njalo. Indlela yokutshiza yeyona ndlela ixhaphakileyo yokugquma kushishino.
Ukuhlanganiswa kwemveliso egqityiweyo
7.Ibhodi ye-PCBA egqunywe ngovavanyo Kulungile idityaniswe kwiqokobhe, kwaye ke umatshini wonke uyaguga kunye novavanyo, kwaye iimveliso ngaphandle kweengxaki ngovavanyo lokuguga zingathunyelwa.
Ukuveliswa kwePCBA likhonkco kwikhonkco. Nayiphi na ingxaki kwinkqubo yokuvelisa i-pcba iya kuba nempembelelo enkulu kumgangatho jikelele, kwaye inkqubo nganye kufuneka ilawulwe ngokungqongqo.