Ukugoba kunye warping yebhodi PCB kulula ukuba kwenzeke eziko backwelding. Njengoko sonke sisazi, indlela yokuthintela ukugoba kunye ne-warping yebhodi ye-PCB ngesithando somlilo se-backwelding ichazwe ngezantsi:

1. Ukunciphisa impembelelo yobushushu kwi-PCB yoxinzelelo lwebhodi

Ekubeni "iqondo lokushisa" ngowona mthombo uphambili woxinzelelo lwebhodi, nje ukuba iqondo lokushisa le-oven yokubuyisela liyancipha okanye izinga lokufudumeza kunye nokupholisa kwebhodi kwi-oven yokubuyisela iyancipha, ukwenzeka kokugoba kweplate kunye ne-warping kuncitshiswe kakhulu. Nangona kunjalo, ezinye iziphumo zecala zinokuthi zenzeke, njenge-solder short circuit.

2. Ukusebenzisa iphepha leTg eliphezulu

I-Tg yiqondo lokushisa lokutshintsha kweglasi, oko kukuthi, iqondo lokushisa apho izinto zitshintsha ukusuka kwiglasi ukuya kwimeko yerabha. Ixabiso eliphantsi le-Tg lezinto eziphathekayo, ngokukhawuleza ibhodi iqala ukuthamba emva kokungena kwisithando somlilo, kwaye ixesha elithathayo ukuze libe yimeko yerabha ethambileyo iya kuba yinde, kwaye ukuguqulwa kwebhodi kuya kuba nzima ngakumbi. . Ukusebenzisa i-Tg sheet ephezulu kunokunyusa amandla ayo okumelana noxinzelelo kunye nokuguqulwa, kodwa ixabiso lezinto eziphathekayo liphezulu.

3. Ukwandisa ubukhulu bebhodi yesekethe

Ukuze ufezekise injongo yokukhanya kunye nokuncinci kwiimveliso ezininzi ze-elektroniki, ubukhulu bebhodi bushiye i-1.0mm, 0.8mm, okanye i-0.6mm. Ubungqingqwa obunjalo kufuneka bugcine ibhodi ingakhuli emva kwesithando somlilo, okunzima ngokwenene. Kunconywa ukuba ukuba akukho mfuneko yokukhanya kunye nokunciphisa, ubukhulu bebhodi kufuneka bube yi-1.6mm, enokunciphisa kakhulu umngcipheko wokugoba kunye nokuguqulwa kwebhodi.

4. Ukunciphisa ubukhulu bebhodi yesekethe kwaye unciphise inani leepuzzle

Ekubeni uninzi lweziko lokutshiza zisebenzisa amatyathanga ukuqhubela phambili ibhodi yesekethe, ubukhulu bebhodi yesekethe enkulu iya kuba ngenxa yobunzima bayo, i-dent kunye nokuguqulwa kwesithando somlilo, ngoko zama ukubeka icala elide lebhodi yesekethe. njengomphetho webhodi. Kwikhonkco lesithando somlilo, ukudakumba kunye nokuguqulwa okubangelwa ubunzima bebhodi yesiphaluka kunokunciphisa. Ukuncitshiswa kwenani leepaneli nako kusekelwe kwesi sizathu. Oko kukuthi, xa udlula isithando somlilo, zama ukusebenzisa i-edge emxinwa ukuze udlulise ulwalathiso lwesithando somlilo kangangoko kunokwenzeka ukuze ufezekise eyona nto iphantsi Ubungakanani bokudandatheka deformation.

5. Ukusetyenziswa kwetreyi yesithando somlilo

Ukuba iindlela ezingentla zinzima ukufezekisa, okokugqibela kukusebenzisa i-reflow carrier / template ukunciphisa inani le-deformation. Isizathu sokuba i-reflow carrier / template inokunciphisa ukugoba kwepleyiti kukuba ingaba kukwandiswa kwe-thermal okanye ukuchithwa okubandayo, kunethemba lokuba i-tray ingabamba ibhodi yesiphaluka kwaye ilinde de ukushisa kwebhodi yesekethe kungaphantsi kwe-Tg. ixabiso kwaye uqale ukuqina kwakhona, kwaye unokugcina ubungakanani begadi.

Ukuba i-pallet ye-single-layer ayikwazi ukunciphisa i-deformation yebhodi yesekethe, isigqubuthelo kufuneka songezwe ukuze sibambe ibhodi yesiphaluka kunye neepaliti eziphezulu kunye nezantsi. Oku kunokunciphisa kakhulu ingxaki yokuguqulwa kwebhodi yesiphaluka ngokusebenzisa isithando somlilo. Nangona kunjalo, le treyi yomlilo ibiza kakhulu, kwaye umsebenzi wezandla uyafuneka ukuze kubekwe kwaye kusetyenziswe ngokutsha iitreyi.

6. Sebenzisa i-Router endaweni ye-V-Cut's sub-board

Ekubeni i-V-Cut iya kutshabalalisa amandla okwakhiwa kwepaneli phakathi kweebhodi zeesekethe, zama ukungasebenzisi i-V-Cut sub-board okanye ukunciphisa ubunzulu be-V-Cut.