Ukutshiza ngenkcenkce linyathelo kunye nenkqubo kwinkqubo yokuqinisekisa ye-PCB. Iibhodi PCBintywiliselwa kwichibi elinyibilikisiweyo le-solder, ukuze yonke imiphezulu yobhedu eveziweyo igqunywe nge-solder, kwaye i-solder engaphezulu ebhodini isuswe ngumsiki womoya oshushu. susa. Amandla e-soldering kunye nokuthembeka kwebhodi yesiphaluka emva kokutshiza i-tin kungcono. Nangona kunjalo, ngenxa yeempawu zayo zenkqubo, ukuthambeka komphezulu wonyango lokutshiza nge-tin akulunganga, ngakumbi kumacandelo amancinci e-elektroniki anje ngeepakethi ze-BGA, ngenxa yendawo encinci ye-welding, ukuba i-flatness ayilungile, inokubangela iingxaki ezinje. iisekethe ezimfutshane.

inzuzo:

1. Ukumanzisa kwamacandelo ngexesha lenkqubo ye-soldering kungcono, kwaye i-soldering ilula.

2. Inokuthintela umphezulu wobhedu ovezwayo ukuba ugqweswe okanye ufakwe i-oxidized.

ukusilela:

Ayifanelekanga izikhonkwane ze-soldering ezinezikhewu ezintle kunye namacandelo amancinci kakhulu, ngenxa yokuba i-flatness yebhodi ye-tin-sprayed ayilungile. Kulula ukuvelisa amaso enkcenkce kwi-PCB proofing, kwaye kulula ukubangela isiphaluka esifutshane kumacandelo anezikhonkwane ezicolekileyo zesikhewu. Xa isetyenziswe kwinkqubo ye-SMT emacala amabini, ngenxa yokuba icala lesibini liye lafumana i-soldering ye-reflow soldering ephezulu, kulula kakhulu ukunyibilika kwakhona isitshizi se-tin kunye nokuvelisa amaso e-tin okanye amathontsi amanzi afanayo achatshazelwa ngumxhuzulane kwiindawo ze-tin ezingqukuva. ukuwisa, kubangela ukuba umphezulu ungabukeki nangakumbi. Ukucandwa ngokulinganayo kuchaphazela iingxaki ze-welding.

Okwangoku, ezinye PCB proofing isebenzisa inkqubo OSP kunye nokuntywiliselwa inkqubo yegolide endaweni inkqubo yokutshiza inkonkxa; Uphuhliso lwetekhnoloji luye lwenze ukuba ezinye iifektri zamkele inkonkxa yokuntywiliselwa kunye nenkqubo yesilivere yokuntywiliselwa, idityaniswa nendlela yokungafumani ilothe kwiminyaka yakutshanje, ukusetyenziswa kwenkqubo yokutshiza ngenkcenkce kube ngumda ongakumbi.