Nge-Via (VIA), lo ngumgodi oqhelekileyo osetyenziselwa ukuqhuba okanye ukudibanisa imigca yefoyile yobhedu phakathi kweepatheni zokuqhuba kwiindlela ezahlukeneyo zebhodi yesekethe. Umzekelo (njengemingxuma eyimfama, imingxuma engcwatyiweyo), kodwa ayikwazi ukufaka icandelo elikhokelela okanye imingxuma yobhedu yezinye izinto eziqinisiweyo. Ngenxa yokuba i-PCB yenziwe ngokuqokelelwa kwefoyile ezininzi zobhedu, umaleko ngamnye wefoyile yobhedu uya kugqunywa ngongqimba olukhuselayo, ukuze umaleko wefoyile yobhedu unxibelelane, kwaye ikhonkco lomqondiso lixhomekeke kumngxuma (Via). ), ngoko kukho isihloko sesiTshayina nge.
Uphawu kukuba: ukwenzela ukuhlangabezana neemfuno zabathengi, imingxuma yebhodi yesekethe kufuneka izaliswe ngemingxuma. Ngale ndlela, kwinkqubo yokutshintsha inkqubo yeplagi ye-aluminium yendabuko, i-mesh emhlophe isetyenziselwa ukugqiba imaski ye-solder kunye nemingxuma yeplagi kwibhodi yesiphaluka ukwenza imveliso izinzile. Umgangatho uthembekile kwaye isicelo sigqibelele ngakumbi. I-Vias ikakhulu idlala indima yoqhagamshelo kunye nokuqhutywa kweesekethe. Ngophuhliso olukhawulezayo lweshishini le-elektroniki, iimfuno eziphezulu zikwabekwa kwinkqubo kunye neteknoloji yokunyuka komphezulu yeebhodi zesekethe eziprintiweyo. Inkqubo yokufakwa kweeplagi ngemingxuma isetyenziswe, kwaye ezi mfuno zilandelayo kufuneka zifezekiswe ngexesha elifanayo: 1. Kukho ubhedu kwi-hole, kwaye imaski ye-solder inokutsalwa okanye ayikho. 2. Kufuneka kubekho inkonkxa kunye nelothe kumngxuma odlulayo, kwaye kufuneka kubekho ubukhulu obuthile (4um) ukuba kungabikho inki ye-solder imaski inokungena emngxunyeni, okukhokelela ekubeni kubekho amaso e-tin afihlakeleyo emngxunyeni. 3. Umngxuma ophumela kwiplagi kufuneka ube nomngxuma weplagi yemaski yesolder, opaque, kwaye kufuneka ungabi nezangqa zenkcenkce, amaso enkcenkce kunye neemfuno zokucaba.
Umngxuma oyimfama: Kukudibanisa isiphaluka esingaphandle kwi-PCB kunye nomaleko ongaphakathi omeleneyo ngokufaka imingxuma. Ngenxa yokuba elinye icala alibonakali, libizwa ngokuba yimfama. Kwangaxeshanye, ukuze kwandiswe indawo yokusetyenziswa phakathi kweeleya zesekethe yePCB, kusetyenziswa ii-vias eziyimfama. Oko kukuthi, umngxuma odlulayo kumphezulu omnye webhodi eprintiweyo.
Iimpawu: Imingxuma eyimfama ibekwe kwiindawo eziphezulu kunye nezantsi kwibhodi yesiphaluka ngobunzulu obuthile. Zisetyenziselwa ukudibanisa umgca womphezulu kunye nomgca wangaphakathi ongezantsi. Ubunzulu bomngxuma ngokuqhelekileyo abudluli umlinganiselo othile (i-aperture). Le ndlela yokuvelisa idinga ingqalelo ekhethekileyo kubunzulu bokomba (i-Z axis) ukuba ilungile. Ukuba awuyihoyi ingqalelo, kuya kubangela ubunzima kwi-electroplating emngxunyeni, ngoko ke akukho mzi-mveliso uyamkelayo. Kwakhona kunokwenzeka ukubeka iileyile zeesekethe ezifuna ukudibaniswa kwangaphambili kwiisekethe zomntu ngamnye. Imingxuma igrunjwa kuqala, kwaye emva koko idityaniswe kunye, kodwa izixhobo ezichanekileyo zokubeka kunye nokulungelelanisa ziyafuneka.
I-vias engcwatywayo ngamakhonkco phakathi kwayo nayiphi na imigangatho yesekethe ngaphakathi kwi-PCB kodwa ayidityaniswanga kumaleko angaphandle, kwaye ikwathetha ngemingxuma enganwebekiyo kumphezulu webhodi yesekethe.
Iimpawu: Le nkqubo ayinakufezekiswa ngokubhoboza emva kokudibanisa. Kufuneka igrunjwe ngexesha leeleyile zeesekethe zomntu ngamnye. Okokuqala, umaleko wangaphakathi ubotshwe ngokuyinxenye kwaye emva koko u-electroplated kuqala. Ekugqibeleni, inokudityaniswa ngokupheleleyo, eqhuba ngakumbi kuneyokuqala. Imingxuma kunye nemingxunya eyimfama ithatha ixesha elininzi, ngoko ke ixabiso lelona libiza kakhulu. Le nkqubo idla ngokusetyenziselwa kuphela iibhodi zeesekethe eziphezulu zoxinaniso ukwandisa indawo enokusebenziseka yezinye iileyile zesekethe
Kwinkqubo yokuvelisa iPCB, ukugrumba kubaluleke kakhulu, akukhathali. Ngenxa yokuba ukubhobhoza kukubhobhoza okufunekayo kwimingxuma kwibhodi yeentsimbi zobhedu ukubonelela ukudibanisa kombane kunye nokulungisa umsebenzi wesixhobo. Ukuba umsebenzi awufanelekanga, kuya kubakho iingxaki kwinkqubo yokudlula imingxuma, kwaye isixhobo asikwazi ukulungiswa kwibhodi yesiphaluka, eya kuchaphazela ukusetyenziswa, kwaye ibhodi yonke iya kuchithwa, ngoko inkqubo yokugaya ibaluleke kakhulu.