Intshayelelo yeIbhodi yeSekethe yeCopper eThickIteknoloji

(1) Ukulungiswa kwangaphambili kunye nonyango lwe-electroplating

Injongo ephambili yokutyebisa i-copper plating kukuqinisekisa ukuba kukho umaleko otyebileyo owaneleyo wokwenza ubhedu emngxunyeni ukuqinisekisa ukuba ixabiso lokumelana lingaphakathi koluhlu olufunwa yinkqubo. Njengeplagi-in, kukulungisa indawo kunye nokuqinisekisa amandla okudibanisa; njengesixhobo esixhonywe phezulu, eminye imingxuma isetyenziswa kuphela njengemingxuma, edlala indima yokuqhuba umbane kumacala omabini.

(2) Izinto zokuhlola

1. Ngokukodwa jonga umgangatho we-metallization womngxuma, kwaye uqinisekise ukuba akukho ukugqithisa, i-burr, umgodi omnyama, umngxuma, njl njl.

2. Khangela ukuba kukho ukungcola kunye nezinye izinto ezigqithisileyo kumphezulu we-substrate;

3. Khangela inombolo, inombolo yomzobo, uxwebhu lwenkqubo kunye nenkcazo yenkqubo ye-substrate;

4. Fumana indawo yokuxhoma, iimfuno zokukhwela kunye nommandla wokugquma ukuba itanki yokucoca inokuthwala;

5. Indawo yokubeka kunye neeparitha zenkqubo kufuneka icace ukuqinisekisa ukuzinza kunye nokunokwenzeka kweeparamitha zenkqubo ye-electroplating;

6. Ukucoca kunye nokulungiswa kwamacandelo e-conductive, unyango lokuqala lokufakelwa kombane ukwenza isisombululo sisebenze;

7. Qinisekisa ukuba ukubunjwa kolwelo lokuhlambela lufanelekile kunye nommandla weplate ye-electrode; ukuba i-anode ye-spherical ifakwe kwikholamu, ukusetyenziswa kufuneka kuhlolwe kwakhona;

8. Khangela ukuqina kwamacandelo oqhagamshelwano kunye noluhlu lokuguquguquka kwamandla ombane kunye nombane.

(3) Ulawulo lomgangatho weplating yobhedu ejiyileyo

1. Bala ngokuchanekileyo indawo yokucoca kwaye ubhekisele kwimpembelelo yenkqubo yokuveliswa kwangempela ngoku, ukugqiba ngokuchanekileyo ixabiso elifunekayo langoku, ulawule utshintsho lwangoku kwinkqubo ye-electroplating, kwaye uqinisekise ukuzinza kweeparameters zenkqubo ye-electroplating. ;

2. Ngaphambi kwe-electroplating, sebenzisa kuqala ibhodi yokulungisa ibhodi yokulungisa ukuvavanya, ukwenzela ukuba ibhafu ibe yindawo esebenzayo;

3. Qinisekisa ulwalathiso lokuhamba kwe-current total, kwaye emva koko unqume umyalelo wamacwecwe okuxhoma. Ngokomgaqo, kufuneka isetyenziswe ukusuka kude ukuya kufutshane; ukuqinisekisa ukufana kokusasazwa kwangoku kuwo nawuphi na umgangatho;

4. Ukuqinisekisa ukufana kwengubo emngxunyeni kunye nokuhambelana kobunzima bokugquma, ngaphezu kwemilinganiselo yezobuchwepheshe yokuvuselela kunye nokucoca, kuyafuneka kwakhona ukusebenzisa i-impulse current;

5. Ukubeka iliso rhoqo utshintsho lwangoku ngexesha lenkqubo ye-electroplating ukuqinisekisa ukuthembeka kunye nokuzinza kwexabiso langoku;

6. Khangela ukuba ubukhulu becwecwe lobhedu lomngxuma luyahlangabezana neemfuno zobugcisa.

(4) Inkqubo yokufakwa kweCopper

Kwinkqubo yokutyebisa i-copper plating, iiparameters zenkqubo kufuneka zibekwe esweni rhoqo, kwaye ilahleko engeyomfuneko ihlala ibangelwa ngenxa yezizathu ezizimeleyo kunye neenjongo. Ukwenza umsebenzi olungileyo wokutyebisa inkqubo yobhedu yobhedu, le miba ilandelayo kufuneka yenziwe:

1. Ngokwexabiso lendawo elibalwe yikhompyutheni, lidibene namava aqokelelwe rhoqo kwimveliso yangempela, ukwandisa ixabiso elithile;

2. Ngokwexabiso langoku elibaliweyo, ukwenzela ukuba kuqinisekiswe ingqibelelo yomaleko weplating emngxunyeni, kuyimfuneko ukunyusa ixabiso elithile, oko kukuthi, i-inrush yangoku, kwixabiso langoku langoku, kwaye emva koko ubuyele ixabiso lokuqala ngaphakathi kwexesha elifutshane;

3. Xa i-electroplating yebhodi yesekethe ifikelela kwimizuzu emi-5, khupha i-substrate ukuze ukhangele ukuba uluhlu lwethusi oluphezu komhlaba kunye nodonga lwangaphakathi lomngxuma lugqityiwe, kwaye kungcono ukuba zonke izimbobo zibe ne-metallic luster;

4. Umgama othile kufuneka ugcinwe phakathi kwe-substrate kunye ne-substrate;

5. Xa i-copper plating eqiniweyo ifikelela kwixesha elifunekayo le-electroplating, umlinganiselo othile wangoku kufuneka ugcinwe ngexesha lokususwa kwe-substrate ukuqinisekisa ukuba umphezulu kunye nemingxuma ye-substrate elandelayo ayiyi kuba mnyama okanye ibe mnyama.

Ukulumkela:

1. Tshekisha amaxwebhu enkqubo, ufunde iimfuno zenkqubo kwaye uqhelane neblueprint yomatshini we-substrate;

2. Qwalasela umphezulu we-substrate ukukrazula, i-indentations, iindawo zobhedu eziveziweyo, njl.;

3. Yenza uvavanyo lwe-trial processing ngokwe-mechanical processing floppy disk, yenza uhlolo lokuqala lwangaphambili, kwaye emva koko usebenze zonke ii-workpieces emva kokuhlangabezana neemfuno zeteknoloji;

4. Lungisa izixhobo zokulinganisa kunye nezinye izixhobo ezisetyenziselwa ukubeka esweni imilinganiselo yejometri ye-substrate;

5. Ngokweempawu zezinto eziluhlaza ze-substrate yokucubungula, khetha isixhobo esifanelekileyo sokugaya (i-milling cutter).

(5) Ulawulo lomgangatho

1. Ukuphumeza ngokungqongqo inkqubo yokuhlola inqaku lokuqala ukuqinisekisa ukuba ubungakanani bemveliso buhlangabezana neemfuno zoyilo;

2. Ngokwezinto ezibonakalayo zebhodi yesekethe, khetha ngokufanelekileyo iiparamitha zenkqubo yokugaya;

3. Xa ulungisa indawo yebhodi yesekethe, yibambe ngokucophelela ukuze ugweme umonakalo kwi-solder layer kunye ne-solder mask ebusweni bebhodi yesekethe;

4. Ukuqinisekisa ukungqinelana kwemilinganiselo yangaphandle ye-substrate, ukuchaneka kwendawo kufuneka kulawulwe ngokungqongqo;

5. Xa udibanisa kunye nokudibanisa, ingqalelo ekhethekileyo kufuneka ihlawulwe kwi-padding layer ye-substrate ukuphepha umonakalo kwi-coating layer ebusweni bebhodi yesekethe.