Ezona mveliso zePCB zitsala amehlo ngo-2020 ziya kuba nokukhula okuphezulu kwixesha elizayo

Phakathi kweemveliso ezahlukeneyo zeebhodi zeesekethe zehlabathi ngo-2020, ixabiso lemveliso yee-substrates liqikelelwa ukuba linomlinganiselo wokukhula wonyaka we-18.5%, elona liphezulu kuzo zonke iimveliso. Ixabiso lemveliso ye-substrates lifikelele kwi-16% yazo zonke iimveliso, okwesibini kuphela kwiBhodi ye-multilayer kunye nebhodi ethambileyo. Isizathu sokuba ibhodi yokuthwala ibonise ukukhula okuphezulu kwi-2020 inokushwankathelwa njengezizathu ezininzi eziphambili: 1. Ukuthunyelwa kwe-IC jikelele kuyaqhubeka nokukhula. Ngokwedatha ye-WSTS, izinga lokukhula kwexabiso lemveliso ye-IC yehlabathi ngo-2020 limalunga ne-6%. Nangona izinga lokukhula lingaphantsi kancinane kunezinga lokukhula kwexabiso lemveliso, kuqikelelwa ukuba malunga ne-4%; 2. Ibhodi yokuthwala i-ABF yexabiso eliphezulu ikwimfuno emandla. Ngenxa yokukhula okuphezulu kwemfuno yezikhululo zesiseko ze-5G kunye neekhompyutheni eziphezulu zokusebenza, ii-chips eziphambili kufuneka zisebenzise iibhodi ze-ABF ze-carrier Umphumo wokunyuka kwexabiso kunye nomthamo uye wandisa izinga lokukhula kwemveliso yebhodi ye-carrier; 3. Imfuno entsha yeebhodi zokuthwala ezithathwe kwiifowuni ze-5G. Nangona ukuthunyelwa kweefowuni eziphathwayo ze-5G ngo-2020 kuphantsi kunokuba bekulindelwe malunga nezigidi ezingama-200 kuphela, i-millimeter wave 5G Ukwanda kwenani leemodyuli ze-AiP kwiifowuni eziphathwayo okanye inani leemodyuli ze-PA kwi-RF front-end sisizathu sokuba ukwanda kwemfuno yeebhodi zokuthwala. Lilonke, nokuba luphuhliso lwetekhnoloji okanye imfuno yentengiso, ibhodi yabathwali ka-2020 ngokungathandabuzekiyo yeyona mveliso itsala amehlo phakathi kwazo zonke iimveliso zebhodi yesekethe.

Intsingiselo eqikelelweyo yenani leephakheji ze-IC emhlabeni. Iindidi zepakethe zahlulwe zaba ziindidi zesakhelo ezikhokelela kwisiphelo esiphezulu QFN, MLF, SON…, iintlobo zesakhelo esikhokelayo semveli SO, TSOP, QFP…, kunye nezikhonkwane ezimbalwa ze-DIP, ezi ntlobo zintathu zingentla zonke zifuna isakhelo esikhokelayo sokuthwala i-IC. Ukujonga utshintsho lwexesha elide kwimilinganiselo yeentlobo ezahlukeneyo zeephakheji, izinga lokukhula kwe-wafer-level kunye ne-bare-chip packages liphezulu. Izinga lokukhula lonyaka elihlanganisiweyo ukusuka ku-2019 ukuya ku-2024 liphezulu njenge-10.2%, kwaye ubungakanani benombolo yephakheji iyonke ikwayi-17.8% ngo-2019. , Ukunyuka ukuya kwi-20.5% ngo-2024. , ii-earphone, izixhobo ezinxitywayo...ziya kuqhubeka ziphuhliswa kwixesha elizayo, kwaye olu hlobo lwemveliso alufuni iitshiphusi ezintsonkothileyo ezintsonkothileyo kakhulu, ngoko ke igxininisa ukukhanya nokuqwalaselwa kweendleko Okulandelayo, ithuba lokusebenzisa ukupakishwa kwenqanaba le-wafer liphezulu kakhulu. Ngokubhekiselele kwiindidi zepakethe eziphezulu ezisebenzisa iibhodi zokuthwala, kubandakanywa iiphakheji ze-BGA kunye ne-FCBGA ngokubanzi, izinga lokukhula lonyaka elihlanganisiweyo ukusuka kwi-2019 ukuya kwi-2024 li malunga ne-5%.

 

Ukuhanjiswa kwesabelo semakethi yabavelisi kwimarike yebhodi yabathwali behlabathi kusalawulwa yiTaiwan, iJapan kunye noMzantsi Korea ngokusekwe kwingingqi yomenzi. Phakathi kwabo, i-market share yaseTaiwan isondele kwi-40%, okwenza kube yindawo enkulu yokuvelisa ibhodi yokuthwala ibhodi ngoku, iSouth Korea Isabelo semarike yabavelisi baseJapan kunye nabavelisi baseJapan baphakathi kwezona ziphezulu. Phakathi kwabo, abavelisi baseKorea bakhule ngokukhawuleza. Ngokukodwa, ii-substrates ze-SEMCO zikhule kakhulu ziqhutywa kukukhula kokuthunyelwa kweefowuni ze-Samsung.

Ngokubhekiselele kumathuba oshishino kwixesha elizayo, ukwakhiwa kwe-5G eyaqala kwisiqingatha sesibini se-2018 idale imfuno ye-ABF substrates. Emva kokuba abavelisi bewandisile amandla abo emveliso ngo-2019, imakethi isanqongophele. Abavelisi baseTaiwan batyale imali engaphezulu kwe-NT$10 yeebhiliyoni zokwakha umthamo omtsha wemveliso, kodwa baya kubandakanya iziseko kwixesha elizayo. ITaiwan, izixhobo zonxibelelwano, iikhompyuter ezisebenza kakhulu… zonke ziya kufumana imfuno yeebhodi zokuthwala ze-ABF. Kuqikelelwa ukuba u-2021 useza kuba ngunyaka apho imfuno yeebhodi ze-ABF ezithwala kunzima ukuhlangabezana nazo. Ukongeza, ekubeni i-Qualcomm iqalise imodyuli ye-AiP kwikota yesithathu ye-2018, ii-smart phone ze-5G zamkele i-AiP ukuphucula amandla okufumana umqondiso wefowuni yeselula. Xa kuthelekiswa neefowuni ze-4G ezidlulileyo zisebenzisa iibhodi ezithambileyo njengee-antenna, imodyuli ye-AiP ine-eriyali emfutshane. , itshiphu yeRF...njl. zipakishwe kwimodyuli enye, ngoko ke imfuno yebhodi yomthwali ye-AiP iya kufunyanwa. Ukongeza, izixhobo zonxibelelwano ze-5G zingafuna i-10 kwi-15 AiPs. Uluhlu lwe-antenna nganye ye-AiP yenzelwe i-4×4 okanye i-8×4, efuna inani elikhulu leebhodi zokuthwala. (TPCA)