Kulwakhiwo oluchanekileyo lwezixhobo zombane zanamhlanje, ibhodi yesekethe eprintiweyo yePCB idlala indima ephambili, kunye neGolide Finger, njengenxalenye ephambili yoqhagamshelo oluthembekileyo, umgangatho wayo womphezulu uchaphazela ngokuthe ngqo ukusebenza kunye nobomi benkonzo yebhodi.
Umnwe weGolide ubhekisa kwibha yokudibanisa yegolide kumda wePCB, esetyenziswa ikakhulu ukuseka uqhagamshelo lombane oluzinzileyo kunye namanye amacandelo e-elektroniki (afana nememori kunye nebhodi yomama, ikhadi lemizobo kunye nojongano lomnini, njl. njl.). Ngenxa ye-conductivity yayo egqwesileyo yombane, ukuxhathisa kwe-corrosion kunye nokuchasana koqhagamshelwano oluphantsi, igolide isetyenziswa ngokubanzi kwiindawo zokudibanisa ezifuna ukufakwa rhoqo kunye nokususwa kunye nokugcina ukuzinza kwexesha elide.
Gold plating isiphumo rough
Ukunciphisa ukusebenza kombane: Umphezulu orhabaxa womnwe wegolide uya kwandisa ukuxhathisa koqhagamshelwano, okukhokelela ekwandeni kokuthomalalisa ekuhanjisweni komqondiso, okunokubangela iimpazamo zothumelo lwedatha okanye uqhagamshelwano olungazinzanga.
Ukunciphisa ukuqina: Umgangatho onqabileyo kulula ukuqokelela uthuli kunye nee-oxides, ezikhawuleza ukunxiba kwegolide kunye nokunciphisa ubomi benkonzo yomnwe wegolide.
Iipropati ezonakeleyo zomatshini: Umphezulu ongalinganiyo unokukrwela indawo yokudibanisa yelinye iqela ngexesha lokufakwa nokususwa, okuchaphazela ukuqina koqhagamshelwano phakathi kwamaqela amabini, kwaye kunokubangela ukufakela okanye ukususwa okuqhelekileyo.
Ukwehla kobuhle: nangona le ingeyongxaki ngqo yokusebenza kobugcisa, inkangeleko yemveliso ikwayimbonakaliso ebalulekileyo yomgangatho, kwaye ukucakwa kwegolide okurhabaxa kuya kuchaphazela ukuphononongwa kwabathengi ngokubanzi kwemveliso.
Umgangatho owamkelekileyo womgangatho
Ubungqingqwa bokucwenga kwegolide: Ngokubanzi, ubukhulu begolide bomnwe wegolide kufuneka bube phakathi kwe-0.125μm kunye ne-5.0μm, ixabiso elithile lixhomekeke kwiimfuno zesicelo kunye nokuqwalaselwa kweendleko. Ukubhitya kakhulu kulula ukunxiba, ukutyeba kakhulu kubiza kakhulu.
Uburhabaxa bomphezulu: I-Ra (i-arithmetic ithetha uburhabaxa) isetyenziswa njengesalathiso somlinganiselo, kwaye umgangatho oqhelekileyo wokufumana nguRa≤0.10μm. Lo mgangatho uqinisekisa ukudibana kombane kunye nokuqina.
Ukwaleka okufanayo: Umaleko wegolide kufuneka ugqunywe ngokufanayo ngaphandle kwamabala acacileyo, ukuvezwa kobhedu okanye amaqamza ukuqinisekisa ukusebenza okungaguqukiyo kwendawo nganye yoqhagamshelwano.
Uvavanyo lwe-Weld kunye novavanyo lokumelana nokubola: uvavanyo lokutshiza ityuwa, ubushushu obuphezulu kunye novavanyo lokufuma okuphezulu kunye nezinye iindlela zokuvavanya ukumelana nokubola kunye nokuthembeka kwexesha elide lomnwe wegolide.
Uburhabaxa begolide bebhodi yePCB yomnwe weGolide inxulumene ngokuthe ngqo nokuthembeka koqhagamshelo, ubomi benkonzo kunye nokhuphiswano lwemarike yeemveliso zombane. Ukuthotyelwa kwemigangatho engqongqo yokuvelisa kunye nezikhokelo zokwamkelwa, kunye nokusetyenziswa kweenkqubo zegolide eziphezulu ze-plating zingundoqo ekuqinisekiseni ukusebenza kwemveliso kunye nokwaneliseka komsebenzisi.
Ngokuhambela phambili kwetekhnoloji, ishishini lemveliso yombane lihlala liphonononga iindlela ezizezinye ezisebenza ngokufanelekileyo, ezinobungani nokusingqongileyo kunye nezoqoqosho ezityatyekwe ngegolide ukuhlangabezana neemfuno eziphezulu zezixhobo zombane zexesha elizayo.